• 제목/요약/키워드: Interface delamination

검색결과 138건 처리시간 0.03초

틸팅열차 차체용 탄소섬유직물/에폭시 복합재의 모우드 I 층간파괴인성 평가 (Evaluation of Mode I Interlaminar Fracture Toughness for Carbon Fabric/Expocy Composite for Tilting Train Carbody)

  • 허광수;김정석;윤성호
    • 한국철도학회논문집
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    • 제8권6호
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    • pp.573-580
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    • 2005
  • Model I interlaminar fracture behaviors of the carbon/epoxy composite, one of the candidate composites for a tilting train carbody, were investigate by the use of DCB(Double cantilever beam) specimens. These specimens were made of CF3327 plain woven fabric with epoxy resin, and an artificial starter delamination was fabricated by inserting Teflon film with the thickness of $12.5{\mu}m$ of $25.0{\mu}m$ at the one end of the specimen. Mode I interlaminar fracture toughness was evaluated for the specimens with the different thickness of an inserter. Also delamination propagating behaviors and interlaminar fracture surface were examined through an ooptical travelling scope and a scanning electron microscope. We found that abruptly unstable crack propagation called as stick-slip phenomena was observed. In addition, interlaminar fracture behaviors were affected on the location and the morphology of a crack tip as well as an interface region.

Scanning acoustic microscopy for material evaluation

  • Hyunung Yu
    • Applied Microscopy
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    • 제50권
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    • pp.25.1-25.11
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    • 2020
  • Scanning acoustic microscopy (SAM) or Acoustic Micro Imaging (AMI) is a powerful, non-destructive technique that can detect hidden defects in elastic and biological samples as well as non-transparent hard materials. By monitoring the internal features of a sample in three-dimensional integration, this technique can efficiently find physical defects such as cracks, voids, and delamination with high sensitivity. In recent years, advanced techniques such as ultrasound impedance microscopy, ultrasound speed microscopy, and scanning acoustic gigahertz microscopy have been developed for applications in industries and in the medical field to provide additional information on the internal stress, viscoelastic, and anisotropic, or nonlinear properties. X-ray, magnetic resonance, and infrared techniques are the other competitive and widely used methods. However, they have their own advantages and limitations owing to their inherent properties such as different light sources and sensors. This paper provides an overview of the principle of SAM and presents a few results to demonstrate the applications of modern acoustic imaging technology. A variety of inspection modes, such as vertical, horizontal, and diagonal cross-sections have been presented by employing the focus pathway and image reconstruction algorithm. Images have been reconstructed from the reflected echoes resulting from the change in the acoustic impedance at the interface of the material layers or defects. The results described in this paper indicate that the novel acoustic technology can expand the scope of SAM as a versatile diagnostic tool requiring less time and having a high efficiency.

복합재 적층판의 자유단 층간분리의 평가 (Evaluation of Free-Edge Delamination in Composite Laminates)

  • 김인권;공창덕;방조혁
    • Composites Research
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    • 제14권1호
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    • pp.8-14
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    • 2001
  • 복합재 적층판의 자유단 층간분리의 모드별 변형률 에너지 해방률을 구하는 간이 계산법을 제안하였다. 층간응력은 층간에서의 평형식으로부터 층간의멘트와 층간전단력으로 평가하였다. 적층판 자유단 층간분리의 변형은 일반화된 준3차원 고전적층이론에 의하여 계산하였다. 이 간이 계산법은 변형균 에너지 해방률의 세성분을 구하는 간편한 식으로 나타내었다 복합재 적층판이 일축인장을 받는 경우에 대하여 적층판 중앙면에 대칭과 비대칭인 층간분리가 발생한 경우에 대하여 해석을 행하였다. 해석결과는 가상분리진전법에 의한 유한요소해석결과와 잘 일치하였다.

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어닐링 온도 변화가 Al/연강 클래드재의 계면 특성에 미치는 영향 (Effects of Annealing Temperature on Interface Properties for Al/Mild Steel Clad Materials)

  • 정은욱;김희봉;김동용;김민중;조영래
    • 한국재료학회지
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    • 제22권11호
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    • pp.591-597
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    • 2012
  • For heat exchanger applications, 2-ply clad materials were fabricated by rolling of aluminum (Al) and mild steel sheets. Effects of annealing temperature on interface properties, especially on inter-layer formation and softening of strain hardened mild-steel, for Al/mild steel clad materials, were investigated. To obtain optimum annealing conditions for the Al/mild steel clad materials, annealing temperature was varied from room temperature to $600^{\circ}C$. At the annealing temperature about $450^{\circ}C$, an inter-layer was formed in an island-shape at the interface of the Al/mild steel clad materials; this island expanded along the interface at higher temperature. By analyzing the X-ray diffraction (XRD) peaks and the energy dispersive X-ray spectroscopy (EDX) results, it was determined that the exact chemical stoichiometry for the inter-layer was that of $Fe_2Al_5$. In some samples, an X-layer was formed between the Al and the inter-layer of $Fe_2Al_5$ at high annealing temperature of around $550^{\circ}C$. The existence of an X-layer enhanced the growth of the inter-layer, which resulted in the delamination of the Al/mild-steel clad materials. Hardness tests were also performed to examine the influence of the annealing temperature on the cold deformability, which is a very important property for the deep drawing process of clad materials. The hardness value of mild steel gradually decreased with increasing annealing temperature. Especially, the value of hardness sharply decreased in the temperature range between $525^{\circ}C$ and $550^{\circ}C$. From these results, we can conclude that the optimum annealing temperature is around $550^{\circ}C$ under condition of there being no X-layer creation.

경계요소법에 의한 이종재료 접합 잔류열응력의 해석 (A Study on the Bonding Residual Thermal Stress Analysis of Dissimilar Materials Using Boundary Element Method)

  • 이원;유영철;정의섭;윤인식
    • 비파괴검사학회지
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    • 제15권4호
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    • pp.540-548
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    • 1996
  • 전자 부품의 일종인 LSI 패키지의 제조 과정에서 절연 방진 방습 등을 목적으로 수지 몰딩이 널리 사용되고 있는데, 냉각과정에서 금속과 수지의 계면에 접합 잔류열응력이 발생하여 파괴의 원인이 되고 있다. 접합 잔류열응력의 측정에는 X선 회절법등이 사용되지만 측정상의 어려움과 계면단 응력특이성에 대한 해석의 곤란함 때문에 적절한 모델링에 따른 수치해석적 연구가 새로이 주목을 받고 있다. 본 연구에서는 Al/Epoxy를 몰딩 접합한 세가지의 대표적인 계면 형상을 선정하여 계면에서의 잔류열응력을 경계요소 수치해석 및 스트레인 게이지를 이용한 실험을 통하여 각각 해석하였다. 수치해석과 실험결과는 정성적으로 잘 일치하였으며, 서브 요소를 사용하므로써 계면단 응력 특이성의 해석 정밀도를 향상시킬 수 있었다. 또한 접합 잔류열응력의 해석결과로부터 수직응력에 의한 계면 박리가 예상되고, 피착체의 두께가 증가할수록 응력 특이성이 강하게 나타남을 확인하였다.

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전자패키지용 경사조성 $Al-SiC_p$복합재료의 열.기계적 변형특성 해석 (Thermomechanical Analysis of Functionally Gradient $Al-SiC_p$ Composite for Electronic Packaging)

  • 송대현;최낙봉;김애정;조경목;박익민
    • Composites Research
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    • 제13권6호
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    • pp.23-29
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    • 2000
  • 층상구조재료가 갖는 약점으로는 구성재료층 간의 열.기계적 특성 차이로 인하여 내부응력이 발생되고 비틀림 변형이 유발되어 형상 제어가 매우 어려울 뿐만 아니라, 반복적인 열 하중으로 인해 열이력을 받을 경우 접합부에서의 파손이 생길 수 있다는 것이다. 최근 층상구조에서 조직 혹은 조성이 점차적으로 변하는 계면을 삽입한 경사조성재료는 열.기계적 변형특성 차이에 의한 재료의 손상을 최소화시킬 수 있으나, 용도에 적합한 구조설계를 위해서 열.기계적 해석이 필요하다. 본 연구에서는 전자패키징용 $Al-SiC_p$ 경사조성 복합재료의 기하학적 구조와 온도변화에 따른 곡면화 변형 및 내부응력분포를 해석하고자 하였다. 한편 층상구조 $Al-SiC_p$ 경사조성 복합재료의 열변형량을 측정하고 내부응력분포를 실험적으로 구하여, 이론적으로 계산한 결과와 비교하였다. 본 연구의 해석결과는 경사조성 층상구조재료의 최적구조 설계에 유용하게 적용할 수 있다.

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유기트랜지스터 내부 편재화 준위간 커플링에 의한 계면 전하이동의 비선형적 가속화 현상의 이해 (Understanding Interfacial Charge Transfer Nonlinearly Boosted by Localized States Coupling in Organic Transistors)

  • 한송연;김수진;최현호
    • 접착 및 계면
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    • 제22권4호
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    • pp.144-152
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    • 2021
  • 유기반도체와 게이트 절연체 간 계면전하이동을 이해하는 것은 고성능 유기메모리, 고안정성 유기전계효과 트랜지스터 (이하 유기트랜지스터) 개발에 기여할 수 있다. 본 연구에서는 계면 간 전하이동의 특이거동, 즉 홀전하가 유기반도체에서 고분자절연체로 이동되어 편재화되는 것이 편재화 준위간의 커플링에 의해 비선형적으로 가속화될 수 있음을 최초로 밝혀내었다. 이의 규명을 위해 rubrene 단결정과 Mylar 절연체를 기반으로 한 유기트랜지스터를 vacuum lamination 공정으로 제작하여 반도체-절연체 계면의 반복적인 전사와 박리에도 안정적인 소자를 개발하였다. Rubrene 단결정과 Mylar film의 표면을 각각 광유도 산소 확산법과 UV-오존 처리를 통해 결함을 생성시켰다. 그 결과, 계면 간 전하이동과 이에 의한 바이어스 스트레스 효과가 rubrene과 Mylar가 가진 편재화 준위 간 커플링에 의해 비선형적으로 급격하게 가속화되었음을 관측하였다. 특히, rubrene 단결정에 있는 적은 밀도의 편재화 준위가 계면 간 전하이동을 촉진하는데 가교역할을 함을 밝혀내었다

Thermal wetting 현상이 탄소나노튜브-금속박막 계면의 응착력에 미치는 영향에 관한 분자 시뮬레이션 연구 (A Molecular Simulation on the Adhesion Control of Metal Thin Film-Carbon Nanotube Interface based on Thermal Wetting)

  • 이상훈;김현준
    • Tribology and Lubricants
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    • 제39권1호
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    • pp.8-12
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    • 2023
  • This study presents a molecular simulation of adhesion control between carbon nanotube (CNT) and Ag thin film deposited on silicon substrate. Rough and flat Ag thin film models were prepared to investigate the effect of surface roughness on adhesion force. Heat treatment was applied to the models to modify the adhesion characteristics of the Ag/CNT interface based on thermal wetting. Simulation results showed that the heat treatment altered the Ag thin film morphology by thermal wetting, causing an increase in contact area of Ag/CNT interface and the adhesion force for both the flat and rough models changed. Despite the increase in contact area, the adhesion force of flat Ag/CNT interface decreased after the heat treatment because of plastic deformation of the Ag thin film. The result suggests that internal stress of the CNT induced by the substrate deformation contributes in reduction of adhesion. Contrarily, heat treatment to the rough model increases adhesion force because of the expanded contact area. The contact area is speculated to be more influential to the adhesion force rather than the internal stress of the CNT on the rough Ag thin film, because the CNT on the rough model contains internal stress regardless of the heat treatment. Therefore, as demonstrated by simulation results, the heat treatment can prevent delamination or wear of CNT coating on a rough metallic substrate by thermal wetting phenomena.

탄소섬유복합재 가공의 결함특성 및 결함 저감을 위한 경계검출 (CFRP Drilling Experiments: Investigation on Defect Behaviors and Material Interface Detection for Minimizing Delamination)

  • 김규호;하태인;이찬영;안재훈;김주영;민병권;김태곤;이석우
    • 한국정밀공학회지
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    • 제33권6호
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    • pp.453-458
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    • 2016
  • CFRP (Carbon Fiber Reinforced Plastic) and CFRP-metal stacks have recently been widely used in the aerospace and automobile industries. When CFRP is machined by a brittle fracture mechanism, defect generation behaviors are different from those associated with metal cutting. The machining quality is strongly dependent on the properties of CFRP materials. Therefore, process control for CFRP machining is necessary to minimize the defects of differently manufactured CFRPs. In this study, defects in drilling of CFRP substrates with a variety of fiber directions and resin types are compared with respect to thrust force. An experimental study on material interface detection is carried out to investigate its benefits in process control.

얇은 접합층의 계면균열에 대한 이론적 해석 (Theoretical Analysis of Interface Crack on Thin Plate)

  • 노환진
    • 대한조선학회논문집
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    • 제44권6호
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    • pp.627-634
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    • 2007
  • A bonded plate or a coated part can be debonded by external impact or thermal expansion. To analyse adhesive strength, the blister test is generally adopted. In this paper, a blister test is modelled theoretically and then the stability and bifurcation of the blister are studied under several different cases. The blister is simplified to consist of a pure bending plate attached elastically to the rigid substrate. Expression of the energy release rate is obtained as a form of an explicit function for a circular-type blister or tunnel-type blister grown by controlling the internal pressure or internal volume. Stability and bifurcation are also studied in the frame of the quasi-static evolution. The study shows that the circular- type blister propagates with the first mode of bifurcation and that the tunnel-type blister propagates with a regular wave. It is proved that the waves have the same form on two side lines of the tunnel and that the wave length can be obtained. When the internal pressure is controlled, the blister is unstable, but when the internal volume is controlled, it is stable.