• Journal of the Korean Crystal Growth and Crystal Technology
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• v.32 no.5
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• pp.212-217
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• 2022

Large thermal stress due to the difference between silicon carbide and graphite's coefficients of thermal expansion could be formed during crystal growing process of silicon carbide (SiC) at high temperature. The large thermal stress could separate the SiC seed crystals from graphite components, which bring about the drop of the seed crystal during crystal growth. However, the bonding properties of SiC seed crystal module has hardly reported so far. In this study, SiC and graphite were bonded using 3 types of bonding agents and a three-point bending tests using a mixed-mode flexure test were conducted for the bonded samples to evaluate the bonding characteristics between SiC and graphite. Raman spectroscopy, X-ray Photoelectron Spectroscopy, and X-ray Computed Tomography were used to analyze the bonding characteristics and the microstructures of the SiC-graphite interfaces bonded with the bonding agents. As results, an excellent bonding agent was chosen to fabricate SiC seed crystal module with 50 mm in diameter. An SiC single crystal with 50 mm in diameter was successfully grown without falling out during top seeded solution growth of SiC at high temperature.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.39-46
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• 2021

The quantitative measurement of interfacial adhesion energy (Gc) of multilayer thin films for Cu interconnects was investigated using a double cantilever beam (DCB) and 4-point bending (4-PB) test. In the case of a sample with Ta diffusion barrier applied, all Gc values measured by the DCB and 4-PB tests were higher than 5 J/㎡, which is the minimum criterion for Cu/low-k integration without delamination. However, in the case of the Ta/Cu sample, measured Gc value of the DCB test was lower than 5 J/㎡. All Gc values measured by the 4-PB test were higher than those of the DCB test. Measured Gc values increase with increasing phase angle, that is, 4-PB test higher than DCB test due to increasing plastic energy dissipation and roughness-related shielding effects, which matches well interfacial fracture mechanics theory. As a result of the 4-PB test, Ta/Cu and Cu/Ta interfaces measured Gc values were higher than 5 J/㎡, suggesting that Ta is considered to be applicable as a diffusion barrier and a capping layer for Cu interconnects. The 4-PB test method is recommended for quantitative adhesion energy measurement of the Cu interconnect interface because the thermal stress due to the difference in coefficient of thermal expansion and the delamination due to chemical mechanical polishing have a large effect of the mixing mode including shear stress.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.65-71
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• 2017

To prepare the Cu-based filler material indicating enhanced oxidation resistance property and Ag content, Ag-coated Cu particles was fabricated by Ag plating of 40 wt % on the spherical Cu particles with an average size of $2{\mu}m$ and their oxidation behavior was also evaluated. In the case that ethylenediaminetetraacetic acid was used alone, the fabricated particles frequently showed broken structures such as delamination at Ag shell/core Cu interface and hollow structure that are induced by excessive galvanic displacement reaction. As a result, fraction of defect particles increased up to 19.88% after the Ag plating of 40 wt.%. However, the fraction in the 40 wt.% Ag-coated Cu particles decreased to 9.01% and relatively smooth surface and dense microstructure in the Ag shell were also observed with additional usage of hydroquinone as a complexing agent. Ag-coated Cu particles having the enhanced microstructure did not show any weight increase by oxidation for exposure to air at $160^{\circ}C$ for 2 h, indicating increased oxidation resistance property.

• Composites Research
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• v.30 no.2
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• pp.84-93
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• 2017

This study investigates thermal and mechanical characterization of environmental barrier coating on the $SiC_f-SiC$ composites. The spherical environmental barrier coating (EBC) powders are prepared using a spray drying process for flowing easily during coating process. The powders consisting of mullite and 12 wt% of Ytterbium silicate are air plasma sprayed on the Si bondcoat on the LSI SiC fiber reinforced SiC composite substrate for protecting the composites from oxidation and water vapor reaction. We vary the process parameter of spray distance during air plasma spray of powders, 100, 120 and 140 mm. After that, we performed the thermal durability tests by thermal annealing test at $1100^{\circ}C$ for 100hr and thermal shock test from $1200^{\circ}C$ for 3000 cycles. As a result, the interface delamination of EBC never occur during thermal durability tests while stable cracks are prominent on the coating layer. The crack density and crack length depend on the spray distance during coating. The post indentation test indicates thermal tests influence on the indentation load-displacement mechanical behavior.

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.6
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• pp.618-629
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• 2001

This paper presents a result of failure analysis and reliability evaluation for high voltage ceramic capacitors. The failure modes and failure mechanisms were studied in two ways in order to estimate component life and failure rate. The causes of failure mechanisms for zero resistance phenomena under withstanding voltage test in high voltage ceramic capacitors molded by epoxy resin were studied by establishing an effective root cause failure analysis. Particular emphasis was placed on breakdown phenomena at the ceramic-epoxy interface. The validity of the results in this study was confirmed by the results of accelerated testing. Thermal cycling test for high voltage ceramic capacitor mounted on a magnetron were implemented. Delamination between ceramic and epoxy, which might cause electrical short in underlying circuitry, can occur during curing or thermal cycle. The results can be conveniently used to quickly identify defective lots, determine $B_{10}$ life estimation each lot at the level of inspection, and detect major changes in the vendors processes. Also, the condition for dielectric breakdown was investigated for the estimation of failure rate with load-strength interference model.

• Composites Research
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• v.30 no.4
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• pp.241-246
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• 2017

The brittle nature in most FRP composites is accompanying other forms of energy absorption mechanisms such as fibre-matrix interface debonding and ply delamination. It could play an important role on the energy absorption capability of composite structures. To solve the brittle nature, the adhesion between pines and composites was studied. Thermal treated pines were attached on carbon fiber reinforced polymer (CFRP) by epoxy adhesives. To find the optimum condition of thermal treatment for pine, two different thermal treatments at 160 and $200^{\circ}C$ were compared to the neat case. To evaluate mechanical and interfacial properties of pines and pine/CFRP composites, tensile, lap shear and Izod test were carried out. The bonding force of pine grains was measured by tensile test at transverse direction and the elastic wave from fracture of pines was analyzed. The mechanical, interfacial properties and bonding force at $160^{\circ}C$ treated pine were highest due to the reinforced effect of pine. However, excessive thermal treatment resulted in the degradation of hemicellulose and leads to the deterioration in mechanical and interfacial properties.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.105-111
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• 2023

Electronic devices have been evolved to be mechanically flexible that can be endured repetitive deformation. This evolution emphasizes the importance of long-term reliability in metal wiring connecting electronic components, especially under bending fatigue in compressed environments. This study investigated methods to enhance adhesion between copper (Cu) and polyimide (PI) substrates, aiming to improve the reliability of copper wiring under such conditions. We applied oxygen plasma treatment and introduced a chromium (Cr) adhesion layer to the polyimide substrate. Our findings revealed that these adhesion enhancement methods significantly affect compression fatigue behavior. Notably, the chromium adhesion layer, while showing weaker fatigue characteristics at 1.5% strain, demonstrated superior performance at 2.0% strain with no delamination, outperforming other methods. These results offer valuable insights for improving the reliability of flexible electronic devices, including reducing crack occurrence and enhancing fatigue resistance in their typical usage environments.