• 제목/요약/키워드: Interlayer film

검색결과 171건 처리시간 0.026초

ZnO/Cu/ZnO 박막의 차량용 저방사 및 전기광학적 특성 연구 (The emissivity and opto-electrical properties of ZnO/Cu/ZnO thin films for the vehicle applications)

  • 이연학;김선경;엄태용;정용하;소상우;손영길;손동일;김대일
    • 한국표면공학회지
    • /
    • 제56권6호
    • /
    • pp.451-456
    • /
    • 2023
  • Transparent conducting films having a three layered structure of ZnO/Cu/ZnO (ZCZ) were deposited onto the glass substrates by using RF and DC magnetron sputtering at room temperature. The emissivity and opto-electrical properties of the films were investigated with a varying thickness(5, 10, 15 nm) of the Cu interlayer. With increasing the Cu thickness to 15 nm, the films showed a enhanced electrical properties. Although ZnO 30/Cu 15/ZnO 30 nm film shows a lower resistivity of 5.2×10-5 Ωcm, it's visible transmittance is deteriorated by increased optical absorbtion of the films. In addition, X-ray diffraction patterns indicated that the insertion of Cu interlayer improve the grain size of ZnO films, which is favor for the electrical and optical properties of transparent conducting films. From the observed low emissivity of the films, it is concluded that the ZCZ thin films with optimal thickness of Cu interlayer can be applied effectively for the car's window coating materials.

미세 Cu 배선 적용을 위한 SiNx/Co/Cu 박막구조에서 Co층이 계면 신뢰성에 미치는 영향 분석 (Effect of Co Interlayer on the Interfacial Reliability of SiNx/Co/Cu Thin Film Structure for Advanced Cu Interconnects)

  • 이현철;정민수;김가희;손기락;박영배
    • 마이크로전자및패키징학회지
    • /
    • 제27권3호
    • /
    • pp.41-47
    • /
    • 2020
  • 비메모리 반도체 미세 Cu배선의 전기적 신뢰성 향상을 위해 SiNx 피복층(capping layer)과 Cu 배선 사이 50 nm 두께의 Co 박막층 삽입이 계면 신뢰성에 미치는 영향을 double-cantilever beam (DCB) 접착력 측정법으로 평가하였다. DCB 평가 결과 SiNx/Cu 구조는 계면접착에너지가 0.90 J/㎡이었으나 SiNx/Co/Cu 구조에서는 9.59 J/㎡으로 SiNx/Cu 구조보다 약 10배 높게 측정되었다. 대기중에서 200℃, 24시간 동안 후속 열처리 진행한 결과 SiNx/Cu 구조는 0.93 J/㎡으로 계면접착에너지의 변화가 거의 없는 것으로 확인되었으나 SiNx/Co/Cu 구조에서는 2.41 J/㎡으로 열처리 전보다 크게 감소한 것을 확인하였다. X-선 광전자 분광법 분석 결과 SiNx/Cu 도금층 사이에 Co를 증착 시킴으로써 SiNx/Co 계면에 CoSi2 반응층이 형성되어 SiNx/Co/Cu 구조의 계면접착에너지가 매우 높은 것으로 판단된다. 또한 대기중 고온에서 장시간 후속 열처리에 의해 SiNx/Co 계면에 지속적으로 유입된 산소로 인한 Co 산화막 형성이 계면접착에너지 저하의 주요인으로 판단된다.

Ce0.8Sm0.2O2 Sol-gel Modification on La0.8Sr0.2Mn0.8Cu0.2O3 Cathode for Intermediate Temperature Solid Oxide Fuel Cell

  • Lee, Seung Jin;Kang, Choon-Hyoung;Chung, Chang-Bock;Yun, Jeong Woo
    • 마이크로전자및패키징학회지
    • /
    • 제22권4호
    • /
    • pp.77-82
    • /
    • 2015
  • To increase the performance of solid oxide fuel cell operating at intermediate temperature ($600^{\circ}C{\sim}800^{\circ}C$), $Sm_{0.2}Ce_{0.8}O_2$ (SDC) thin layer was applied to the $La_{0.8}Sr_{0.2}Mn_{0.8}Cu_{0.2}O_3$ (LSMCu) cathode by sol-gel coating method. The SDC was employed as a diffusion barrier layer on the yttria-stabilized zirconia(YSZ) to prevent the interlayer by-product formation of $SrZrO_3$ or $La_2Zr_2O_7$. The by-products were hardly formed at the electrolyte-cathode interlayer resulting to reduce the cathode polarization resistance. Moreover, SDC thin film was coated on the cathode pore wall surface to extend the triple phase boundary (TPB) area.

Cu 배선에 Al층간 물질 첨가에 의한 EM특성 개선 (Improvement of electromigration characteristics in using Ai interlayer)

  • 이정환;박병남;최시영
    • 한국진공학회지
    • /
    • 제10권4호
    • /
    • pp.403-410
    • /
    • 2001
  • 본 연구에서는 차세대 Cu 박막 증착 방법으로 유망한 CVD(chemical vapor deposition)방법으로 실질적 배선 증착 공정과 동일하게 시행하여 여러 조건에서 Cu를 증착하여 가장 EM에 관하여 높은 내구성을 가지는 조건을 알아보고 또한 박막의 미세구조가 EM에 어떠한 영향을 미치는지를 알아보았으며 MOCVD 방식으로 증착한 Cu박막의 표면과 barrier layer인 TiN과의 응력(stress)을 조사하여 차세대 EM모델인 grain boundary grooving 모델에 실질적으로 적용하였다. 또한, 이러한 실험을 행 한 후에 정확한 EM 현상을 관찰하고 분석하여 반도체 소자의 신뢰성과 성능개선, 결함 예측, 그리고 소자의 배선설계에 중요한 정보를 제공할 것이다. 또한, 보다 우수한 EM 특성을 가질 수 있게 하기 위해 barrier layer위에 Cu와의 접착력(adhesion)을 향상시킬 수 있는 promoter로 Al을 이용하여 얇게 증착한 후 EM축적 파괴 실험을 하여 EM에 대한 높은 저항성을 실질적으로 가질 수 있는지에 대한 실험도 병행하였다.

  • PDF

Ni 층간박막에 따른 SnO2 박막의 전기적, 광학적 물성 변화 (Influence of Ni Interlayer on the Electrical and Optical Properties of SnO2 thin films)

  • 송영환;엄태영;김대일
    • 열처리공학회지
    • /
    • 제29권5호
    • /
    • pp.216-219
    • /
    • 2016
  • $SnO_2$ single layer films (100 nm thick) and 2 nm thick Ni intermediated $SnO_2$ films were deposited on glass substrate by RF and DC magnetron sputtering without intentional substrate heating and then the influence of the Ni interlayer on the electrical and optical properties of the films were investigated. As deposited $SnO_2$ single layer films show the optical transmittance of 82.6% in the visible wavelength region and a resistivity of $6.6{ \times}10^{-3}{\Omega}cm$, while $SnO_2/Ni/SnO_2$ trilayer films show a lower resistivity of $2.7{ \times}10^{-3}{\Omega}cm$ and an optical transmittance of 76.3% in this study. Based on the figure of merit, it can be concluded that the intermediate Ni thin film effectively enhances the opto-electrical performance of $SnO_2$ films for use as transparent conducting oxides in flexible display applications.

Enhancing Structural Integrity of Composite Sandwich Beams Using Viscoelastic Bonding with Tapered Epoxy Reinforcement

  • Rajesh Lalsing Shirale;Surekha Anil Bhalchandra
    • 한국재료학회지
    • /
    • 제34권3호
    • /
    • pp.125-137
    • /
    • 2024
  • Composite laminates are used in a wide range of applications including defense, automotive, aviation and aerospace, marine, wind energy, and recreational sporting goods. These composite beams still exhibit problems such as buckling, local deformations, and interlaminar delamination. To overcome these drawbacks, a novel viscoelastic autoclave bonding with tapered epoxy reinforcement polyurethane films is proposed. In existing laminates, compression face wrinkling and interlaminar delamination is caused in the sandwich beam. The unique viscoelastic autoclave spunbond interlayer bonding is designed to prevent face wrinkling and absorb and distribute stresses induced by external loads, thereby eliminating interlaminar delamination in the sandwich beam. Also, the existing special reinforcement causes stress concentrations, and the core is not effectively connected, which directly affects the stiffness of the beam. To address this, a novel tapered epoxy polyurethane reinforcement adhesive film is proposed, whose reinforcement thickness gradually tapers as it enters the core material. This minimizes stress concentrations at the interface, preventing excessive adhesive squeeze-out during the bonding process, and improves the stiffness of the beam. Results indicate the proposed model avoids the formation of micro cracks, interlaminar delamination, buckling, and local deformations, and effectively improves the stiffness of the beam.

유리-유리 정전접합을 이용한 FED스페이서 기술 개발 (Development of spacer technology using glass to glass anodic bonding for FED)

  • 김민수;박세광;문권진;김관수;우광제;정성재;이남양
    • 한국진공학회지
    • /
    • 제8권4A호
    • /
    • pp.465-469
    • /
    • 1999
  • In this paper, spacer process for FED (Field Emission Display ) was developed with the glass to glass anodic bonding technology using Al film as an interlayer. Characteristics, current density-time curves and force of the anodic boding were measured on various thickness of Al film; 1000$\AA$, 2000$\AA$, 3000$\AA$, 4000$\AA$ and 500$\AA$. Holders for spacer were fabricated with photosensitive glass and (110) Si wafer by bulk micromachining. Spacers was formed on glass substrate by spacer glass to glass anodic bonding and an evacuated panel was fabricated to prove the potential of application for FED.

  • PDF

졸-겔법에 의한 PLZT 박막의 결정화 및 균열 생성 (Crystallization and Crack Formation in Sol-Gel PLZT Thin Films)

  • 안기철;이전국;김호기;노광수
    • 한국세라믹학회지
    • /
    • 제29권3호
    • /
    • pp.216-222
    • /
    • 1992
  • PLZT thin films were prepared using sol-gel spin coating. The films mainly consisted of perovskite phase when heat treated at 600$^{\circ}C$ and in O2 or air atmosphere for 2 hours after 7 coating cycles. Cracks were formed when smaller than after 9 coating cycles. When ITO interlayer existed between Corning 7059 glass substrate and the film, cracks were not formed after 9 coating cycles, but cracks were formed after 11 coating cycles because of large volume change of the film contracting on the substrate during the heat treatment. In the observation of microstructure, the thin films have perovskite phase of about 2 $\mu\textrm{m}$ grain size and pyrochlore phase of 100∼200${\AA}$ grain size.

  • PDF

Enhanced Performance of Solution-Processed n-channel Organic Thin Film Transistor with Electron-Donating Injection Layer

  • Kim, Sung-Hoon;Lee, Sun-Hee;Han, Seung-Hoon;Choi, Min-Hee;Jeong, Yong-Bin;Jang, Jin
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
    • /
    • pp.64-66
    • /
    • 2009
  • We obtained high performance of n-type organic thin film transistors (OTFTs) using a solution process. N, N' bis-(octyl-)-dicyanoperylene-3,4:9,10-bis(dicarboximide) (PDI-$8CN_2$) in ambient air. Low work function interlayer on source/drain is needed to enhance the electron injection to low LUMO level of n-type organic semiconductor. By using self-assembled monolayer (SAM) the field-effect mobility of 0.33 $cm^2$/Vs was achieved.

  • PDF

$CF_4$ 첨가에 따른 po1yimide 박막의 패터닝 연구 (The Patterning of Polyimide Thin Films for the Additive $CF_4$ gas)

  • 강필승;김창일;김상기
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2001년도 추계학술대회 논문집
    • /
    • pp.209-212
    • /
    • 2001
  • Polyimide(PI) films have been considered as the interlayer dielectric materials due to low dielectric constant, low water absorption, high gap-fill and planarization capability. The PI film was etched with using inductively coupled plasma (ICP). The etching characteristics such as etch rate and selectivity were evaluated to gas mixing ratio. High etch rate was 8300$\AA$/min and vertical profile was approximately acquired 90$^{\circ}$ at CF$_4$/(CF$_4$+O$_2$) of 0.2. The selectivies of polyimide to PR and SiO$_2$ were 1.2, 5.9, respectively. The etching profiles of PI films with an aluminum pattern were measured by a scanning electron microscope (SEM). The chemical states on the PI film surface were investigated by x-ray photoelectron spectroscopy (XPS). Radical densities of oxygen and fluorine in different gas mixing ratio of 07CF4 were investigated by optical emission spectrometer (OES).

  • PDF