• Title/Summary/Keyword: Interface structure

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Test for the influence of socket connection structure on the seismic performance of RC prefabricated bridge piers

  • Yan Han;Shicong Ding;Yuxiang Qin;Shilong Zhang
    • Earthquakes and Structures
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    • v.25 no.2
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    • pp.89-97
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    • 2023
  • In order to obtain the impact of socket connection interface forms and socket gap sizes on the seismic performance of reinforced concrete (RC) socket prefabricated bridge piers, quasi-static tests for three socket prefabricated piers with different column-foundation connection interface forms and reserved socket gap sizes, as well as to the corresponding cast-in-situ reinforced concrete piers, were carried out. The influence of socket connection structure on various seismic performance indexes of socket prefabricated piers was studied by comparing and analyzing the hysteresis curve and skeleton curve obtained through the experiment. Results showed that the ultimate failure mode of the socket prefabricated pier with circumferential corrugated treatment at the connection interface was the closest to that of the monolithic pier, the maximum bearing capacity was slightly less than that of the cast-in-situ pier but larger than that of the socket pier with roughened connection interface, and the displacement ductility and accumulated energy consumption capacity were smaller than those of socket piers with roughened connection interface. The connection interface treatment form had less influence on the residual deformation of socket prefabricated bridge piers. With the increase in the reserved socket gap size between the precast pier column and the precast foundation, the bearing capacity of the prefabricated socket bridge pier component, as well as the ductility and residual displacement of the component, would be reduced and had unfavorable effect on the energy dissipation property of the bridge pier component.

Remultiplexing of Ensemble Transport Interface for Terrestrial DMB Service

  • Yun, Joung-Il;Bae, Byung-Jun;Hahm, Young-Kwon;Ahn, Byung-Ha
    • ETRI Journal
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    • v.27 no.1
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    • pp.102-105
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    • 2005
  • In this letter, we present a layered structure of the Korean terrestrial Digital Multimedia Broadcasting (TDMB) transmission system for multimedia broadcasting service and introduce a device called the Ensemble Remultiplexer which is designed to remultiplex the Ensemble Transport Interface (ETI) for T-DMB service. This letter describes the remultiplexing process of the Ensemble Remultiplexer.

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The Variation of Fracture Strength and Modes in $ZrO_2/NiTi$ Bond by Changing Reaction Layer ($ZrO_2/NiTi$ 접합부 반응조직에 따른 꺽임강도 및 파괴거동 변화)

  • 김영정
    • Journal of the Korean Ceramic Society
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    • v.31 no.10
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    • pp.1197-1201
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    • 1994
  • The fracture strength and fracture modes were studied in 3Y-TZP/NiNi bonding which change their interfacial structure with bonding condition. Average 4-point bending strength of 200 MPa to 400 MPa were achieved. The formation of Ti-oxide phase at the interface critically influenced the bonding strength and fracture mode. The fracture surface of Ti-oxide free interface contained multiphase in some case including ZrO2. From the result it was confirmed that in order to maximize the bonding strength crack deflection from interface to ceramic was required.

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A Study on Communication Protocol for Interface between CTC and EIS Equip (열차집중제어장치와 전자연동장치간 정보전송을 위한 통신 프로토콜 구조 연구)

  • Hwang, Jong-Gyu;Lee, Jae-Ho
    • Proceedings of the KIEE Conference
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    • 2002.11d
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    • pp.341-343
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    • 2002
  • According to the computerization of railway signalling equipments, the need of communication protocol for interface between these equipments is increasing. In this paper the research results on communication protocol structure for interface between LDTS(Local Data Transmission System) and EIS(Electronic Interlocking System) is represented.

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Implementation of Gigabit Ethernet Line Interface Controller using Network Processor (네트워크 프로세서를 이용한 기가비트 이더넷 라인 정합 제어기 구현)

  • 김용태;이강복;이형섭
    • Proceedings of the IEEK Conference
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    • 2002.06a
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    • pp.359-362
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    • 2002
  • In this paper, we propose a structure of 800bps high speed router and a gigabit Ethernet line interface board. Having Programmability, network processor is applied to gjgabit Ethernet line interface board. Also, we propose a new method to upgrade image files that consist of operating system and drivers. It is possible to upgrade image files for several boards at once and to reduce the elapsed time for image upgrade using tile proposed method.

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Structural Study of Interface Layers in Tetragonal-NiSi (010)/Si using Density Functional Theory (밀도범함수를 이용한 정방정계-NiSi (010)/Si 계면 층의 구조 연구)

  • Kim, Dae-Hee;Kim, Dae-Hyun;Seo, Hwa-Il;Kim, Yeong-Cheol
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.22 no.5
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    • pp.377-381
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    • 2009
  • Tetragonal-NiSi (010)/Si superstructures were calculated for studying the interface structure using density functional theory, The orthorhombic-NiSi was changed to the tetragonal-NiSi to be matched with the Si surface for epitaxy interface. The eight interface models were produced by the type of the Si surfaces, The tetragonal-NiSi (010)/Si (020)[00-1] superstructure was energetically the most favorable, and the interface thickness of this superstructure was the shortest among the tetragonal-NiSi (010)/Si superstructures. However, in the case of tetragonal-NiSi (010)/Si (010)[00-1] superstructure, it was energetically the most unfavorable, and the interface thickness was the longest. The energies and interface thicknesses of tetragonal-NiSi (010)/Si superstructures were influenced by the coordination number of Ni atoms and the bond length between atoms located at the interface.

Non-uniform virtual material modeling on contact interface of assembly structure with bolted joints

  • Cao, Jianbin;Zhang, Zhousuo;Yang, Wenzhan;Guo, Yanfei
    • Structural Engineering and Mechanics
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    • v.72 no.5
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    • pp.557-568
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    • 2019
  • Accurate modeling of contact interface in bolted joints is crucial in predicting the dynamic behavior for bolted assemblies under external load. This paper presents a contact pressure distribution based non-uniform virtual material method to describe the joint interface of assembly structure, which is connected by sparsely distributed multi-bolts. Firstly, the contact pressure distribution of bolted joints is obtained by the nonlinear static analysis in the finite element software ANSYS. The contact surface around bolt hole is divided into several sub-layers, and contact pressure in each sub-layer is thought to be evenly. Then, considering multi-asperity contact at the micro perspective, the relationship between contact pressure and interfacial virtual material parameters for each sub-layer is established by using the fractal contact theory. Finally, an experimental platform for the dynamic characteristics testing of a beam lap structure with double-bolted joint is constructed to validate the efficiency of proposed method. It is found that the theoretical results are in good agreement with experimental results by impact response in both time- and frequency-domain, and the relative errors of the first four natural frequencies are less than 1%. Furthermore, the presented model is used to examine the effect of rough contact surface on dynamic characteristics of bolted joint.

TEM Study on the HgCdTe/Anodic oxide/ZnS Interfaces (투과전자현미경에 의한 HgCdTe/양극산화막/ZnS 계면 특성에 관한 연구)

  • 정진원;김재묵;왕진석
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.32A no.9
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    • pp.121-127
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    • 1995
  • We have analyzed the double insulating layer consisting of anodic oxide and ZnS through TEM experiments. The use of double insulating layer for HgCdTe surface passivation is one of the promising passivation method which has been recently studied deeply and the double insulating layer is formed by the evaporation of ZnS on the top of anodic oxide layer grown in H$_{2}$O$_{2}$ electrolyte. The structure of anodic oxide layer on HgCdTe is amorphous but the structure of oxide layer after the evaporation of ZnS has been changed to micro-crystalline. The interface layer of 150.angs. thickness has been found between ZnS and anodic oxide layer and is estimated to be ZnO layer. The results of analysis on the chemical components of ZnS, the interface layer and anodic oxide layer have showed that Zn has diffused into the anodic oxide layer deeply while Hg has been significantly decreased from HgCdTe bulk to the top of oxide layer. The formation of ZnO interface layer and the change of structure of anodic oxide layer after the evaporation of ZnS are estimated to be defects or to induce the defects which might possibly affect the increase of the positive fixed charges shown in C-V measurements of HgCdTe MIS.

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