• 한국주조공학회지
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• 제28권6호
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• pp.268-272
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• 2008

Interfacial characteristics of aluminum borate whisker reinforced AS52 matrix composite was investigated. Peak hardness of AS52 composite was obtained aging at $170^{\circ}C$ for 15h and the aging process was accelerated by the presence of the aluminium borate whisker. The MgO layer, which was the interfacial reaction product between the reinforcement and the Mg matrix, was produced with 20 nm thickness in as-cast condition. As the aging time increased, the thickness of the interfacial reaction layer increased to 50 nm in peak aged condition. The nano-indentation test results indicated that the strength of interface was improved by the aging but over-aging degraded the reinforcement and decreased the interfacial strength which resulted in the decrease of overall composite strength.

• 대한금속재료학회지
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• 제48권5호
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• pp.469-475
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• 2010

In this study, the interfacial bond strength of a squeeze infiltrated $Al_{18}B_{4}O_{33}$/AS52 Mg composite was investigated by using a finite element method. Three types of Mg composites with volume fractions of 15, 25 and 35% were fabricated. Three-dimensional models of the composite were developed by using a unit cell model in order to determine the effective elastic modulus of the metal matrix composite and the interfacial bond strength between the whisker and magnesium matrix. After modeling, numerical results were compared with the experimental tensile test results of $Al_{18}B_{4}O_{33}$/AS52 Mg composites. The results showed that the effective modulus of the composite strongly depended on the interfacial strength between the matrix and reinforcement. Based on the numerical and experimental findings, it was found that the strong interfacial bond was achieved by the interfacial reaction product of 30 nm thick MgO, which led to an improvement in the mechanical properties of the $Al_{18}B_{4}O_{33}$/AS52 Mg composites.

• Composites Research
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• 제19권4호
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• pp.7-14
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• 2006

미소 드랍릿 시편을 이용한 탄소섬유와 에폭시 수지 사이의 계면전단강도에 대해 시험분석하였다. 또한 드랍릿 모델, 원형 단면 모델, 인발모델의 3종류의 유한요소해석을 통해 섬유/수지간의 응력분포를 계산하였다. 본 연구결과는 다음과 같다. (1) 미소드랍릿 시험의 경우는 인발시험보다 섬유/수지의 계면에서 큰 응력집중이 나타났으며 계면박리가 낮은 하중수준에서도 발생하기 용이함을 알수 있었다. (2) 미소드랍릿시험에서 높은 계면강도를 보였는데, 이는 미소드랍릿의 형상과 사이즈, 바이스팁과 접촉하는 부위의 응력집중효과를 함께 받았기 때문으로 해석되었다.

• 대한기계학회논문집A
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• 제26권6호
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• pp.1187-1193
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• 2002

Anodic bonding process has been quantitatively evaluated based on the Taguchi analysis of the interfacial fracture toughness, measured at the interface of anodically bonded silicon-glass bimorphs. A new test specimen with a pre-inserted blade has been devised for interfacial fracture toughness measurement. A set of 81 different anodic bonding conditions has been generated based on the three different conditions for four different process parameters of bonding load, bonding temperature, anodic voltage and voltage supply time. Taguchi method has been used to reduce the number of experiments required for the bonding strength evaluation, thus obtaining nine independent cases out of the 81 possible combinations. The interfacial fracture toughness has been measured for the nine cases in the range of 0.03∼6.12 J/㎡. Among the four process parameters, the bonding temperature causes the most dominant influence to the bonding strength with the influence factor of 67.7%. The influence factors of other process parameters, such as anodic voltage and voltage supply time, bonding load, are evaluated as 18%, 12% and 2.3%, respectively. The maximum bonding strength of 7.23 J/㎡ has been achieved at the bonding temperature of 460$\^{C}$ with the bonding load of 45gf/㎠, the applied voltage of 600v and the voltage supply time of 25minites.

• Steel and Composite Structures
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• 제20권6호
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• pp.1275-1303
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• 2016

Steel plates and carbon-fiber-reinforced polymer (CFRP) laminates or plates bonded to concrete substrates have been widely used for concrete strengthening. However, this technique cause plate debonding, which makes the strengthening system inefficient. The main objective of this study is to enhance the bond strength of externally bonded steel plates and CFRP laminates to the concrete surface by proposing new embedded adhesive and steel connectors. The effects of these new embedded connectors were investigated through the tests on 36 prism specimens. Parameters such as interfacial shear stress, fracture energy and the maximum strains in plates were also determined in this study and compared with the maximum value of debonding stresses using a relevant failure criterion by means of pullout test. The study indicates that the interfacial bond strength between the externally bonded plates and concrete can be increased remarkably by using these connectors. The investigation verifies that steel connectors increase the shear bond strength by 48% compared to 38% for the adhesive connectors. Thus, steel connectors are more effective than adhesive connectors in increasing shear bond strength. Results also show that the use of double connectors significantly increases interfacial shear stress and decrease debonding failure. Finally, a new proposed formula is modified to predict the maximum bond strength of steel plates and CFRP laminates adhesively glued to concrete in the presence of the embedded connectors.

• 대한치과기공학회지
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• 제23권1호
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• pp.31-43
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• 2001

This study was performed to observe the micro-structure change of surface, behavior of oxide change of element, the component transformation of the alloy and the bonding strength between the porcelain interface in order to investigate effects of indium, tin on interfacial properties of porcelain fused to low gold alloy. Hardness of castings was measured with a micro-Vicker's hardness tester. The compositional change of the surface of heat-treated specimen was analyzed with an EDS and an EPMA. The interfacial shear bonding strength between alloy specimen and fused porcelain was measured with a mechanical testing system(MTS 858.20). The results were as follows: 1) The hardness value of alloy increased as increasing amount of indium addition. 2) The formation of oxidation increased as increasing indium and tin contents after heat treatment. 3) Diffusion of indium and tin elements increased as increasing indium and tin contents in metal-porcelain surface after porcelain fused to metal firing. 4) The most interfacial shear bonding strength was increased as increasing a composition of adding elements, and a heat-treatment time, and an oxygen partial pressure. From the results of this study it was found that the addition of alloying elements such as indium and tin increase hardness of as-cast alloy, produce surface oxide layer of adding elements by heat-treatment which may improve interfacial bonding strength between alloy and porcelain.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2002년도 춘계학술발표대회 논문집
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• pp.199-202
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• 2002

Interfacial properties and electrical sensing for fiber fracture in carbon and SiC fibers/epoxy composites were investigated by the electrical resistance measurement and fragmentation test. As fiber-embedded angle increased, interfacial shear strength (IFSS) of two-type fiber composites decreased, and the elapsed time was long to the infinity in electrical resistivity. The initial slope of electrical resistivity increased rapidly to the infinity at higher angle, whereas electrical resistivity increased gradually at small angle. Furthermore, both fiber composites with small embedded angle showed a fully-developed stress whitening pattern, whereas both composites with higher embedded angle exhibited a less developed stress whitening pattern. As embedded angle decreased, the gap between the fragments increased and the debonded length was wider for both fiber composites. Electro-micromechanical technique can be a feasible nondestructive evaluation to measure interfacial sensing properties depending on the fiber-embedded angle in conductive fiber reinforced composites.

• 한국재료학회지
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• 제12권10호
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• pp.820-824
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• 2002

It is of importance to know that the bonding strength and interfacial stress of SOI wafer pairs to meet with mechanical and thermal stresses during process. We fabricated Si/2000$\AA$-SiO$_2$ ∥ 2000$\AA$-SiO$_2$/Si SOI wafer pairs with electric furnace annealing, rapid thermal annealing (RTA), and fast linear annealing (FLA), respectively, by varying the annealing temperatures at a given annealing process. Bonding strength and interfacial stress were measured by a razor blade crack opening method and a laser curvature characterization method, respectively. All the annealing process induced the tensile thermal stresses. Electrical furnace annealing achieved the maximum bonding strength at $1000^{\circ}C$-2 hr anneal, while it produced constant thermal tensile stress by $1000^{\circ}C$. RTA showed very small bonding strength due to premating failure during annealing. FLA showed enough bonding strength at $500^{\circ}C$, however large thermal tensile stress were induced. We confirmed that premated wafer pairs should have appropriate compressive interfacial stress to compensate the thermal tensile stress during a given annealing process.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1998년도 춘계학술대회 논문집
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• pp.220-226
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• 1998

In this pater, a method of strength evaluation applying fracture mechanics in adhesively bonded joints of A1/A1 materials was investigated. Various adhesively bonded joints of double-cantilever beam with a interfacial crack in its adhesive layer were prepared for the fracture toughness test of comprehensive mixed mode conditions from nearly pure mode I to mode II. The experiment of fracture toughness was carried out under various mixed mode conditions with an interfacial crack and critical energy release rate, Gc by the experimental measurements of compliances was determined. From the results, fracture toughness on mixed mode with an interfacial crack is well characterized by strain energy release rate and a method of strength evaluation by the fracture toughness in adhesively bonded joints of A1/A1 materials was discussed.

• Macromolecular Research
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• 제10권1호
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• pp.24-33
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• 2002

Interfacial and microfailure properties of carbon fiber/epoxy composites were evaluated using both tensile fragmentation and compressive Broutman tests. A monomeric and two polymeric coupling agents were applied via the electrodeposition (ED) and the dipping applications. A monomeric and a polymeric coupling agent showed significant and comparable improvements in interfacial shear strength (IFSS) compared to the untreated case under both tensile and compressive tests. Typical microfailure modes including cone-shaped fiber break, matrix cracking, and partial interlayer failure were observed under tension, whereas the diagonal slipped failure at both ends of the fractured fiber appeared under compression. Adsorption and shear displacement mechanisms at the interface were described in terms of electrical attraction and primary and secondary bonding forces.