• Title/Summary/Keyword: Intermediate Annealing

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The Effect of Intermediate Annealing on the Evolution of Texture in I.F. Steel (LF 강의 집합조직 발달에 미치는 중간열처리의 영향)

  • 김현철
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 1999.03b
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    • pp.112-115
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    • 1999
  • The effect of intermediate annealing on the texture evolution in I.f steel was investigated by using X-ray texture measurement. After The sample was cold rolled to 80% reduction intermediate annealing was introduced to preform ${\gamma}$-fiber orientation grains in deformed matrix. The annealing time was varied between 30 and 3600 sec, These samples were cold rolled to 90% reduction and full annealed. By intermediate annealing final full annealed samples had very homogeneous ${\gamma}$-fiber orientation resulting in good deep drawability.

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Effects of Pre-Annealing Treatment on the Combustion Synthesis of Ni3Al Intermetallics Coating (Ni-25at.%Al 금속간화합물의 연소합성반응에 미치는 사전 Annealing 처리의 영향)

  • Lee, Han-Young;Mo, Nam-Kyu
    • Tribology and Lubricants
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    • v.37 no.2
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    • pp.62-70
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    • 2021
  • The problem with intermetallics coating using the heat of molten casting is that the heat generated during combustion synthesis dissolves the coating and the substrate metal. This study investigates whether pre-annealing before synthesis can control the reaction heat, with the aim of Ni3Al coating on the casting surface. Therefore, the effects of the annealing temperature and time on the combustion synthesis behavior of the powder compact of Ni-25at%Al after annealing were investigated. As results, the reaction heat when synthesized decreased as the annealing temperature was high and the annealing time was longer. This was attributed to the fact that Al was diffused to Ni particles during low temperature annealing and intermediate Ni-Al compounds were formed during high temperature annealing. After combustion synthesis, however, it was found that their microstructures were almost identical except for the amount of intermediate intermetallics. Furthermore, an annealing temperature above 450℃, at which intermediate compounds begin to form, is needed to prevent the dissolving problem during synthesizing. The intermetallics synthesized after annealing at higher temperature and prolonger annealing time showed a good wear resistance. This might be because much intermediate intermetallics of high hardness were remained in the microstructure.

Effect of Intermediate Annealing on the Texture and Formability in Ferritic Stainless Steel Sheet (페라이트 스테인리스 강판의 집합조직과 성형성에 미치는 중간열처리의 영향)

  • Cho S. Y.;Huh M. Y.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2000.10a
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    • pp.17-20
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    • 2000
  • In order to improve the sheet formability of the ferritic stainless steel, the through-thickness textures of the recrystallized sample was modified by means of a thermomechanical treatment. An annealing process between the cold rolling reductions modified the preferred orientations throughout the thickness, which resulted in the modification of the final cold rolling texture as well as the final recrystallization texture. With the help of the modification of the recrystallization texture by the intermediate annealing, improvement of the sheet formability, i.e. an increase of the Lankford value.

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A modified simulated annealing search algorithm for scheduling of chemical batch processes with CIS policy

  • Kim, Hyung-Joon;Jung, Jae-Hak
    • 제어로봇시스템학회:학술대회논문집
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    • 1995.10a
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    • pp.319-322
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    • 1995
  • As a trend toward multi-product batch processes is increasing in Chemical Process Industry (CPI), multi-product batch scheduling has been actively studied. But the optimal production scheduling problems for multi-product batch processes are known as NP-complete. Recently Ku and Karimi [5] have studied Simulated Annealing(SA) and Jung et al.[6] have developed Modified Simulated Annealing (MSA) method which was composed of two stage search algorithms for scheduling of batch processes with UIS and NIS. Jung et al.[9] also have studied the Common Intermediate Storage(CIS) policy which have accepted as a high efficient intermediate storage policy. It can be also applied to pipeless mobile intermediate storage pacilities. In spite of these above researches, there have been no contribution of scheduling of CIS policy for chemical batch processes. In this paper, we have developed another MSA for scheduling chemical batch processes with searching the suitable control parameters for CIS policy and have tested the this algorithm with randomly generated various scheduling problems. From these tests, MSA is outperformed to general SA for CIS batch process system.

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Preparation of Ferroelectric PZT Thin Film by Sol-Gel Processing; (III) Effect of Rapid Thermal Annealing on Microstructures and Dielectric Properties (솔-젤법에 의한 강유전성 PZT 박막의 제조;(III) 급속열처리방법이 미세구조 및 유전특성에 미치는 영향)

  • 김병호;박성호;김병호
    • Journal of the Korean Ceramic Society
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    • v.32 no.8
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    • pp.881-892
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    • 1995
  • Sol-Gel derived ferroelectric PZT thin films were fabricated on ITO/Glass substrate. Two kinds of rapid thermal annealing methods, R-I (six times of intermediate and final annealing) and R-II (one final annealing after six times of intermediate annealing) were used for preparation of multi-coated PZT thin films. 2500$\AA$-thick PZT thin films were obtained by the R-I and R-II methods and characterized by microstructure and dielectric properties. In case of using R-II, the microstructure was finer than that of R-I and there was no distinguishable difference in dielectric properties of PZT thin films between the R-I and R-II methods. But dielectric properties were enhanced by increasing perovskite phase fraction with increasing annealing temperature. Measured dielectric constant of PZT thin film annealed at 62$0^{\circ}C$ using the R-I method was 256 at 1kHz. Its remanant polarization (Pr) and coercive field (Ec) were 14.4$\mu$C/$\textrm{cm}^2$ and 64kV/cm, respectively.

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Study of the Effects of ZnO Intermediate Layer on Photoluminescence Properties of Magnetron Sputtering Grown GaN Thin Films (ZnO Intermediate Layer가 GaN 박막의 PL 특성에 미치는 영향 연구)

  • 성웅제;이용일;박천일;최우범;성만영
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.574-577
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    • 2001
  • GaN thin films on sapphire were grown by rf magnetron sputtering with ZnO buffer layer. The dependence of GaN film quality on ZnO buffer layer was investigated by X-ray diffraction(XRD). The improved film quality has been obtained by using thin ZnO buffer layer. Using Auger electron spectroscopy(AES), it was observed that the annealing process improved the GaN film quality. The surface roughness according to the annealing temperatures(700, 900, 1100$^{\circ}C$) were investigated by AFM(atomic force microscopy) and it was confirmed that the crystallization was improved by increasing the annealing temperature. Photoluminescence at 8K shows a near-band-edge peak at 3.2eV with no deep level emission.

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Effect of Cold Rolling and Annealing Conditions on the Microstructure and Texture Evolution (430 스테인리스강의 미세조직 및 집합조직 형성에 미치는 냉간압연 및 소둔조건의 영향)

  • 김광육
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2000.04a
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    • pp.202-205
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    • 2000
  • The effect of two step cold rolling and intermediate annealing conditions on the microstructure and texture evolution in type 430 stainless steel has been investigated tin order to improve ridging characteristic and deep drawability. The rolling and recrystallization textures were examined by orientation distributionfunction(ODF) and electron backscattered diffraction(EBSD). The observation showed that the intensity of ${\gamma}$-fiber was increased with two-step cold rolling process and so ridging characteristic and deep drawability were considerably improved. The relation between these properties an texture evolution has been discussed.

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Annealing Characteristic of Phosphorus Implanted Silicon Films using an Ion Mass Doping Method (Ion Mass Doping 법을 이용한 Phosphorus 주입된 실리콘 박막의 Annealing 특성)

  • 강창용;최덕균;주승기
    • Journal of the Korean institute of surface engineering
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    • v.27 no.4
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    • pp.234-240
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    • 1994
  • A large area impurity doping method for poly-Si TFT LCD has been developed. The advantage of this method is the doping of impurities into Si over a large area without mass separation and beam scanning. Phosphorus diluted in hydrogen was discharged by RF(13.56MHz) power and ions from discharged gas were accelerated by DC acceleration voltage and were implanted into deposited Si films. The annealing characteristic of this method was similar to that of the ion implantation method in the low doping concentration. Three mechanisms were evolved in the annealing characteristics of phosphorus doped Si films. Point defects annihilation and the retrogradation of dopant atoms at grain boundaries as a result of grain growth played a major role at low and high annealing temperature, respectively. However, due to the dopant segregation, the reverse annealing range existed at intermediate annealing temperature.

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Dielectric and electric properties of sol-gel derived PZT thin Films (솔-젤법으로 제조한 PZT박막의 유전 및 전기적 특성)

  • Hong, Kwon;Kim, Byong-Ho
    • Electrical & Electronic Materials
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    • v.9 no.3
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    • pp.251-258
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    • 1996
  • Sol-Gel derived ferroelectric Pb(Z $r_{0.52}$ $Ti_{0.48}$) $O_{3}$ thin films have been fabricated on Pt/Ti/ $SiO_{2}$/Si substrate. Two kinds of fast annealing methods, F-I (six times of intermediate and final annealing) and F-II(one final annealing after six times of intermediate annealing) were used for preparation of multi-coated PZT thin films. As the annealing temperature was increased, high capacitance could be obtained, for instance, 2700.angs.-thick PZT thin film annealed at 680.deg. C had a capacitance value of approximately 20nF at 1kHz. In addition, it is found that the dielectric constant is a function of the perovskite phase fraction. In case of F-I method, PZT thin film had a remanent polarization(Pr) of 8-15.mu.C/c $m^{2}$ and a coercive field( $E_{c}$) of 35-44kV/cm according to annealing temperature, whereas PZT film fabricated by F-II method had as high as 24-25.mu.C/c $m^{2}$ and 48-59kV/cm, respectively. As a result of measuring Curie temperature, PZT thin film had a range of 460-480.deg. C by F-I method and more or less higher range of 525-530.deg. C by F-II method, which implied that different microstructures could cause the different Curie temperature. Through I-V measurement, leakage current of PZT thin film fabricated by F-I and F-II methods was 64nA/c $m^{2}$ and 2.2.mu.A/c $m^{2}$ in the electric field of 100kV/cm, respectively.y.y.y.

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