• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.33 no.5
• /
• pp.411-417
• /
• 2020

In this study, we introduce a Na β"-alumina composite thick film as a solid electrolyte, to reduce the resistance of electrolyte for a Na/S battery. An alumina/zirconia composite material was used to enhance the mechanical properties of the electrolyte. A solid electrolyte of about 40 ㎛ thick was successfully fabricated through the conversion and tape-casting methods. In order to investigate the effect of the surface treatment process of the solid electrolyte on the battery performance, the electrolyte was polished by dry and wet processes, respectively, and then the Na/S batteries were prepared for analyzing the battery characteristics. The battery with the dry process performed much better than the battery made with the wet process. As a result, the battery manufactured by the dry process showed excellent performance. Therefore, it is confirmed that the surface treatment process of the solid electrolyte has an important effect on the battery capacity and coulombic efficiency, as well as the interface reaction.

• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.41 no.8
• /
• pp.597-604
• /
• 2013

A coupled thermomechanical analysis of composite structures in pyrolysis and ablation environments is performed. The pyrolysis and ablation models include the effects of mass loss, pore gas diffusion, endothermic reaction energy, surface recession, etc. The thermal and structural analysis interface is based upon a staggered coupling algorithm by using a commercial finite element code. The characteristics of the proposed method are investigated through numerical experiments with carbon/phenolic composites. The numerical studies are carried out to examine the surface recession rate by chemical and mechanical ablation. In addition, the effects of shrinkage or intumescence during the pyrolysis process are shown.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.263-263
• /
• 2013

This work examines the dynamic properties of ice surfaces in vacuum for the temperature range of 140~180 K, which extends over the onset temperatures for ice sublimation and the phase transition from amorphous to crystallization ice. In particular, the study focuses on the transport processes of excess protons and chloride ions in ice and their segregative behavior to the ice surface. These phenomena were studied by conducting experiments with a relatively thick (~100 BL) ice film constructed with a bottom $H_2O$ layer and an upper $D_2O$ layer, with excess hydronium and chloride ions trapped at the $H_2O$/$D_2O$ interface as they were generated by the ionization of hydrogen chloride. The migration of protons, chloride ions, and water molecules to the ice film surface and their H/D exchange reactions were measured as a function of temperature using the methods of low energy sputtering (LES) and Cs+ reactive ion scattering (RIS). Temperature programmed desorption (TPD) experiments monitored the desorption of water and hydrogen chloride from the surface. Our observations indicated that both hydronium and chloride ions migrated from the interfacial layer to segregate to the surface at high temperature. Hydrogen chloride gas desorbs via recombination reaction of hydronium and chloride ions floating on the surface. Surface segregation of these species is driven by thermodynamic potential gradient present near the ice surface, whereas in the bulk, their transport is facilitated by thermal diffusion process. The finding suggests that chlorine activation reactions of hydrogen chloride for polar stratospheric ice particles occur at the surface of ice within a depth of at most a few molecular layers, rather than in the bulk phase.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.130-131
• /
• 2013

Nanostructured oxides are widely used in heterogeneous catalysis where their catalytic properties are closely associated with the size and morphology at nanometer level. The effect of particle size has been well decumented in the past two decades, but the shape of the nanoparticles has rarely been concerned. Here we illustrate that the redox and acidic-basic properties of oxides are largely dependent on their shapes by taking $Co_3O_4$, $Fe_2O_3$, $CeO_2$ and $La_2O_3$ nanorods as typical examples. The catalytic activities of these rod-shaped oxides are mainly governed by the nature of the exposed crystal planes. For instance, the predominant presence of {110} planes which are rich in active $Co^{3+}$ on $Co_3O_4$ nanorods led to a much higher activity for CO oxidation than the nanoparticles that mainly exposed the {111} planes. The simultaneous exposure of iron and oxygen ions on the surface of $Fe_2O_3$ nanorods have significantly enhanced the adsorption and activation of NO and thereby promoted the efficiency of DeNOx process. Moreover, the exposed surface planes of these rod-shaped oxides mediated the reaction performance of the integrated metal-oxide catalysts. Au/$CeO_2$ catalysts exhibited outstanding stability under water-gas shift conditions owing to the strong bonding of gold particle on the $CeO_2$ nanorods where the formed gold-ceria interface was resistant towards sintering. Cu nanoparticles dispersed on $La_2O_3$ nanorods efficiently catalyzed transfer dehydrogenation of primary aliphatic alcohols based on the uniue role of the exposed {110} planes on the support. Morphology control at nanometer level allows preferential exposure of the catalytically active sites, providing a new stragegy for the design of highly efficient nanostructured catalysts.

• Journal of Korea Foundry Society
• /
• v.8 no.3
• /
• pp.287-295
• /
• 1988

The experiment was carried out for the purpose of studying the carburization of pure iron ingot and sintered iron powder by solid carbon in the atmosphere of CO gas. The volocity of carburization was estimaed by the diffusion coefficient D calculated by carburization equation. The results obtained were as follow: 1. The higher the carburization temperature, carburization depth and carbon concentration were increased, and the melting zone which had $2.8{\sim}3.4%C$ at the $3{\sim}4mm$ from interface of carburization was formed at $1300^{\circ}C$. 2. The main carburization mechanism of pure iron ingot and the sintered iron powder were proceeded by CO gas up to $1100^{\circ}C$, solid carbon over than $1300^{\circ}C$, respectively. 3. The main carburization mechanism of pure iron ingot at $1200^{\circ}C$ was proceeded by solid carbon, and sintered iron powder was proceeded bs CO gas, however, in case the reaction time, the carburization was proceeded by solid carbon over than 5hrs. 4. The diffusion coefficient D of carbon were $0.559{\times}10^{-6}cm^2.sec^{-1}$ at $1100^{\circ}C$, $0.237{\times}10^{-6}cm^2.sec^{-1}$ at $1200^{\circ}C$, $0.087{\times}10^{-6}cm^2.sec^{-1}$ at $1300^{\circ}C$, in case of pure iron ingot carburized. 5. The diffusion coefficient D of carbon were $0.124\;cm^2.sec^{-1}$ at $1100^{\circ}C$, $0.102\;cm^2.sec^{-1}$ at $1200^{\circ}C$, $0.480\;{\times}10^{-6}cm^2.sec^{-1}$ at $1300^{\circ}C$, in the case of sintered iron carburized at the pressuring $4ton\;/\;cm^2$.

• Electrical & Electronic Materials
• /
• v.8 no.4
• /
• pp.478-486
• /
• 1995

Cu/NbTi multilayer thin films and superconducting wires were fabricated and heat treated with conventional annealing and analyzed by differential scanning calorimetry (DSC) as a basic study for the enhancement of Jc. Interfacial reactions of Cu/NbTi multilayer thin films and superconducting wires were investigated with optical microscope, SEM, and XRD. According to the effective heat of formation (EHF) model, CU$\_$3/Ti was predicted as a first phase. However, considering the crystalline structure and thermodynamics, CuTi was predicted as a first phase. According to the results of DSC and XRD, CU$\_$2/Ti was found to be the first phase, followed by the formation Of CU$\_$4/Ti. The difference in first crystalline phase between the experimental result and the predicted one was discussed. In case of Cu/NbTi superconducting wires, the compounds formed at the Cu/NbTi interface grew with annealing time and the amount of compounds formed in Nb-47wt%Ti alloy was larger than that in Nb-50wt%Ti alloy. It seemed that the incubation time for the formation of compounds in Nb-50wt%Ti alloy was longer than that formed in Nb-47wt%Ti alloy. Also, the diffusion was the rate controlling step for the growth of compounds in all specimens. These compounds were formed at 500-600.deg. C for I hour annealing and, thus, the drawing time below I hour must be required to minimize the growth of compounds for the enhancement of Jc.

• Korean Journal of Materials Research
• /
• v.13 no.7
• /
• pp.465-472
• /
• 2003

Pd/Ge/Ti/Pt and Pd/Ge/Pd/Ti/Au ohmic contacts to n-type InGaAs were investigated for applications to AlGaAs/GaAs HBT emitter ohmic contacts. In the Pd/Ge/Ti/Pt ohmic contact minimum specific contact resistivity of $3.7${\times}$10^{-6}$ $\Omega$$\textrm{cm}^2$ was achieved by rapid thermal annealing at $^400{\circ}C$/10 sec. In the Pd/Ge/Ti/Au ohmic contact, minimum specific contact resistivity of $1.1${\times}$10^{-6}$ $\Omega$$\textrm{cm}^2$ was achieved by annealing at 40$0^{\circ}C$/10 sec but the ohmic performance was degraded with increasing annealing temperature due to the reaction between the ohmic contact materials and the InGaAs substrate. However, non-spiking planar interface and relatively good ohmic contact (high-$10^{-6}$ /$\Omega$$\textrm{cm}^2$) were maintained after annealing at $450^{\circ}C$/10 sec. Therefore, these thermally stable ohmic contact systems are promising candidates for compound semiconductor devices. RF performance of the AlGaAs/GaAs HBT was also examined by employing the Pd/Ge/Ti/Pt and Pd/Ge/Pd/Ti/Au systems as emitter ohmic contacts. Cutoff frequencies were 63.5 ㎓ and 65.0 ㎓, respectively, and maximum oscillation frequencies were 50.5 ㎓ and 51.3 ㎓, respectively, indicating very successful high frequency operations.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.11 no.3
• /
• pp.127-131
• /
• 2001

The effect of grain shape on the grain growth behavior of oxide system was investigated as afunction of liquid content during liquid phase sintering. As a model system, the solid grains of $Al_{2}O_{3}$ and MgO were selected during liquid phase sintering, i.e. faceted shape of $Al_{2}O_{3}$ in $CaAl_{2}Si_{2}O_{8}$ liquid phase and spherical shape of MgO in $CaMgSiO_{4}$ liquid phase. The average grain size of MgO with spherical shape was decreased with increasing the liquid phase content, whereas that of $Al_{2}O_{3}$ with faceted shape was independent of liquid phase content. In the case of $Al_{2}O_{3}$ grains with faceted shape, which interfaces are expected to be atomically flat, are likely to grow by the interfacial reaction controled process. Whereas, in the case of MgO grains with spherical shape, which interface are expected to be atomically rough, are likely to grow by the diffusion controlled process.

• Journal of the Microelectronics and Packaging Society
• /
• v.12 no.1 s.34
• /
• pp.87-93
• /
• 2005

Interfacial reactions between 48Sn-52In solder and $0.1{\mu}m$ Ti/3 ${\mu}m$ Cu/Au under bump metallurgies(UBM) with various Au thickness of $0.1{\~}0.7{\mu}m$ have been investigated after solder reflow at $150^{\circ}C,\;200^{\circ}C$, and $250^{\circ}C$ for 1 minute. Ball shear strength and shear energy of the Sn-52In solder bump on each UBM was also evaluated. With reflowing at $150^{\circ}C$ and $200^{\circ}C$, $Cu_6(Sn,In)_5$ and $AuIn_2$ intermetallic compounds were formed at UBW solder interface. However, UBM was consumed almost completely with reflowing at $250^{\circ}C$. While ball shear strength was not consistent with UBM/solder reactions, ball shear energy matched well with UBM/solder reactions.

• Journal of the Microelectronics and Packaging Society
• /
• v.14 no.4
• /
• pp.71-77
• /
• 2007

In this study, the mechanical and electrical properties of three different ball grid array (BGA) solder joints, consisting of Sn-37Pb, Sn-3.5Ag and Sn-3.5Ag-0.75Cu (all wt.%), with organic solderability preservative (OSP)-finished Cu pads were investigated as a function of reflow number. Based on scanning electron microscopy (SEM) analysis results, a continuous $Cu_6Sn5$, intermetallic compound (IMC) layer was formed at the solder/substrate interface, which grew with increasing reflow number. The ball shear testing results showed that the shear force peaked after 3 reflows (in case of Sn-Ag solder, 4 reflows), and then decreased with increasing reflow number. The electrical property of the joint gradually decreased with increasing reflow number.