• Journal of the Korean Crystal Growth and Crystal Technology
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• v.19 no.5
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• pp.228-236
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• 2009

In this study, we investigated morphological characteristics of $SF_6$ clathrate hydrate crystals to understand its formation and growth mechanism. $SF_6$ clathrate hydrate crystals were formed in high-pressure reaction cell charged with pure water and $SF_6$ gas at constant pressure and temperature. Two-phase ($SF_6$ gas/aqueous solution) and three-phase ($SF_6$ gas/aqueous solution/$SF_6$ liquid) conditions were investigated, In both conditions, dendritic shape hydrate crystals were grown as like fibriform crystals along upward growth direction at the gas/aqueous solution interface. In the case of the reaction process of three-phase condition, when the $SF_6$ gas bubbles which were generated in $SF_6$ liquid phase due to the reduction of reaction cell pressure stuck to the gas/aqueous interfaces, the hydrate phase were appeared at the surface of the bubbles. This paper presents the detail growth characteristics of $SF_6$ hydrate crystals including crystal nucleation, migration, growth and interference.

• BMB Reports
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• v.31 no.6
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• pp.595-599
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• 1998

To investigate conformational information of a low oxygen affinity recombinant hemoglobin (rHb) containing $96Val{\rightarrow}Trp$ mutation at the ${\alpha}96$ position, we ave produced rHb (${\alpha}96Val{\rightarrow}Phe$) and rHb (${\alpha}96Val{\rightarrow}Tyr$), using the Escherichia coli expression system and site-directed mutagenesis. The oxygen affinity of rHb (${\alpha}96Val{\rightarrow}Phe$) is similar to that of human normal adult hemoglobin (Hb A). However, the oxygen affinity of rHb (${\alpha}96Val{\rightarrow}Tyr$) showed much lower oxygen affinity than Hb A which is similar to that of rHb (${\alpha}96Val{\rightarrow}Tyr$), providing an opportunity as a potential candidate for a hemoglobin-based blood substitute. Both rHb (${\alpha}96Val{\rightarrow}Phe$) and rHb (${\alpha}96Val{\rightarrow}Tyr)$ showed high cooperativity in oxygen binding. IH-NMR spectroscopy shows that both rHb (${\alpha}96Val{\rightarrow}Phe$) and rHb (${\alpha}96Val{\rightarrow}Tyr$) have very similar tertiary structure around the heme pockets and uaternary structure in the ${\alpha}_1/{\beta}_2$ subunit interface ompared to Hb A. The low oxygen affinity of rHb (${\alpha}96Val{\rightarrow}Tyr$) has been suggested to be due to a hydrogen bond caused by an extra hydroxyl group not present in rHb (${\alpha}96Val{\rightarrow}Phe$). However, investigation of the carbonmonoxy form of rHb (${\alpha}96Val{\rightarrow}Phe$) and (${\alpha}96Val{\rightarrow}Try$) in the presence of inositol hexaphosphate at low temperature suggests that low oxygen affinity of (${\alpha}96Val{\rightarrow}Try$) may arise from a mechanism different to that of rHb (${\alpha}96Val{\rightarrow}Trp$).

• Proceedings of the Microbiological Society of Korea Conference
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• 2007.05a
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• pp.120-122
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• 2007

All living organisms use numerous signal-transduction pathways to sense and respond to their environments and thereby survive and proliferate in a range of biological niches. Molecular dissection of these signalling networks has increased our understanding of these communication processes and provides a platform for therapeutic intervention when these pathways malfunction in disease states, including infection. Owing to the expanding availability of sequenced genomes, a wealth of genetic and molecular tools and the conservation of signalling networks, members of the fungal kingdom serve as excellent model systems for more complex, multicellular organisms. Here, we employed Cryptococcus neoformans as a model system to understand how fungal-signalling circuits operate at the molecular level to sense and respond to a plethora of environmental stresses, including osmoticshock, UV, high temperature, oxidative stress and toxic drugs/metabolites. The stress-activated p38/Hog1 MAPK pathway is structurally conserved in many organisms as diverse as yeast and mammals, but its regulation is uniquely specialized in a majority of clinical Cryptococcus neoformans serotype A and D strains to control differentiation and virulence factor regulation. C. neoformans Hog1 MAPK is controlled by Pbs2 MAPK kinase (MAPKK). The Pbs2-Hog1 MAPK cascade is controlled by the fungal "two-component" system that is composed of a response regulator, Ssk1, and multiple sensor kinases, including two-component.like (Tco) 1 and Tco2. Tco1 and Tco2 play shared and distinct roles in stress responses and drug sensitivity through the Hog1 MAPK system. Furthermore, each sensor kinase mediates unique cellular functions for virulence and morphological differentiation. We also identified and characterized the Ssk2 MAPKKK upstream of the MAPKK Pbs2 and the MAPK Hog1 in C. neoformans. The SSK2 gene was identified as a potential component responsible for differential Hog1 regulation between the serotype D sibling f1 strains B3501 and B3502 through comparative analysis of their meiotic map with the meiotic segregation of Hog1-dependent sensitivity to the fungicide fludioxonil. Ssk2 is the only polymorphic component in the Hog1 MAPK module, including two coding sequence changes between the SSK2 alleles in B3501 and B3502 strains. To further support this finding, the SSK2 allele exchange completely swapped Hog1-related phenotypes between B3501 and B3502 strains. In the serotype A strain H99, disruption of the SSK2 gene dramatically enhanced capsule biosynthesis and mating efficiency, similar to pbs2 and hog1 mutations. Furthermore, ssk2, pbs2, and hog1 mutants are all hypersensitive to a variety of stresses and completely resistant to fludioxonil. Taken together, these findings indicate that Ssk2 is the critical interface protein connecting the two-component system and the Pbs2-Hog1 pathway in C. neoformans.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.10a
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• pp.15-15
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• 1999

In chip plating, several parameters must be taken into consideration. Current density, solution concentration, pH, solution temperature, components volume, chip and media ratio, barrel geometrical shape were most likely found to have an effect to the process yields. The 3 types of barrels utilized in chip plating industry are the conventional rotating barrel. vibrational barrel (vibarrel), and the centrifugal type. Conventional rotating barrel is a close type and is commonly used. The components inside the barrel are circulated by the barrel's rotation at a horizontal axis. Process yield has known to have higher thickness deviation. The vibrational barrel is an open type which offers a wide exposure to electrolyte resulting to a stable thickness deviation. It rotates in a vertical axis coupled with multi-vibration action to facilitate mixed up and easy transportation of components, The centrifugal barrel has its plated work centrifugally compacted against the cathode ring for superior electrical contact with simultaneous rotary motion. This experiment has determined the effect of barrel vibration intensity to the plating thickness distribution. The procedures carried out in the experiment involved the overall plating process., cleaning, rinse, Nickel plating, Tin-Lead plating. Plating time was adjusted to meet the required specification. All other parameters were maintained constant. Two trials were performed to confirm the consistency of the result. The thickness data of the experiment conducted showed that the average mean value obtained from higher vibrational intensity is nearer to the standard mean. The distribution curve shown has a narrower specification limits and it has a reduced variation around the target value, Generally, intensity control in vi-barrel facilitates mixed up and easy transportation of components, However, it is desirable to maintain an optimum vibration intensity to prevent solution intrusion into the chips' internal electrode. A cathodic reaction can occur in the interface of the external and internal electrode. $2HD{\;}+{\;}e{\;}{\rightarrow}20H{\;}+{\;}H_2$ Hydrogen can penetrate into the body and create pressure which can cause cracks. At high intensity, the chip's motion becomes stronger, its contact between each other is delayed and so plating action is being controlled. However, the strong impact created by its collision can damage the external electrode's structure thereby resulting to bad plating condition. 1 lot of chip was divided into two equal partion. Each portion was loaded to the same barrel one after the other. Nickel plating and tin-lead plating was performed in the same station. Portion A maintained the normal barrel vibration intensity and portion B vibration intensity was increased two steps higher. All other parameters, current, solution condition were maintained constant. Generally, plating method find procedures were carried out in a best way to maintained the best plating condition. After plating, samples were taken out from each portion. molded and polished. Plating thickness was investigated for both. To check consistency of results. 2nd trial was done now using different lot of another characteristics.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.29-29
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• 2009

On this research, laser welding technology for manufacturing automobile body is studied. Laser welding technology is one of the important technologies used in the manufacturing of lighter, safer automotive bodies at a high level of productivity; the leading automotive manufacturers have replaced spot welding with laser welding in the process of car body assembly. Korean auto manufacturers are developing and applying the laser welding technology using a high output power Nd:YAG laser and a 6-axes industrial robot. On the other hand, the robot-based remote laser welding system was equipped with a long focal laser scanner system in robotic end effect. Laser system, robot system, and scanner system are used for realizing the high speed laser welding system. The remote laser welding system and industrial robotic system are used to consist of robot-based remote laser welding system. The robot-based remote laser welding system is flexible and able to improve laser welding speed compared with traditional welding as spot welding and laser welding. The robot-based remote laser systems used in this study were Trumpf's 4kW Nd:YAG laser (HL4006D) and IPG's 1.6kW Fiber laser (YLR-1600), while the robot systems were of ABB's IRB6400R (payload:120kg) and Hyundai Heavy Industry's HX130-02 (payload:130kg). In addition, a study of quality evaluation and monitoring technology for the remote laser welding was conducted. The welding joints of steel plate and steel plate coated with zinc were butt and lapped joints. The quality testing of the laser welding was conducted by observing the shape of the beads on the plate and the cross-section of the welded parts, analyzing the results of mechanical tension test, and monitoring the plasma intensity and temperature by using UV and IR detectors. Over the past years, Trumf's 4kW Nd:YAG laser and ABB's IRB6400R robot system was used. Nowadays, the new laser source, robot and laser scanner system are used to increase the processing speed and to improve the efficiency of processes. This paper proposes the robot-based remote laser welding system as a means of resolving the limited welding speed and accuracy of conventional laser welding systems.

• Journal of Welding and Joining
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• v.30 no.5
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• pp.64-69
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• 2012

Sn-Bi eutectic alloy has been widely used as one of the key solder materials for step soldering at low temperature. The Sn-58Bi solder paste containing chloride flux was adopted to compare with that using the chloride-free flux. The paste was applied on the electroless nickel-immersion gold (ENIG) surface finish by stencil printing, and the reflow process was then performed at $170^{\circ}C$ for 10 min. After reflow, the solder joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 h in an oven. The interfacial microstructures were obtained by using scanning electron microscopy (SEM), and the composition of intermetallic compounds (IMCs) was analyzed using energy dispersive spectrometer (EDS). Two different IMC layers, consisting of $Ni_3Sn_4$ and relatively very thin Sn-Bi-Ni-Au were formed at the solder/surface finish interface, and their thickness increased with increasing aging time. The wettability of solder joints was investigated by wetting balance test. The mechanical property of each aging solder joint was evaluated by the ball shear test in accordance with JEDEC standard (JESD22-B117A). The results show that the highest shear force was measured when the aging time was 100 h, and the fracture mode changed from ductile fracture to brittle fracture with increasing aging time. On the other hand, the chloride flux in the solder paste did not affect the shear force and fracture mode of the solder joints.

• Journal of the Korean Vacuum Society
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• v.1 no.1
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• pp.67-72
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• 1992

The growth of Ti on Si(111)-$7{\times}7$ and the formation of epitaxial C54 $TiSi_2$ were investigated by using reflection high energy electron diffraction(RHEED) and high resolution transmission electron microscopy(HRTEM). Polycrystalline Ti layer is grown on the amorphous Ti-Si interlayer which is formed at the Ti/Si interface by Ti deposition on Si(111)-$7{\times}7$ at room temperature (RT). HRTEM lattice image and transmission electron diffraction(TED) showed that epitaxial C54 $TiSi_2$ grown on Si substrate with 160 ML of Ti on Si(111)-$7{\times}7$ surface at RT, followed by annealing at $750^{\circ}C$ for 10 min in UHV. Thin single crystal Si overlayer with [111] direction is grown on $TiSi_2$ surface when $TiSi_2$/Si(111) is annealed at ${\sim}900^{\circ}C$ in UHV, which was confirmed by Si(111)-$7{\times}7$ superstructure.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1999.04a
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• pp.5-5
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• 1999

The Principal deficiency of the existing notion about the sintering-mixtures consists in the fact that almost no attention is focused on the Phenomenon of alloy formation during sintering, its connection with dimensional changes of powder bodies, and no correct ideas on the driving force for the sintering process in the stage of establishing chemical equilibrium in a system are available as well. Another disadvantage of the classical sintering theory is an erroneous conception on the dissolution mechanism of solid in liquid. The two-particle model widely used in the literature to describe the sintering phenomenon in solid state disregards the nature of the neighbouring surrounding particles, the presence of pores between them, and the rise of so called arch effect. In this presentation, new basic scientific principles of the driving forces for the sintering process of a two-component powder body, of a diffusion mechanism of the interaction between solid and liquid phases, of stresses and deformation arising in the diffusion zone have been developed. The major driving force for sintering the mixture from components capable of forming solid solutions and intermetallic compounds is attributed to the alloy formation rather than the reduction of the free surface area until the chemical equilibrium is achieved in a system. The lecture considers a multiparticle model of the mixed powder-body and the nature of its volume changes during solid-state and liquid-phase sintering. It explains the discovered S-and V-type concentration dependencies of the change in the compact volume during solid-state sintering. It is supposed in the literature that the dissolution of solid in liquid is realised due to the removal of atoms from the surface of the solid phase into the melt and then their diffusicn transfer from the solid-liquid interface into the bulk of liquid. It has been shown in our experimental studies that the mechanism of the interaction between two components, one of them being liquid, consist in diffusion of the solvent atoms from the liquid into the solid phase until the concentration of solid solutions or an intermetallic compound in the surface layer enables them to pass into the liquid by means of melting. The lecture discusses peculimities of liquid phase formation in systems with intermediate compounds and the role of the liquid phase in bringing about the exothermic effect. At the frist stage of liquid phase sintering the diffusion of atoms from the melt into the solid causes the powder body to grow. At the second stage the diminution of particles in size as a result of their dissolution in the liquid draws their centres closer to each other and makes the compact to shrink Analytical equations were derived to describe quantitatively the porosity and volume changes of compacts as a result of alloy formation during liquid phase sinteIing. Selection criteria for an additive, its concentration and the temperature regime of sintering to control the density the structure of sintered alloys are given.

• Applied Chemistry for Engineering
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• v.5 no.2
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• pp.285-294
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• 1994

Some supported gold catalysts were prepared by impregnation and coprecipitation methods. Effect of gold addition and active sloe formation were studied by investigating particle sizes of gold, amounts of oxygen adsorbed, adsorption properties of CO and NO, and reduction and oxidation properties, etc.. The gold particles of the catalyst by impregnation were irregular and very large as 30~100 nm, but those by coprecipitation were uniform and ultra-fine as about 4 nm. On $Au/Al_2O_3$ catalyst, the addition of gold to inactive $Al_2O_3$ caused the decomposition of $N_2O$, and CO was not irreversibly adsorbed while $O_2$ was atomically and irreversibly adsorbed. The adsorption sites of oxygen were attributed to the active sites which were restricted to the circumference of hemispherical gold particle-support interface rather than all atoms on the surface of gold particle. Also, CO was reversibly and irreversibly adsorbed on $Al_2O_3$ at low temperature, and the addition of gold weakened both reversible and irreversible adsorptions. The affinity for CO on $Au/Co_3O_4$ catalyst decreased conspicuously compared to $Co_3O_4$. The effect of gold addition did not appear in reduction step but did remarkably in reoxidation step; the added gold promoted the reoxidation of the reduced cobalt atoms.

• Journal of the Korean Geotechnical Society
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• v.27 no.12
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• pp.5-15
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• 2011

Conventional designs of landfill covers use geosynthetics such as geomembrane and GCL, and clay liners to lower the permeability of final covers of landfill sites. However, differential settlement and the variation of temperature or humidity in landfill sites cause the development of cracks or structural damage inside the final cover. This study examined the application of a Self Recovering Sustainable Liner (SRSL) as an alternative landfill final cover material. SRSL consists of double layers, which have chemicals, can generate precipitates filling the pores of the layers by chemical reaction. The interface material forms an impermeable layer and in case of internal cracks, the reactants of the two layers migrate towards the crack and heal it by forming another liner. In this study the applicability of SRSL material for landfill final cover was examined by performing flexible wall permeameter tests to prove that the hydraulic conductivity is lower than the regulations and unconfined compression tests to judge whether the strength satisfies the restriction for the landfill final cover. Furthermore, the environmental impacts on the permeability and strength were evaluated. The experimental results show that the SRSL has lower hydraulic conductivity and higher strength than the regulations and is little influenced by climatic changes such as wet/dry or freeze/thaw process.