• 한국표면공학회지
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• 제37권1호
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• pp.1-4
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• 2004

MoS$_2$-Ti films were deposited on SKD-11 tool steel substrate by a D.C. magnetron sputtering system. The influence of deposition parameters on the adhesion of the films was investigated by the scratch test. Crosssection morphology was evaluated using FE-SEM. The plasma etching played an important role on the adhesion of the films. The appropriate etching conditions roughened the surface, resulting In the improved adhesion of the film. The adhesion of the film increased with the interlayer thickness up to 110 nm and then decreased slightly with further increasing of interlayer thickness. The adhesion was highest at a bias voltage of -50 V. Further increase of the bias voltage decreased the film adhesion.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1994년도 제6회 학술발표회 논문개요집
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• pp.65-67
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• 1994

• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 추계학술발표대회
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• pp.36.2-36.2
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• 2009

Low dielectric materials have been great attention in the semiconductor industry to develop high performance interlayer dielectrics with low k for Cu interconnect technology. In our study, the dielectric properties of SiOC /SiO2 thin film derived from polyphenylcarbosilane were investigated as a potential interlayer dielectrics for Cu interconnect technology. Polyphenylcarbosilane was synthesized from thermal rearrangement of polymethylphenylsilane around $350^{\circ}C{\sim}430^{\circ}C$. Characterization of synthesized polyphenylcarbosilane was performed with 29Si, 13C, 1H NMR, FT-IR, TG, XRD, GPC and GC analysis. From FT-IR data, the band at 1035 cm-1 is very strong and assigned to CH2 bending vibration in Si-CH2-Si group, indicating the formation of the polyphenylcarbosilane. Number average of molecular weight (Mn) of the polyphenylcarbosilane synthesized at $400^{\circ}C$ for 6hwas 2, 500 and is easily soluble in organic solvent. SiOC/SiO2 thin film was fabricated on ton-type silicon wafer by spin coating using 30wt % polyphenylcarbosilane incyclohexane. Curing of the film was performed in the air up to $400^{\circ}C$ for 2h. The thickness of the film is ranged from $1{\mu}m$ to $1.7{\mu}m$. The dielectric constant was determined from the capacitance data obtained from metal/polyphenylcarbosilane/conductive Si MIM capacitors and show a dielectric constant as low as 2.5 without added porosity. The SiOC /SiO2 thin film derived from polyphenylcarbosilane shows promising application as an interlayer dielectrics for Cu interconnect technology.

• 공업화학
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• 제8권5호
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• pp.742-748
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• 1997

초경공구(WC-Co)의 성능 향상을 목적으로 고경도, 높은 열전도도의 특성 등을 가진 다이아몬드 막을 코팅하고 있으나 WC-Co 기판표면의 특성상 문제점으로 인하여 코팅의 어려움이 있다. 이 문제의 해결을 위하여 WC-Co기판위에 중간층을 도입한 후 다이아몬드 막을 증착시키는 새로운 방법을 고려하였으며 중간층의 제조에 무전해 Ni-P도금법을 사용하였다. 무전해도금을 위한 WC-Co기판의 전처리, 무전해도금 및 열처리, 다이아몬드 막 증착의 공정에 대하여 조사하였다. 형성되는 계면의 구조와 성분, 계면간의 밀착력 등을 Scratch Tester, Roughness Tester, SEM/EDS, XRD, Raman Spectroscopy를 사용하여 분석하였다. 무전해도금의 전처리로서 산에 의한 방법과 다이아몬드 분말에 의한 방법을 사용하였으며 두 경우에 모두 WC-Co기판의 표면조도의 감소, 표면 Co성분의 감소, 그리고 밀착력 저하가 관찰되었다. 무전해도금층의 열처리시 영향을 조사하였으며 온도 증가에 따라 Ni 결정이 형성되며 이로 인하여 도금의 밀착력이 증가되며 Ni 결정이 성장함을 관찰하였다. 또한 열처리된 Ni-P도금 위에서 다이아몬드막 증착 실험을 실시하였으며 증착온도를 증가시킴에 따라 다이아몬드 형성이 증가되어 $800^{\circ}C$일때 양호한 다이아몬드 막을 얻을 수 있었다. 본 연구의 방법 및 실험조건은 WC-Co를 비롯하여 다이아몬드 막 형성이 어려운 소재들의 코팅에 효과적으로 이용될 수 있다.

• Transactions on Electrical and Electronic Materials
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• 제17권2호
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• pp.121-124
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• 2016

ZnSnO₃ (ZTO)/Ag/ ZnSnO₃ (ZTO) trilayer films were prepared on glass substrates by radio frequency (RF) and direct current (DC) magnetron sputtering. The electrical resistivity and optical transmittance of the films were investigated as a function of the Ag interlayer thickness. ZTO films with a 15 nm thick Ag interlayer show the highest average visible transmittance (83.2%) in the visible range. In this study, the highest figure of merit (2.1×10⁻² Ω cm) is obtained with the ZTO 50 nm/Ag 15 nm/ZTO 50 nm films. The enhanced optical and electrical properties of ZTO films with a 15 nm thick Ag interlayer are attributed to the crystallization of the Ag interlayer, as supported by the distinct XRD pattern of the Ag (111) peaks. From the observed results, higher optical and electrical performance of the ZTO film with a 15 nm thick Ag interlayer seems to make a promising alternative to conventional transparent conductive ITO films.

• 반도체디스플레이기술학회지
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• 제18권1호
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• pp.1-4
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• 2019

Reactive sputtering is widely used because of its high deposition rate and high step coverage. The deposition layer is often affected by target poisoning because the target conditions are changed, as well, by reactive gases during the initial stage of sputtering process. The reactive gas affects the deposition rate and process stability (target poisoning), and it also leads unintended oxide interlayer formation. Although the target poisoning mechanism has been well known, little attention has been paid on understanding the interlayer formation during the reactive sputtering. In this research, we studied the interlayer formation during the reactive sputtering. A DC magnetron sputtering process is carried out to deposit an aluminum oxide film on a silicon wafer. From the real-time process monitoring and material analysis, the target poisoning phenomena changes the reactive gas balance at the initial stage, and affects the interlayer formation during the reactive sputtering process.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.171-177
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• 2001

The adhesion enhancement from inserting a RF bias-sputtered Cr layer between Cu and polyimide (PI) has been studied. The RF bias power applied in this study was ranged from 0 to 400 W. Without the RF bias, the peel strength, which measures the adhesion strength, was nearly o g/mm. As the RF power was increased, the peel strength rose up to ~130 g/mm at 200 W, which remained constant with further increase of the RF bias power. Cross-sectional transmission electron microscopy(TEM) was used to investigate the interfacial reaction between the Cr film and PI substrate during the bias sputtering. The Cr/PI interface without the application of RF dais showed a clean, sharp interface while the RF raised Cr/PI interface had about 10~30 nm thick atomistically mixed interlayer between the metal film and PI substrate. This interlayer appeared to have resulted from the implantation of high energy adatoms during the RF bias sputtering of Cr film. This mixed layer serves as an interlocking layer, which enhances adhesion between the metal and PI layers.

• 한국자기학회지
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• 제26권5호
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• pp.149-153
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• 2016

Fe/Gd 다층박막 내 자성층간 결합에 미치는 패턴의 영향을 연구하였다. 이를 위하여 하나의 다층박막 시료를 나누어서 패턴한 것과 패턴하지 않은 것으로 제작하여 비교하였다. X선 자기 원편광 이색성(X-ray magnetic circular dichrosim: XMCD)을 이용하여 Gd 원소에 선택적인 자화 벡터의 온도 변화를 비교한 결과, 패턴 시료의 경우 Gd 자화 벡터의 온도의존성이 패턴 전에 비해 뚜렷하게 변화했음을 관측하였다. 이는 패턴 효과와 반강자성의 층간 결합 효과가 서로 경쟁하여 나타난 결과이다.

• 한국철도학회논문집
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• 제19권1호
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• pp.1-10
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• 2016

본 논문은 고속열차 객실 내 유리창의 차음 성능을 향상시키기 위한 기반연구로, 접합유리에 사용되는 고분자 필름의 물성과 음향학적 특성을 분석하여 그 상관관계를 살펴보고자 하였다. 기존에 사용되고 있는 PVB(polyvinyl butyal) 필름 및 다른 단량체 비율을 가지는 PVB 유도체, 그리고 유리 사이 차음재로 사용가능 한 PC(polycarbonate)의 동적기계적 특성을 분석(DMA)하였다. DMA 분석을 통해 상온에 가까운 온도범위에서 유리전이온도($T_g$)를 가지며 tan ${\delta}$(loss tangent) 값이 큰 것으로 나타난 PVB-HEMU 시편의 댐핑(damping) 성능이 가장 우수할 것으로 예측하고, 이를 고속철도 차량의 접합유리창과 동일한 구조에서의 투과손실 시험과 해석을 통해 검증하고자 하였다. 접합필름의 종류에 따른 유리창 투과손실 값을 투과손실 측정(인텐시티법)과 FE 해석을 이용해 도출하고, 고분자 필름의 물성과 음향성능 간 상관관계 분석을 위한 기초자료를 구축하였다.

• 열처리공학회지
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• 제23권5호
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• pp.245-248
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• 2010

Sn doped $In_2O_3$ (ITO) and ITO/Ni/ITO (INI) multilayer films were deposited on the glass substrates with a reactive magnetron sputtering system without intentional substrate heating and then the influence of the Ni interlayer on the methanol gas sensitivity of ITO and INI film sensors were investigated. Although both ITO and INI film sensors have the same thickness of 100 nm, INI sensors have a sandwich structure of ITO 50 nm/Ni 5 nm/ITO 45 nm. The changes in the gas sensitivity of the film sensors caused by methanol gas ranging from 100 to 1000 ppm were measured. It is observed that the INI film sensors show the higher sensitivity than that of the ITO single layer sensors. Finally, it can be concluded that the INI film sensor have the potential to be used as improved methanol gas sensors.