• Journal of Periodontal and Implant Science
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• v.19 no.2
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• pp.143-143
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• 1989

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• 2000.11a
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• pp.17-20
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• 2000

This study is about a retrograde triple well employed in the Cell tr. of next DRAM and flash memory. triple well structure is formed deep n-well under the light p-well using MeV ion implantation. MeV P implanted deep n-well was observed to show greatly improved characteristics of electrical isolation and soft error. Junction leakage current, however, showed a critical behavior as a function of implantation and annealing conditions. {311} defects were observed to be responsible for the leakage current. {311} defects were generated near the R$\sub$p/ (projected range) region and grown upward to the surface during annealing. This is study on the defect behavior in device region as a function of implantation and annealing conditions.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.17-20
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• 2000

This study is about a retrograde triple well employed in the Cell tr. of next DRAM and flash memory. Triple well structure is formed deep n-well under the light p-well using MeV ion implantation. MeV P implanted deep n-well was observed to show greatly improved characteristics of electrical isolation and soft error. Junction leakage current, however, showed a critical behavior as a function of implantation and annealing conditions. {311} defects were observed to be responsible for the leakage current. {311} defects were generated near the R$\_$p/ (Projected range) region and grown upward to the surface during annealing. This is study on the defect behavior in device region as a function of implantation and annealing conditions.

• Korean Journal of Metals and Materials
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• v.46 no.1
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• pp.39-43
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• 2008

PSII (Plasma Source Ion Implantation) using high density pulsed ICP source was employed to implant oxygen ions in Si wafer. The PSII technique can achieve a nominal oxygen dose of $3 {\times}10^{17}atoms/cm^2$ in implantation time of about 20min. In order to prevent oxidation of SOI layer during high temperature annealing, the wafer was capped with $2,000{\AA}$ $Si_3N_4 $ by PECVD. Cross-sectional TEM showed that continuous $500{\AA}$ thick buried oxide layer was formed with $300{\AA}$ thick top silicon layer in the sample. This study showed the possibility of SOI fabrication using the plasma source ion implantation with pulsed ICP source.

• Journal of the Korean Vacuum Society
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• v.7 no.s1
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• pp.30-36
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• 1998

The plasma-spray technique is currently the most frequently used method to produce calcium phosphate coatings. Hydroxyapatite(HAp), one form of calcium phosphate, is preferred by its ability to form a direct bond with living bone, resulting in improvements of implant fixation and faster bone healing. Recently, concerns have been raised regarding the viable use and long-term stability of plasma-spray HAp coatings due to its nature of comparatively thick, porous, and poor bonding strength to metal implants. Thin layers (maximum of few microns) of calcium phosphate were formed by an e-beam evaporation with and without ion bombardments. The Ca/P ration of film was controlled by either using the evaporants having the different ration of Ca/P with addition of CaO, or adjusting the ion beam assist current. The Ca/P ration had great effects on the structure formation after heat treatment and the dissolution bahavior. The calcium phosphate films produced by IBAD exhibited high adhesion strength.

• Journal of Periodontal and Implant Science
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• v.43 no.1
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• pp.18-23
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• 2013

Purpose: The purpose of this study was to evaluate the osseointegration of calcium phosphate (CaP)-coated implants by ion beam assisted deposition with a lack of primary stability. Methods: A total of 20 CaP-coated implants were bilaterally placed in the mandible of five dogs. In the rotational implant group, the implants were inserted in oversized drilled sockets without mechanical engagement, while the conventional surgical protocol was followed in the control group. Each group was allowed to heal for 4 and 8 weeks. The bone-to-implant contact (BIC, %) was measured by a histometric analysis. Results: All of the implants were well-maintained and healing was uneventful. In the histologic observation, all of the implants tested were successfully osseointegrated with a high level of BIC at both observation intervals. There was no significant difference in BIC among any of the groups. Conclusions: Within the limitation of this study, successful osseointegration of CaP-coated implants could be achieved in unfavorable conditions without primary stability.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.67 no.10
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• pp.1375-1381
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• 2018

In this paper, we studied coatings of the DLC thin film for improving loosening torque of dental implant screw. We used a filtered arc ion plating process which can realize the most dense DLC layer by coating the DLC thin film on the surface of the dental abutment screw. It showed both hardness comparable to diamond and low friction coefficient similar to graphite, and to improve the loosening phenomenon by increasing the screw tightening force Cr/CrN, Ti/TiN or Ti/TiN/Cr/CrN buffer layers were deposited for 5 to 10 minutes to improve the adhesion of the DLC thin film to the surface of the Ti (Gr.5), and then the DLC thin film was coated for about 15 minutes. As a result, the Cr/CrN buffer layer exhibited the highest hardness of 29.7 GPa, the adhesion of 18.62N on average, and a very low coefficient of friction of less than 0.2 as a whole. And we measured loosening torque after one million times with masticatory movement simulator. As a result, the values of the coated screw loosening torque were clearly higher than those of the uncoated screw. From this, it was found that the DLC coating was effective methods improving the loosening torque. In addition, it was confirmed that the cytotoxicity test and cell adhesion test showed high biocompatibility.

• Journal of the Korean Society for Heat Treatment
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• v.7 no.4
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• pp.307-317
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• 1994

The surf ace microstructure modification by $N^+$ ion implantation into 7050Al alloy and its low cycle fatigue behavior were investigated. Ion implantation method is to physically implant accelerated ions to the surface of a substrate. High dose of nitrogen($5{\times}10^{17}ions/cm^2$) were implanted into 7050Al alloy using current density of accellerating voltage of 100KeV. The implanted layers were characterized by Electron Probe-Micro Analysis(EPMA), Auger Elecron Spectroscopy(AES), X-Ray Diffraction(XRD), X-Ray Photoelectron Spectroscopy(XPS), and Transmission Electron Microscopy(TEM). The experimental results were compared with computer simulation data. It was shown that AlN was formed to 4500 ${\AA}$ deep. The low cycle fatigue life of the $N^4$ion modified material was prolonged by about three times the unimplanted one. The improved low cycle fatigue life was attributed to the formation of AlN and the damaged region on the surface by $N^+$ ion implantation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.12
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• pp.750-758
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• 2016

For the channel doping of shallow junction and retrograde well formation in CMOS, indium can be implanted in silicon. The retrograde doping profiles can serve the needs of channel engineering in deep MOS devices for punch-through suppression and threshold voltage control. Indium is heavier element than B, $BF_2$ and Ga ions. It also has low coefficient of diffusion at high temperatures. Indium ions can be cause the erode of wafer surface during the implantation process due to sputtering. For the ultra shallow junction, indium ions can be implanted for p-doping in silicon. UT-MARLOWE and SRIM as Monte carlo ion-implant models have been developed for indium implantation into single crystal and amorphous silicon, respectively. An analytical tool was used to carry out for the annealing process from the extracted simulation data. For the 1D (one-dimensional) and 2D (two-dimensional) diffused profiles, the analytical model is also developed a simulation program with $C^{{+}{+}}$ code. It is very useful to simulate the indium profiles in implanted and annealed silicon autonomously. The fundamental ion-solid interactions and sputtering effects of ion implantation are discussed and explained using SRIM and T-dyn programs. The exact control of indium doping profiles can be suggested as a future technology for the extreme shallow junction in the fabrication process of integrated circuits.

• Maxillofacial Plastic and Reconstructive Surgery
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• v.28 no.2
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• pp.127-135
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• 2006

Objectives: The extent of bone formation that occurs at the interface of metallic implants and bone is determined by the number and activity of osteoblastic cells. Stress proteins may be contributing determinants of cell viability in altered environments. Hsp27 is a small Mr hsp which is known as a molecular chaperone. Methods: To better understand how heat shock protein 27 contributes to endosseous implant - associated metal ions affects on osteoblastic cell viability, the effect of chromium and titanium ions were compared to effects of cadmium ions in the ROS17/2.8 osteoblastic cell line. Results: ROS17/2.8 osteoblastic cell line demonstrated ion - specific reductions in growth; reductions were significantly greater for cadmium than for chromium or titanium. Chromium impaired growth of cultures without altering cell viability measured using the MTT assay. A stable transformed cell line expressing additional hsp27(clone "A7") was resistant to the toxic effects of titanium and partially protected from cadmium toxicity. Conclusions: A role for hsp27 in protection of osteoblastic cells from metal ion toxicity is supported by the chromium - induced elevations in hsp27 abundance and the behavior of the A7 cell line in response to metal ions in culture. Similar biochemical responses to altered cellular environments may contribute to the fate of tissues adjacent to select metallic implants.