• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.55-61
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• 2022

In this study, properties of Pb-free solder joints which were combined using Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder with a mid-temperature type of melting temperature and Sn-57Bi-1Ag Pb-free solder with a low-temperature type of melting temperature were reported. Combined Pb-free solder joints were formed by reflow soldering processes with ball grid array (BGA) packages which have SAC305 solder balls and flame retardant-4 (FR-4) printed circuit boards (PCBs) which printed Sn-57Bi-1Ag solder paste. The reflow soldering processes were performed with two types of temperature profiles and interfacial properties of combined Pb-free solder joints such as interfacial reactions, formations of intermetallic compounds (IMCs), diffusion mechanisms of Bi, and so on were analyzed with the reflow process conditions. In order to compare reliability characteristics of combined Pb-free solder joints, we also conducted thermal shock test and analyzed changes of mechanical properties for joints from a shear test during the thermal shock test.

• Bulletin of the Korean Chemical Society
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• v.33 no.8
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• pp.2546-2552
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• 2012

A novel biguanide-functionalized $Fe_3O_4/SiO_2$ magnetite nanoparticle with a core-shell structure was developed for utilization as a heterogeneous organosuperbase in chemical transformations. The structural, surface, and magnetic characteristics of the nanosized catalyst were investigated by various techniques such as transmission electron microscopy (TEM), powder X-ray diffraction (XRD), vibrating sample magnetometry (VSM), elemental analyzer (EA), thermogravimetric analysis (TGA), $N_2$ adsorption-desorption (BET and BJH) and FT-IR. The biguanide-functionalized $Fe_3O_4/SiO_2$ nanoparticles showed a superpara-magnetic property with a saturation magnetization value of 46.7 emu/g, indicating great potential for application in magnetically separation technologies. In application point of view, the prepared catalyst was found to act as an efficient recoverable nanocatalyst in nitroaldol and domino Knoevenagel condensation/Michael addition/cyclization reactions in aqueous media under mild condition. Additionally, the catalyst was reused six times without significant degradation in catalytic activity and performance.

• Membrane and Water Treatment
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• v.11 no.3
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• pp.179-187
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• 2020

Electrodialysis has been applied for treatment of industrial wastewater including metal electroplating. The wastewater from metal plating industries contains high concentrations of inorganics such as copper, nickel, and sodium. The ions in the feed were separated due to the electrical forces in the electrodialysis. The concentrate compartment is exposed to the elevated concentrations of the ions and yielded inorganic precipitations on the cation exchange membranes. The presence of organic matter in the metal plating wastewater affects complex interfacial reactions, which determines characteristics of inorganic scale fouling. The wastewater from a metal plating industry in practice was collected and the inorganic and organic compositions of the wastewater were analyzed. The performance of electrodialysis of the raw wastewater was evaluated and the effects of adjusting pH of the raw water were also measured. The integrated processes with neutralization and electrodialysis showed great removal of heavy metals sufficient to discharge to aquatic ecosystem. The organic matter in the raw water was also reduced by the neutralization, which might enhance removal performance and alleviate organic fouling in the integrated system.

• Journal of the Korean Vacuum Society
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• v.4 no.1
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• pp.51-59
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• 1995

(001)방향 GaAs 기판과 Si/Co 박막의 계면반응 및 상평형에 관한 연구를 300-$700^{\circ}C$ 열처리 구간에서 행하였다. 반응에 의한 상전이 과정은 glancing angle X-ray diffraction(GXRD), Auger electron spectroscopy(AES) 및 cross-sectional transmission electron microscopy(GXRD), Auger electron spectroscopy(AES) 및 corss-sectional transmission electron microscopy(XTEM)을 이용하여 분석하였다. Si/Co/GaAs계의 계면반응에서 Co는 $380^{\circ}C$에서 GaAs 기판 및 Si와 반응하여 Co2GaAs과 Co2Si상을 형성하였다. $420^{\circ}C$에서 열처리 후, Co층은 모두 소모되었으며 단면구조는 Si/CoSi/CoGa(CoAs)/Co2GaAs/GaAs으로 전이되었다. $460^{\circ}C$까지 온도를 올려 계속적인 반응을 일으키면 CoGa와 CoAs이 분해되면서 CoSi가 성장하였고, $600^{\circ}C$에서는 Co2GaAs마저 분해되고 CoSi상이 성장하여 GaAs와 계면을 형성하였다. CoSi와 GaAs사이의 계면은 $700^{\circ}C$의 고온까지 안정하였으며 이러한 계면반응 결과는 계산에 의하여 구한 Si-Co-Ga-As 4원계 상태도로부터 이해될 수 있었다.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.487-492
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• 2002

The growth kinetics of intermetallic compound layers formed between eutectic Sn-58Bi solder and (Cu, electroless Ni-P/Cu) substrate were investigated at temperature between 70 and 120 C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P system satisfied the parabolic law at given temperature range. As a whole, because the values of time exponent (n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energies of Cu$_{6}$Sn$_{5}$ and Ni$_3$Sn$_4$ intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P were 127.9 and 81.6 kJ/mol, respectively.ely.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.7
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• pp.1223-1231
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• 2002

Al alloy matrix composite with TiNi shape memory fiber as reinforcement has been fabricated by hot pressing to investigate microstructures and mechanical properties. The analysis of SEM and EDS showed that the composites have shown good interface bonding. The stress-strain behavior of the composites was evaluated at temperatures between 363K and room temperature as a function of prestrain, and it showed that the yield stress at 363K was higher than that of the room temperature. Especially, the yield stress of this composite increases with increasing the amount of prestrain, and it also depends on the volume fraction of fiber and heat treatment. The smartness of the composite is given due to the shape memory effect of the TiNi fiber which generates compressive residual stress in the matrix material when heated after being prestrained. Microstructural observation has revealed that interfacial reactions occur between the matrix and fiber, creating two intermetallic layers.

• Journal of the Microelectronics and Packaging Society
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• v.5 no.1
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• pp.7-18
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• 1998

In the flip chip interconnection on organic substrates using eutectic Pb/Sn solder bumps highly reliable Under Bump Metallurgy (UBM) is required to maintain adhesion and solder wettability. Various UBM systems such as 1$\mu$m Al/0.2$\mu$m Pd/1$\mu$m Cu, laid under eutectic Pb/Sn solder were investigated with regard to their interfacial reactions and adhesion proper-ties. The effects of numbers of solder reflow and aging time on the growth of intermetallic compounds (IMCs) and on the solder ball shear strength were investigated. Good ball shear strength was obtained with 1$\mu$m Al/0.2$\mu$m Ti/5$\mu$m Cu and 1$\mu$m Al/0.2$\mu$m ni/1$\mu$m Cu even after 4 solder reflows or 7 day aging at 15$0^{\circ}C$. In contrast 1$\mu$m Al/0.2$\mu$m Ti/1$\mu$m Cu and 1$\mu$mAl/0.2$\mu$m Pd/1$\mu$m 쳐 show poor ball shear strength. The decrease of the shear strength was mainly due to the direct contact between solder and nonwettable metal such as Ti and Al resulting in a delamination. In this case thin 1$\mu$m Cu and 0.2$\mu$m Pd diffusion barrier layer were completely consumed by Cu-Sn and pd-Sn reaction.

• Bulletin of the Korean Chemical Society
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• v.26 no.3
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• pp.361-370
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• 2005

In this review, the field of biosurface organic chemistry is defined and some examples are presented. The aim of biosurface organic chemistry, composed of surface organic chemistry, bioconjugation, and micro- and nanofabrication, is to control the interfaces between biological and non-biological systems at the molecular level. Biosurface organic chemistry has evolved into the stage, where the lateral and vertical control of chemical compositions is achievable with recent developments of nanoscience and nanotechnology. Some new findings in the field are discussed in consideration of their applicability to nanobiotechnology and biomedical sciences.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.33-35
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• 2006

The interactions between Cu/Sn-Ag-(Cu) and Sn-Ag-(Cu)/Ni interfacial reactions were studied during isothermal aging at $150^{\circ}C$ for up to 1000h using Cu(ENIG)/Sn-3.5Ag-(0.7Cu)/Cu(ENIG) sandwich solder joints. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer formed at the upper Sn-Ag/Cu interface after reflowing, whereas a $(Cu,Ni)_6Sn_5$ IMC layer was observed at the Sn-Ag/ENIG interface. The Cu in the $(Cu,Ni)_6Sn_5$ IMC layer formed on the Ni side was sourced from the dissolution of the opposite Cu metal pad or Cu-Sn IMC layer. When the dissolved Cu arrived at the interface of the Ni pad, the $(Cu,Ni)_6Sn_5$ IMC layer formed on the Ni interface, preventing the Ni pad from reacting with the solder. Although a long isothermal aging treatment was performed at $150^{\circ}C$, no Ni was detected in the Cu-Sn IMC layer formed on the Cu side. Compared to the single Sn-Ag/ENIG solder joint, the formation of the $(Cu,Ni)_6Sn_5$ IMC layer of the Cu/sn-Ag/ENIG sandwich joint effectively retarded the Ni consumption from the electroless Ni-P layer.

• Journal of Hydrogen and New Energy
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• v.24 no.2
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• pp.172-178
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• 2013

This study examined the electrochemical deposition and dissolution of lithium on nickel electrodes in 1 mol $dm^{-3}$ (M) $LiPF_6$ dissolved in propylene carbonate (PC) containing different 1,2-dimethoxyethane (DME) concentrations as a co-solvent. The DME concentration was found to have a significant effect on the reactions occurring at the electrode. The poor cycleability of the electrodes in the pure PC solution was improved considerably by adding small amounts of DME. This results suggested that the dendritic lithium growth could be suppressed by using co-solvents. After hundredth cycling in the 1 M $LiPF_6$/PC:DME (67:33) solution, almost no dead lithium has been found from the disassembled cell, resulting from suppression of dendritic lithium growth. Scanning electron microscopy revealed that dendritic lithium formation was greatly affected by the ratio of DME. Raman spectroscopy results suggested that the structure of solvated lithium ions is a crucial important factor in suppressing dendritic lithium formation.