• Korean Journal of Materials Research
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• v.20 no.9
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• pp.478-482
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• 2010

A series of molecular dynamic (MD), finite element (FE) and ab initio simulations are carried out to establish suitable modeling schemes for the continuum-based analysis of aluminum matrix nanocomposites reinforced with carbon nanotubes (CNTs). From a comparison of the MD with FE models and inferences based on bond structures and electron distributions, we propose that the effective thickness of a CNT wall for its continuum representation should be related to the graphitic inter-planar spacing of 3.4${\AA}$. We also show that shell element representation of a CNT structure in the FE models properly simulated the carbon-carbon covalent bonding and long-range interactions in terms of the load-displacement behaviors. Estimation of the effective interfacial elastic properties by ab initio simulations showed that the in-plane interfacial bond strength is negligibly weaker than the normal counterpart due to the nature of the weak secondary bonding at the CNT-Al interface. Therefore, we suggest that a third-phase solid element representation of the CNT-Al interface in nanocomposites is not physically meaningful and that spring or bar element representation of the weak interfacial bonding would be more appropriate as in the cases of polymer matrix counterparts. The possibility of treating the interface as a simply contacted phase boundary is also discussed.

• Advances in materials Research
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• v.6 no.3
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• pp.245-255
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• 2017

High energy ball milling is employed to produce iron matrix- multiwall carbon nanotube (MWCNT) reinforced composite. The damage caused to MWCNT due to harsh ball milling condition and its influence on interfacial bonding is studied. Different amount of MWCNT is used to find the optimal percentage of MWCNT for avoidance of the formation of chemical reaction product at the matrix - reinforcement interface. Effect of process control agent is assessed by the use of different materials for the purpose. It is observed that ethanol as a process control agent (PCA) causes degradation of MWCNT reinforcements after milling for two hours whereas solid stearic acid used as process control agent, allows satisfactory conservation of MWCNT structure. It is further noted that at a high MWCNT content (~ 2wt.%), high energy ball milling leads to reaction of iron and carbon and forms iron carbide (cementite) at the iron-MWCNT interface. At low percentage of MWCNT, dissolution of carbon in iron takes place and the amount of reinforcement in iron matrix composite becomes negligibly small. However, under the present ball milling condition (ball to metal ratio~ 6:1 and 200 rpm vial speed) iron-1wt.% MWCNT composite of good interfacial bonding can retain the tubular structure of reinforcing MWCNT.

• Journal of Welding and Joining
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• v.30 no.3
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• pp.38-43
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• 2012

In this study, active metal brazing methods for $ZrO_2$ and Ti alloy were discussed. To get a successful metal-ceramic bonding, various factors (melting temperature, corrosion, sag resistance, thermal expansion coefficient etc. of base materilas and filler metal) should be considered. Moreover, in order to clarify bonding between the metal and ceramic, the mechanism of the interfacial structure of the joints should be identified. The driving force for the formation of metal and ceramic interfaces is the reduction of the free energy which occurs when their contact becomes complete. Interfacial bonding depends on the material combinations and the bonding processes. This study describes the bonding between ceramic and metal in an active metal brazing.

• The Journal of the Korea Contents Association
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• v.10 no.10
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• pp.219-225
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• 2010

The bonding strength between titanium and ceramic were analyzed according to the bonding agent and the coating methods of Au and TiN respectively. The bonding strength was measured through the 3 point bending test. Consequently, the bonding strength of the special bonding agent after the TiN coated (SPTB) group was $72.20({\pm}5.25)MPa$ which was the strongest one among groups. The bonding strength of the special bonding agent treated only (SPB) group was $67.66({\pm}12.10)MPa$, the special bonding agent after the Au coating SPGB group was $46.95({\pm}12.48)MPa$ and the SP group was $43.80({\pm}5.12)MPa$. Taking these results into account, the bonding strength of the SPB group shows the same as it of the SPTB group, however, it is stronger than SP group. And the TiN coated SPTB group shows the stronger bonding strength than the Au coated SPGB group.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.04b
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• pp.47-51
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• 2000

A modified direct bonding technique employing a wet chemical deposition of $SiO_2$ film on a wafer surface to be bonded is proposed for the fabrication of Si-$SiO_2$-Si structures. Structural and electrical quality of the bonded wafers is studied. Satisfied insulating properties of interfacial $SiO_2$ layers are demonstrated. Elastic strain caused by surface morphology is investigated. The diminution of strain in the grooved structures is semi-quantitatively interpreted by a model considering the virtual defects distributed over the interfacial region.

• Tribology and Lubricants
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• v.21 no.6
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• pp.302-305
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• 2005

Various carbon nanotubes (CNTs) are added into the epoxy matrix as reinforcements to investigate the effect on the wear behavior. Effects to the tribological properties of different loading concentrations and types of surface modification are investigated by using a linear reciprocal wear tester. As increasing the concentration of CNTs shows the reduction of the wear loss. Moreover, surface modified CNTs give better tribological property than as produced CNTs. It is due that the functional groups on the surface of CNTs increase the interfacial bonding between CNTs and epoxy matrix through chemical bonding. Changes in worn surface morphology are observed by optical microscope and SEM to investigate the wear behavior. CNTs in the epoxy matrix near the surface are exposed and it becomes the lubricating working film on the worn surface. It reduces the friction and results in the lower surface roughness morphology in the epoxy matrix as increasing the contents of the CNTs.

• Restorative Dentistry and Endodontics
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• v.20 no.1
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• pp.183-192
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• 1995

The purpose of this study was to evaluate the effect of smear layer management on the interfacial morphology between dentin bonding system and dentin. Clearfil New Bond, Scotchbond Multipurpose, Prisma Universal Bond 3 and X-R Bond were used on the cervical dentinal surfaces of bovine incisor teeth. All of the dentin bonding systems were labeled with fluorescene in primer and rhodamine B in adhesive. Specimens of 2~3mm thichness were prepared by longitudinal and labiolingual sectioning. The interface between dentin bonding system and dentin was observed by flouresence imaging with a confocal laser scanning microscope. Following results were obtained. 1. In the specimen of Clearfil New Bond, dentinal tubules were widened by destruction of peritubular dentin in the course of treatment with phosphoric acid of high concentration. 2. Hybrid layer was observed in the specimen of Scotchbond Multipurpose and X-R Bond. 3. In the specimen of Prisma Universal Bond 3, the penetraton of adhesive was not observed clearly.

• Journal of the Korean Ceramic Society
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• v.31 no.10
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• pp.1197-1201
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• 1994

The fracture strength and fracture modes were studied in 3Y-TZP/NiNi bonding which change their interfacial structure with bonding condition. Average 4-point bending strength of 200 MPa to 400 MPa were achieved. The formation of Ti-oxide phase at the interface critically influenced the bonding strength and fracture mode. The fracture surface of Ti-oxide free interface contained multiphase in some case including ZrO2. From the result it was confirmed that in order to maximize the bonding strength crack deflection from interface to ceramic was required.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.39-47
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• 2007

It is investigated how KOH and Rthylenediamine(EDA) treatment conditions on Polyimide film surface affect the interfacial fracture energy between electroless plated Ni and Polyimide film by $180^{\circ}$ peel test. Estimated values of interfacial fracture energy were 24.5 g/mm and 33.3 g/mm for the KOH treatment times under 1 and 5 minutes, respectively, while, those were 31.6 g/mm and 22.3 g/mm for EDA treatment times under 1 and 5 minutes, respectively. Interfacial bonding between electroless plated Ni and Polyimide seems to be dominated by chemical bonding effect rather than mechanical interlocking effect. It is found that chemical treatment produces carboxyl and mine functional groups which are closely related the interfacial bonding mechanism. Finally, it is speculated that interfacial fracture energy seems to be controlled by O=C-O bonding near cohesive failure region.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.31-37
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• 2009

Cu-Cu thermo-compression bonding process was successfully developed as functions of the $N_2+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the quantitative interfacial adhesion energy was measured by 4-point bending test. While the pre-annealing with $N_2+H_2$ gas below $200^{\circ}C$ is not effective to improve the interfacial adhesion energy at bonding temperature of $300^{\circ}C$, the interfacial adhesion energy increased over 3 times due to post-annealing over $250^{\circ}C$ after bonding at $300^{\circ}C$, which is ascribed to the effective removal of native surface oxide after post-annealing treatment.