• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2002.11a
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• pp.27-33
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• 2002

The residual thermal stresses at the interface corner between the elastic substrate and the viscoelastic thin film due to cooling from cure temperature down to room temperature have been studied. The polymeric thin film was assumed to be thermorheologically simple. The boundary element method was employed to investigate the nature of stresses on the whole interface. Numerical results show that very large stress gradients are present at the interface comer and such stress singularity might lead to edge cracks or delamination.

• Structural Engineering and Mechanics
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• v.5 no.6
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• pp.705-713
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• 1997

The residual thermal stresses at the interface corner between the elastic fiber and the viscoelastic matrix of a two-dimensional unidirectional laminate due to cooling from cure temperature down to room temperature were studied. The matrix material was assumed to be thermorheologically simple. The time-domain boundary element method was employed to investigate the nature of stresses on the interface. Numerical results show that very large stress gradients are present at the interface corner and this stress singularity might lead to local yielding or fiber-matrix debonding.

• Proceedings of the Korean Nuclear Society Conference
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• 1996.05c
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• pp.305-310
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• 1996

This paper concerns the cladding residual stresses in a reactor vessel induced during cooling from the manufacturing temperature down to room temperature Finite element results show that very large stress gradients are present at the interface corner and such stress singularity might lead to local yielding or cladding-base metal debonding.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2002.10a
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• pp.146-152
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• 2002

In this study, the singular thermal stresses induced during cooling down from high temperature to room temperature have been analyzed for the viscoelastic thin layer. The time domain boundary element method has been employed to investigate the behavor of stresses for the whole interface. Within the context of a linear viscoelastic theory, a stress singularity exists at the point where the interface between the elastic substrate and the viscoelastic thin layer intersects the free surface.

• Journal of the Korean Mathematical Society
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• v.37 no.5
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• pp.779-791
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• 2000

The nonlinear stage of the evolution of free boundary between a light fluid and a heavy fluid driven by an external force is studied by a potential flow model with a source singlarity. The potential flow model is applied to a bubble and spije evolution for constantly accelerated interface (Rayleigh-Taylor instability) and impulsively accelerated interface (Richtmyer-Meshkow instability). The numerical results of the model show that, in constantly accelerated intergace, bubble grows with constant velocity and the spike falls with gravitational acceleration at later times, while the velocity of the bubble in impulsively accelerated interface decay to zero asymp flow model for the bubble and spike for constantly accelerated interface and impulsively accelerated interface.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.299-303
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• 2001

Adherend-adhesive interface failure will occur on a macroscale when surface preparation or material quality are poor. It is well known that the stress singularity occurs at the edges of interface between the adhernds and the adhesive, and that crack will initiate from these positions. Also if bubbles are created and remained in the adhesive layer during the bonding process, the stress concentrates around these hole defects. In this paper, the effects of the hole defects on the SIF of interface crack were examined. From results, SIF increased with the hole defects near the interface crack and increased with an decreae in the upper adherend thickness, an increase in the center adhesive thickness.

• Multiscale and Multiphysics Mechanics
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• v.1 no.1
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• pp.35-51
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• 2016

In this paper, a mixed-mode cohesive law for an interface crack between epoxy and TR (transparent thermoplastic) resin is inversely estimated by the field projection method using numerical solutions and experimentally measured displacements. Displacements in a region far away from the crack tip are measured by digital image correlation technique. An inverse analysis, the field projection method formulated from the interaction J- and M-integrals with numerical auxiliary fields, is carried out to estimate a mixed-mode cohesive law for an interface crack between dissimilar materials. In the present approach, nonlinear deformations and damage near the crack tip are converted into the relationships of tractions and separations on crack surfaces behind the crack tip. The phase angle of mixed-mode singularities of the interface crack is also obtained from measured displacements in this study.

• Journal of applied mathematics & informatics
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• v.38 no.3_4
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• pp.311-334
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• 2020

The solution of the elliptic partial differential equation has interface singularity at the points which are either the intersections of interfaces or the intersections of interfaces with the boundary of the domain. The singularities that arises in the elliptic interface problems are very complex. In this article we propose an exponentially accurate nonconforming spectral element method for these problems based on [7, 18]. A geometric mesh is used in the neighbourhood of the singularities and the auxiliary map of the form z = ln ξ is introduced to remove the singularities. The method is essentially a least-squares method and the solution can be obtained by solving the normal equations using the preconditioned conjugate gradient method (PCGM) without computing the mass and stiffness matrices. Numerical examples are presented to show the exponential accuracy of the method.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.25-30
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• 2001

The stress intensity factors for edge cracks located at the bonding interface between the semiconductor chip and the adhesive layer subjected to a uniform transverse tensile strain are investigated. Such cracks might be generated due to a stress singularity in the vicinity of the free surface. The boundary element method (BEM) is employed to investigate the behavior of interface stresses. The amplitude of complex stress intensity factor depends on the crack length, but it has a constant value at large crack lengths. The rapid propagation of interface crack is expected if the transverse tensile strain reaches a critical value.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.14 no.3
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• pp.309-315
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• 2001

The Stress intensity factors for edge cracks located at the bonding interface between the elastic semiconductor chip and the viscoelastic adhesive layer have been investigated. Such cracks might be generated due to stress singularity in the vicinity of the free surface. The domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The overall stress intensity factor for the case of a small interfacial edge crack has been computed. The magnitude of stress intensity factors decrease with time due to viscoelastic relaxation.