Proceedings of the Korean Powder Metallurgy Institute Conference (한국분말야금학회:학술대회논문집)
- 1997.04a
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- Pages.20-20
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- 1997
The Behavior of Isothermal Solidification Process during TLP Bonding with LPS Insert Metals
액상소결삽입재를 사용한 천이액상접합시 등온응고과정에 관하여
Abstract
Keywords