• Title/Summary/Keyword: Ion beam etching

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Characteristics of Polarization and Birefringence for Submicron a-Ge Thin Film on Quartz Substrate Formed by Focused-Ion-Beam (석영 기판 위에 집속 이온빔 기술에 의해 형성된 비정질 게르마늄 박막 미세 패턴의 편광 및 복굴절 특성)

  • Shin, Kyung;Ki, Jin-Woo;Park, Chung-Il;Lee, Hyun-Yong;Chung, Hong-Bay
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.05a
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    • pp.617-620
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    • 1999
  • In this study, the polarization e(fecal and the birefringence effect of amorphous germanium (a-Ge) thin films were investigated by using linearly polarized He-Ne laser beam. The a-7e thin films were deposited on the quarts substrate by plasma enhanced chemical vapor deposition (PECVD) and thermal vacuum evaporation In order to obtain the optimum grating arrays, inorganci resists such as Si$_3$N$_4$ and a-Se$_{75}$ Ge$_{25}$ , were prepared with the optimized thickness by Monte Carlo (MC) simulation. As the results of MC simulation, the thickness ofa-Se$_{75}$ Ge$_{25}$ resist was determined with Z$_{min}$ of 360$\AA$ . The resists were exposed to Ga$^{+}$-FIB with accelerating energies of 50 keV, developed by wet etching, and a-Ge thin film was etched by reactive ion-etching (RIE). Finally, we were obtained grating arrays which grating width and linewidth are 0.8${\mu}{\textrm}{m}$, respectively and we studied the polarization and birefringence effect in transmission grating array made of high refractive amorphous material, and the applicability as waveplates and polarizers in optical device.e.e.

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Effects of the Brazing Bonding between Al2O3 and STS304 with an Ion Beams (이온빔을 이용한 STS304와 알루미나 브레이징 접합효과)

  • Park, Il-Soo
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.16 no.12
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    • pp.8679-8683
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    • 2015
  • Using a surface modification technique, ion beam assisted deposition (IBAD) of Ti thin film it becomes possible to prepare an active ceramic surface to braze $Al_2O_3$-STS304 with conventional Ag-Cu eutectic composition filler metal. Researches on bonding formations at interfaces of ceramic joints were mainly related on the development of filler metals to ceramic, the process parameters, and clarifications of reaction products. From the results, the reactive brazing is a very convenient technique compared to the conventional Mn-Mo method. However melting point of reactive filler is still higher than that of Ag-Cu eutectic and it forms the brittle inter metallic compound. Recently several new approaches are introduced to overcome the main shortcomings of the reactive metal brazing in ceramic-metal, metal vapor vacuum arc ion source was introduced to implant the reactive element directly into the ceramics surface, and sputter deposition with sputter etching for the deposition of active material.

Advanced surface processing of NLO borate crystals for UV generation

  • Mori, Yusuke;Kamimur, Tomosumi;Yoshimura, Masashi;Sasaki, Takatomo
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.9 no.5
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    • pp.459-462
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    • 1999
  • Recent advances in NLO Borate Crystals for UV Generation are reviewed with the particular emphasis on the technique to improve the life time of UV optics. The laser-damage resistance of CLBO and fused silica surfaces was successfully improved after removing polishing compound by ion beam etching. The polishing compound embedded in the CLBO and fused silica surfaces were to a depth of less than 100nm. We were able to remove polishing compound without degrading the surface condition when the applied ion beam voltage was less than 200 V. The laser-induced surface damage threshold of CLBO was improved up to 15J/$\textrm{cm}^2$(wavelength: 355 nm, pulse width: 0.85 ns)as compared with that of the as-polished surface (11 J/$\textrm{cm}^2$). The laser-induced surface damage of fused silica also increased from 7.5J/$\textrm{cm}^2$ to 15J/$\textrm{cm}^2$. For the irradiation of a 266 nm high-intensity and high-repetition laser light, the surface lifetime of CLBO and fused silica could be more doubled compared with that of the as-polished surface.

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THE FABRICATION OF A PROCESS HEAT EXCHANGER FOR A SO3 DECOMPOSER USING SURFACE-MODIFIED HASTELLOY X MATERIALS

  • Park, Jae-Won;Kim, Hyung-Jin;Kim, Yong-Wan
    • Nuclear Engineering and Technology
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    • v.40 no.3
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    • pp.233-238
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    • 2008
  • This study investigates the surface modification of a Hastelloy X plate and diffusion bonding in the assembly of surface modified plates. These types of plates are involved in the key processes in the fabrication of a process heat exchanger (PHE) for a $SO_3$ decomposer. Strong adhesion of a SiC film deposited onto Hastelloy X can be achieved by a thin SiC film deposition and a subsequent N ion beam bombardment followed by an additional deposition of a thicker film that prevents the Hastelloy X surface from becoming exposed to a corrosive environment through the pores. This process not only produces higher corrosion resistance as proved by electrolytic etching but also exhibits higher endurance against thermal stress above 9$900^{\circ}C$. A process for a good bonding between Hastelloy X sheets, which is essential for a good heat exchanger, was developed by diffusion bonding. The diffusion bonding was done by mechanically clamping the sheets under a heat treatment at $900^{\circ}C$. When the clamping jig consisted of materials with a thermal expansion coefficient that was equal to or less than that of the Hastelloy X, sound bonding was achieved.

The study of beam characteristics for Ga LMIS and In LMIS (갈륨액체금속 이온원과 인듐액체금속 이온원의 빔 특성에 대한 연구)

  • Hyun Jeong Woo;Yim Youn Chan;Jung Kang Won;Jung Won Hee;Park Cheol Woo;Lee Jong Hang;Kang Seung Oun
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2005.05a
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    • pp.360-363
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    • 2005
  • 본 연구에서는 인듐 액체금속이온원을 제작하여 빔 특성에 대해 연구를 하였으며, 기존의 연구를 하였던 갈륨 액체금속 이온원의 빔특성과 비교분석 하였다. 빔특성 분석을 위해 빔 안정도, 전류-전압특성곡선, 에너지 퍼짐을 측정하였다. 액체금속이온원에 사용되는 액체금속 저장소 및 바늘전극(tip)은 $500{\mu}m$의 직경을 갖는 텅스텐을 사용하였으며, 국내에서 제작된 제품을 사용하였다. 액체금속 저장소의 구조는 이전에 구상하여 연구가 이루어진 6개의 pre-etching된 텅스텐와이어(wire)가 묶여진 형태를 사용하였다.

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마이크로·나노 구조 형성을 통한 알루미늄 표면의 발수 특성 개발

  • Byeon, Eun-Yeon;Lee, Seung-Hun;Kim, Jong-Guk;Kim, Yang-Do;Kim, Do-Geun
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2012.05a
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    • pp.223-224
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    • 2012
  • 금속 표면에 마이크로 나노 구조물을 형성하고 그 위에 발수 특성을 가진 물질을 증착하여, 발수성을 가지는 금속 표면을 개발하였다. Sand blast 공정으로 마이크로 구조 형성, Linear Ion Source(LIS)를 적용한 Ion beam etching으로 나노 구조를 형성하였다. 그 결과 FE-SEM을 통해 수~수십 ${\mu}m$ 크기의 구조 위에 nm 크기의 구조가 형성 된 것을 확인하였다. 발수 특성은 매끈한 표면보다 거친(rough)표면과 낮은 표면에너지로 구현된다. 마이크로 나노 구조가 형성된 Al의 표면에너지를 낮추기 위해 Hexamethyldisiloxane(HMDSO)을 코팅하였다. 접촉각 측정 결과 $105^{\circ}$로 표면 형상을 제어함으로써 발수 특성이 나타나는 것을 확인하였다.

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Exchange Bias Modifications in NiFe/FeMn/NiFe Trilayer by a Nonmagnetic Interlayer

  • Yoon, S.M.;Sankaranarayanan V.K.;Kim, C.O.;Kim, C.G.
    • Journal of Magnetics
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    • v.10 no.3
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    • pp.99-102
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    • 2005
  • Modification in exchange bias of a NiFe/FeMn/NiFe trilayer, on introduction of a nonmagnetic Al layer at the top FeMn/NiFe interface, is investigated in multilayers prepared by rf magnetron sputtering. The introduction of Al layer leads to vanishing of bias of the top NiFe layer. But the bias for the bottom NiFe layer increases steadily with increasing Al layer thickness and attains bias (230 Oe) which is greater than that of the trilayer without the Al layer (150 Oe). When the top NiFe layer thickness is varied, exchange bias has highest value at 12 nm thickness for 1 nm thicknes of Al layer. Ion beam etching of the top NiFe layer also leads to an enhancement in bias for the bottom NiFe layer.

Aluminum Oxide Photonic Crystals Fabricated on Compound Semiconductor (화합물 반도체 기판 위에 제작된 산화 알루미늄 광결정 특성)

  • Choi, Jae-Ho;Kim, Keun-Joo;Jung, Mi;Woo, Duk-Ha
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.77-78
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    • 2006
  • We fabricated photonic crystals on GaAs and GaN substrates. After anodizing the aluminium thin film in electrochemical embient, the porous alumina was implemented to the mask for reactive ion beam etching process of GaAs wafer. And photonic crystals in GaN wafer were also fabricated using electron beam nano-lithography process. The coated PMMA thin film with 200 nm-thickness on GaN surface was patterned with triangular lattice and etched out the GaN surface by the inductively coupled plasma source. The fabricated GaAs and GaN photonic crystals provide the enhanced intensities of light emission for the wavelengths of 858 and 450 nm, respectively. We will present the detailed dimensions of photonic crystals from SEM and AFM measurements.

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Simulation of an X-ray Fresnel Zone Plate with Nonideal Factors

  • Chen, Jie;Fan, Quanping;Wang, Junhua;Yuan, Dengpeng;Wei, Lai;Zhang, Qiangqiang;Liao, Junsheng;Xu, Min
    • Current Optics and Photonics
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    • v.4 no.1
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    • pp.9-15
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    • 2020
  • Fresnel zone plates have been widely used in many applications, such as x-ray telescopes, microfluorescence, and microimaging. To obtain an x-ray Fresnel zone plate, many fabrication methods, such as electron-beam etching, ion-beam etching and chemical etching, have been developed. Fresnel zone plates fabricated by these methods will inevitably lead to some nonideal factors, which have an impact on the focusing characteristics of the zone plate. In this paper, the influences of these nonideal factors on the focusing characteristics of the zone plate are studied systematically, by numerical simulations based on scalar diffraction theory. The influence of the thickness of a Fresnel zone plate on the absolute focusing efficiency is calculated for a given incident x-ray's wavelength. The diffraction efficiency and size of the focal spot are calculated for different incline angles of the groove. The simulations of zone plates without struts, with regular struts, and with random struts are carried out, to study the effects of struts on the focusing characteristics of a zone plate. When a Fresnel zone plate is used to focus an ultrashort x-ray pulse, the effect of zone-plate structure on the final pulse duration is also discussed.

Parametric Study of Picosecond Laser Hole Drilling for TSV (피코초 레이저의 공정변수에 따른 TSV 드릴링 특성연구)

  • Shin, Dong-Sig;Suh, Jeong;Kim, Jeng-O
    • Laser Solutions
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    • v.13 no.4
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    • pp.7-13
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    • 2010
  • Today, the most common process for generating Through Silicon Vias (TSVs) for 3D ICs is Deep Reactive Ion Etching (DRIE), which allows for high aspect ratio blind holes with low surface roughness. However, the DRIE process requires a vacuum environment and the use of expensive masks. The advantage of using lasers for TSV drilling is the higher flexibility they allow during manufacturing, because neither vacuum nor lithography or masks arc required and because lasers can be applied even to metal and to dielectric layers other than silicon. However, conventional nanosecond lasers have the disadvantage of causing heat affection around the target area. By contrast, the use of a picosecond laser enables the precise generation of TSVs with less heat affected zone. In this study, we conducted a comparison of thermalization effects around laser-drilled holes when using a picosecond laser set for a high pulse energy range and a low pulse energy range. Notably, the low pulse energy picosecond laser process reduced the experimentally recast layer, surface debris and melts around the hole better than the high pulse energy process.

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