• Journal of the Korean Society for Heat Treatment
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• v.16 no.5
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• pp.260-266
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• 2003

In order to study the interfacial reaction between Nb thin sheet and Fe-C-(Si) alloy with different Chemical compositions, they were cast-bonded. The growth of carbide layer formed at the interface after isothermal heat treatment at 1173K, 1223K, 1273K and 1323K for various times was investigated. The carbide formed at the interface was NbC and the thickness of NbC layer was increased linearly in proportional to the heat treating time. Therefore, It was found that the growth of NbC layer was controlled by the interfacial reaction. The growth rate constant of NbC layer was slightly increased with increase of carbon content when the silicon content is similar in the cast irons. However, as silicon content increases with no great difference in carbon content, the growth of NbC layer was greatly retarded. The calculated activation energy for the growth of NbC layer was varied in the range of 447.4~549.3 kJ/moI with the compositions of cast irons.

• Journal of Adhesion and Interface
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• v.10 no.4
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• pp.162-168
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• 2009

As a preliminary study of optimum composite properties under cryogenic temperature, the comparison of interfacial properties of carbon or glass fibers reinforced epoxy composites was evaluated at ambient and intermediate low temperature, i.e., 25 and $-10^{\circ}C$ by using micromechanical techniques. Under tensile and compressive loading conditions, their mechanical modulus at low temperature was higher than that atambient temperature. Interfacial shear strength (IFSS) at ambient and low temperatures was compared to each other, depending on epoxy matrix toughness and apparent modulus at the interface. The IFSS was much higher at low temperature than that at room temperature because of the increased epoxy matrix modulus. Statistical distributions of tensile strengths of glass and carbon fibers were evaluated for different temperature ranges, which is dependent upon fiber's inherent flaws and rigidity.

• Korean Journal of Materials Research
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• v.18 no.4
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• pp.204-210
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• 2008

$1.5\;{\mu}m$-thick copper films deposited on silicon wafers were successfully bonded at $415^{\circ}C$/25 kN for 40 minutes in a thermo-compression bonding method that did not involve a pre-cleaning or pre-annealing process. The original copper bonding interface disappeared and showed a homogeneous microstructure with few voids at the original bonding interface. Quantitative interfacial adhesion energies were greater than $10.4\;J/m^2$ as measured via a four-point bending test. Post-bonding annealing at a temperature that was less than $300^{\circ}C$ had only a slight effect on the bonding energy, whereas an oxygen environment significantly deteriorated the bonding energy over $400^{\circ}C$. This was most likely due to the fast growth of brittle interfacial oxides. Therefore, the annealing environment and temperature conditions greatly affect the interfacial bonding energy and reliability in Cu-Cu bonded wafer stacks.

• Korean Journal of Materials Research
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• v.12 no.10
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• pp.820-824
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• 2002

It is of importance to know that the bonding strength and interfacial stress of SOI wafer pairs to meet with mechanical and thermal stresses during process. We fabricated Si/2000$\AA$-SiO$_2$ ∥ 2000$\AA$-SiO$_2$/Si SOI wafer pairs with electric furnace annealing, rapid thermal annealing (RTA), and fast linear annealing (FLA), respectively, by varying the annealing temperatures at a given annealing process. Bonding strength and interfacial stress were measured by a razor blade crack opening method and a laser curvature characterization method, respectively. All the annealing process induced the tensile thermal stresses. Electrical furnace annealing achieved the maximum bonding strength at $1000^{\circ}C$-2 hr anneal, while it produced constant thermal tensile stress by $1000^{\circ}C$. RTA showed very small bonding strength due to premating failure during annealing. FLA showed enough bonding strength at $500^{\circ}C$, however large thermal tensile stress were induced. We confirmed that premated wafer pairs should have appropriate compressive interfacial stress to compensate the thermal tensile stress during a given annealing process.

• Korean Journal of Materials Research
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• v.20 no.9
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• pp.478-482
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• 2010

A series of molecular dynamic (MD), finite element (FE) and ab initio simulations are carried out to establish suitable modeling schemes for the continuum-based analysis of aluminum matrix nanocomposites reinforced with carbon nanotubes (CNTs). From a comparison of the MD with FE models and inferences based on bond structures and electron distributions, we propose that the effective thickness of a CNT wall for its continuum representation should be related to the graphitic inter-planar spacing of 3.4${\AA}$. We also show that shell element representation of a CNT structure in the FE models properly simulated the carbon-carbon covalent bonding and long-range interactions in terms of the load-displacement behaviors. Estimation of the effective interfacial elastic properties by ab initio simulations showed that the in-plane interfacial bond strength is negligibly weaker than the normal counterpart due to the nature of the weak secondary bonding at the CNT-Al interface. Therefore, we suggest that a third-phase solid element representation of the CNT-Al interface in nanocomposites is not physically meaningful and that spring or bar element representation of the weak interfacial bonding would be more appropriate as in the cases of polymer matrix counterparts. The possibility of treating the interface as a simply contacted phase boundary is also discussed.

• Advances in materials Research
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• v.6 no.3
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• pp.245-255
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• 2017

High energy ball milling is employed to produce iron matrix- multiwall carbon nanotube (MWCNT) reinforced composite. The damage caused to MWCNT due to harsh ball milling condition and its influence on interfacial bonding is studied. Different amount of MWCNT is used to find the optimal percentage of MWCNT for avoidance of the formation of chemical reaction product at the matrix - reinforcement interface. Effect of process control agent is assessed by the use of different materials for the purpose. It is observed that ethanol as a process control agent (PCA) causes degradation of MWCNT reinforcements after milling for two hours whereas solid stearic acid used as process control agent, allows satisfactory conservation of MWCNT structure. It is further noted that at a high MWCNT content (~ 2wt.%), high energy ball milling leads to reaction of iron and carbon and forms iron carbide (cementite) at the iron-MWCNT interface. At low percentage of MWCNT, dissolution of carbon in iron takes place and the amount of reinforcement in iron matrix composite becomes negligibly small. However, under the present ball milling condition (ball to metal ratio~ 6:1 and 200 rpm vial speed) iron-1wt.% MWCNT composite of good interfacial bonding can retain the tubular structure of reinforcing MWCNT.

• Composites Research
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• v.28 no.1
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• pp.22-27
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• 2015

Although it is important to have high strength of each of fiber and matrix, interface between fiber and matrix is most important. If NaCl water penetrates the interface, that area will be weak. So experiment about increasing interfacial strength is in process. In this study, the change of properties by mechanical, interfacial and micromechanical tests was observed after NaCl and aging treatment. The changes in mechanical properties of glass fiber were investigated using single-fiber tensile test. Interfacial properties between glass fiber and epoxy resin were evaluated using nondestructive acoustic emission (AE) and micromechanical test applied to fatigue test. Through change of fatigue properties, relative interfacial properties were evaluate. In conclusion, glass fiber diameter decreased and the reduction of mechanical and interfacial was observed with NaCl solution and aging treatment.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.837-838
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• 2009

In this work, pyromellitic dianhydride (PMDA) was used as a cathode interfacial layer in the organic light emitting diodes (OLEDs) and its thickness was optimized. Various electrical and optical characterizations of the OLEDs having various thicknesses of the PMDA cathode interfacial layer revealed that the best OLED performance could be achieved by using 0.5 nm-thick PMDA layer compared to the control device without any interfacial layer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.532-535
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• 1999

In power cable joints, the interfaces of two different dielectric materials are inevitable. In addition, the interfacial breakdown between two internal dielectric surfaces represents one of the major causes of failure for power cable joints. We chose epoxy/EPDM interface, one of the interface in cable joints, and investigate dielectric interfacial breakdown phenomenon. First, design specimen with Flux 2D. Second, find interface condition which has high dielectric strength. Third, investigate interfacial breakdown properties with variable temperature.

• Journal of Welding and Joining
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• v.5 no.3
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• pp.28-37
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• 1987

To clarify the debonding phenomena of clad steel, the effect of thermal treatment (temperature, holding time) on the interfacial strength of clad steel was preliminarily investigated. From this study, it was confirmed that the interfacial strength of clad steel was deteriorated by thermal treatment and the amount of strength deteriorated, depending on the condition of thermal treatment, could be evaluated by the following equation. ${\sigma}_{ HT}/{\sigma}_{i}/=A_{0}-A\;exp(-Q/RT)log(t/t_{0})$ This equation implies that temperature has a far strong effect on strength deterioration than tiem. The deterioration of interfacial strength of clad steel after thermal treatment may be derived from the thermal stress caused by the difference in thermal expansion coefficient between component materials and microstructural change along the interface.