• Advanced Composite Materials
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• v.16 no.4
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• pp.269-282
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• 2007

Fully biodegradable high strength composites or 'advanced green composites' were fabricated using yearly renewable soy protein based resins and high strength liquid crystalline cellulose fibers. For comparison, E-glass and aramid ($Kevlar^{(R)}$) fiber reinforced composites were also prepared using the same modified soy protein resins. The modification of soy protein included forming an interpenetrating network-like (IPN-like) resin with mechanical properties comparable to commonly used epoxy resins. The IPN-like soy protein based resin was further reinforced using nano-clay and microfibrillated cellulose. Fiber/resin interfacial shear strength was characterized using microbond method. Tensile and flexural properties of the composites were characterized as per ASTM standards. A comparison of the tensile and flexural properties of the high strength composites made using the three fibers is presented. The results suggest that these green composites have excellent mechanical properties and can be considered for use in primary structural applications. Although significant additional research is needed in this area, it is clear that advanced green composites will some day replace today's advanced composites made using petroleum based fibers and resins. At the end of their life, the fully sustainable 'advanced green composites' can be easily disposed of or composted without harming the environment, in fact, helping it.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.195-202
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• 2003

In this study, failure mechanisms of Au stud bumps/ACF flip chip joints were investigated underhigh current stressing condition. For the determination of allowable currents, I-V tests were performed on flip chip joints, and applied currents were measured as high as almost 4.2Amps $(4.42\times10^4\;Amp/cm^2)$. Degradation of flip chip joints was observed by in-situ monitoring of Au stud bumps-Al pads contact resistance. All failures, defined at infinite resistance, occurred at upward electron flow (from PCB pads to chip pads) applied bumps (UEB). However, failure did not occur at downward electron flow applied bumps (DEB). Only several $m\Omega$ contact resistance increased because of Au-Al intermetallic compound (IMC) growth. This polarity effect of Au stud bumps was different from that of solder bumps, and the mechanism was investigated by the calculation of chemical and electrical atomic flux. According to SEM and EDS results, major IMC phase was $Au_5Al_2$, and crack propagated along the interface between Au stud bump and IMC resulting in electrical failures at UEB. Therefore. failure mechanisms at Au stud bump/ACF flip chip Joint undo high current density condition are: 1) crack propagation, accompanied with Au-Al IMC growth. reduces contact area resulting in contact resistance increase; and 2) the polarity effect, depending on the direction of electrons. induces and accelerates the interfacial failure at UEBs.

• Structural Monitoring and Maintenance
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• v.4 no.4
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• pp.301-329
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• 2017

Impedance-based damage detection method has been known as an innovative tool with various successful implementations for structural health monitoring of civil structures. To monitor the local critical area of a structure, the impedance-based method utilizes the high-frequency impedance responses sensed by piezoelectric sensors as the local dynamic features. In this paper, current advances and future challenges of the impedance-based structural health monitoring are presented. Firstly, theoretical background of the impedance-based method is outlined. Next, an overview is given to recent advances in the wireless impedance sensor nodes, the interfacial impedance sensing devices, and the temperature-effect compensation algorithms. Various research works on these topics are reviewed to share up-to-date information on research activities and implementations of the impedance-based technique. Finally, future research challenges of the technique are discussed including the applicability of wireless sensing technology, the predetermination of effective frequency bands, the sensing region of impedance responses, the robust compensation of noise and temperature effects, the quantification of damage severity, and long-term durability of sensors.

• Journal of the Society of Disaster Information
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• v.9 no.4
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• pp.392-399
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• 2013

The use of advanced composite materials in strengthening and repair of existing structures is increasing rapidly. One specific area in which the technique has been introduced lately is the strengthening of metallic structures with bonded carbon-fibre laminates. In this paper, the behaviors of composite steel-CFRP members is studied experimentally. A new type of test specimen has been developed for this purpose. By examining different combination of CFRP-laminates and adhesives, different types of fracture mode could be examined. The tested composite elements also displayed different behavior and a large difference in strength and ductility could be observed.

• Journal of the Korean Society for Heat Treatment
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• v.9 no.1
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• pp.53-61
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• 1996

Effects of carbon and Ti on damping capacity are investigated in an Fe-17%Mn alloy. The suppressive force of carbon against ${\gamma}{\rightarrow}{\varepsilon}$ transformation increases linearly with an increase in its content, lowering Ms temperature and volume fraction of ${\varepsilon}$ martensite. Carbon deteriorates damping capacity by reducing the interfacial area of damping sources and mobility of the boundaries contributing to anelastic deformation. The reduction in damping capacity is accelerated when carbon-containing alloy is aged at higher temperatures above room temperature. The effect of Ti on damping capacity is found to be benificial in carbon-containing alloy, which is attributed to the depletion of carbon solute due to the formation of TiC.

• Korean Chemical Engineering Research
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• v.52 no.1
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• pp.63-67
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• 2014

The effects of reactant composition on the particle size distribution, synthetic yield, and density of Phenol-formaldehyde bead were examined in the synthesis of resol-type phenolic resin. Decrease of the content of DI water as dispersion media can increase the viscosity of suspension, which may cause the difference of particle size distribution and aggregation. The average particle size of synthesized beads was also decreased with the increasing content of stabilizer which can affect the interfacial area. The amount of crosslinking agent showed no effect on the size distribution and synthetic yield, but it made a decrease in the density of synthesized bead due to the macropore in the bead.

• Korean Journal of Materials Research
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• v.20 no.2
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• pp.104-110
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• 2010

The characteristics of all polymer composites containing carbon materials are determined by four factors: component properties, composition, structure and interfacial interactions. The most important filler characteristics are particle size, size distribution, specific surface area and particle shape. As a consequence, in this paper we discuss the aspects of the mechanical, electrical and thermal properties of composites with different fillers of carbon black, carbon nanotube (CNT), graphene and graphite and focus on the relationship between factors and properties, as mentioned above. Accordingly, we fabricate rubber composites that contain various carbon materials in carbon black-based and silica based-SBR matrixes with dual phase fillers and use scanning electron microscopy, Raman spectroscopy, a rhometer, an Instron tensile machine, and a thermal conductivity analyzer to evaluate composites' mechanical, fatigue, thermal, and electronic properties. In mechanical properties, hardness and 300%-modulus of graphene-composite are sharply increased in all cases due to the larger specific surface. Also, it has been found that the thermal conductivity of the CNT-composite is higher than that of any of the other composites and that the composite with graphene has the best electrical properties.

• Korean Journal of Materials Research
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• v.30 no.3
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• pp.105-110
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• 2020

Cu/PET composite films are widely used in a variety of wearable electronics. Lifetime of the electronics is determined by adhesion between the Cu film and the PET substrate. The formation of an anisotropic nanostructure on the PET surface by surface modification can enhance Cu/PET interfacial adhesion. The shape and size of the anisotropic nanostructures of the PET surface can be controlled by varying the surface modification conditions. In this work, the effect of Cu/PET interface nanostructures on the failure mechanism of a Cu/PET flexible composite film is studied. From observation of the morphologies of the anisotropic nanostructures on plasma-treated PET surfaces, and cross-sections and surfaces of the fractured specimens, the Cu/PET interface area and nanostructure width are analyzed and the failure mechanism of the Cu/PET film is investigated. It is found that the failure mechanism of the Cu/PET flexible composite film depends on the shape and size of the plasmatreated PET surface nanostructures. Cu/PET interface nanostructures with maximal peel strength exhibit multiple craze-crack propagation behavior, while smaller or larger interface nanostructures exhibit single-path craze-crack propagation behavior.

• Korean Membrane Journal
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• v.10 no.1
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• pp.46-52
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• 2008

Optimization of ionomer solution was conducted in order to improve the performance of MEAs in PEMPC. The interface between membrane and electrodes in MEAs is crucial region determining fuel cell performance as well as ORR reaction at cathode. Through the modification of Nafion ionomer content at the interface between membrane and electrodes, an optimal content was obtained with Nafion 115 membranes. Two times higher current density was obtained with the outer Nafion sprayed MEA compared with the non-sprayed one. In addition, the symmetrical impedance spectroscopy mode (SM) exhibited that the resistances of membrane area, proton hydration, and charge transfer decreased as the outer Nafion is sprayed. From the polarization curves and SM, the highest current density and the lowest resistance was obtained at the outer ionomer content of $0.15\;mg\;cm^{-2}$.

• Advanced Composite Materials
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• v.17 no.2
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• pp.167-175
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• 2008

Vapor grown carbon fibers (VGCF) were treated with atmospheric plasma enhancing the surface area in order to improve the bonding to the matrix in epoxy composites. The changes in the mechanical properties of VGCF/epoxy nanocompostes, such as tensile modulus and tensile strength were investigated in this study. VGCF with and without atmospheric plasma treatment for surface modification were used in this investigation. The interdependence of these properties on the VGCF contents and interfacial bonding between VGCF/epoxy matrix were discussed. The mechanical properties of atmospheric plasma treated (APT) VGCF/epoxy were compared with raw VGCF/epoxy. The tensile strength of APT VGCF/epoxy nanocomposites showed higher value than that of raw VGCF. The tensile strength was increased with atmospheric plasma treatment, due to better adhesion at VGCF/epoxy interface. The tensile modulus of raw VGCF and APT VGCF/epoxy matrix were of the similar value. The dispersion of the VGCF was investigated by scanning electron microscopy (SEM), SEM micrographs showed an excellent dispersion of VGCF in epoxy matrix by ultrasonic method.