• Journal of the Korean Geotechnical Society
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• v.27 no.12
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• pp.5-15
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• 2011

Conventional designs of landfill covers use geosynthetics such as geomembrane and GCL, and clay liners to lower the permeability of final covers of landfill sites. However, differential settlement and the variation of temperature or humidity in landfill sites cause the development of cracks or structural damage inside the final cover. This study examined the application of a Self Recovering Sustainable Liner (SRSL) as an alternative landfill final cover material. SRSL consists of double layers, which have chemicals, can generate precipitates filling the pores of the layers by chemical reaction. The interface material forms an impermeable layer and in case of internal cracks, the reactants of the two layers migrate towards the crack and heal it by forming another liner. In this study the applicability of SRSL material for landfill final cover was examined by performing flexible wall permeameter tests to prove that the hydraulic conductivity is lower than the regulations and unconfined compression tests to judge whether the strength satisfies the restriction for the landfill final cover. Furthermore, the environmental impacts on the permeability and strength were evaluated. The experimental results show that the SRSL has lower hydraulic conductivity and higher strength than the regulations and is little influenced by climatic changes such as wet/dry or freeze/thaw process.

• The Journal of Korean Academy of Prosthodontics
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• v.29 no.1
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• pp.111-137
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• 1991

Although a number of studies have been performed to assure that residual stress caused by a mismatch of alloy porcelain thermal expansion can contribute to clinical failure of a ceramometal restoratoin, the interactive influence of cooling rate on the magnitude of thermal expansion difference and on bond strength between them have not been extensively analyzed. The objective of this study was to determine the influence of cooling rate and the number of firing cycles on the expansion mismatch and the flexural failure resistance of metal porcelain strip. Tested alloys included one Pd-Ag alloy, one Ni-Cr-Be alloy with two kinds of porcelain, Vita and Ceramco. Metal specimens were cast into rods with a height of 13mm and a diameter of 5mm. Subsequently, the castings were subjected to scheduled firing cycles without porcelain. And the porcelain specimens after being fired were trimmed into a bar with a final dimension of 5 x 5 x 25mm. Thermal expansions of the alloys and porcelains were measured by using a push rod or a differential dialometer respectively. Porcelain glass transition temperatures and expansion values were derived alloy- porcelain pairs were assessed by comparing expansion values of the components at a porcelain glass transition temperature. Calculations were made using combinations of a Ni-Cr alloy or Pd-Ag alloy with each of two porcelain products. Metal- porcelain strip specimens were subjected to four point loading in an Instron testing machine until crack occured at the metal-cramic interface at the time of sharp decrease of load on recorder. On the basis of this study, the following conclusions may be stated : 1. Regardless of the kinds of ceramometal combinations, both of calculated and experimental data revealed that the double fired specimens exhibited a significantly lower flexural strength. 2. By the rise of the amount of mismatch, bond strength were decreased. 3. Thermal expansion value of Pd-Ag alloys were higher than of Ni-Cr alloys. 4. Expansion curves of metal were proportional to the increase of temperature and were not affected by the experimental conditions, however porcelains did not show the same magnitude of metal, and a shift of the glass transition temperature to higher temperatures was observed when cooled rapidly. 5. Alloy- porcelain thermal compatibility appeared more dependent on the porcelain than the alloy.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.69-73
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• 2010

Finite-element analyses were conducted to investigate the thermal stress in 3-dimensional stacked wafers package containing through-silicon-via (TSV), which is being widely used for 3-Dimensional integration. With finite element method (FEM), thermal stress was analyzed with the variation of TSV diameter, bonding diameter, pitch and TSV height. It was revealed that the maximum von Mises stresses occurred at the edge of top interface between Cu TSV and Si and the Si to Si bonding site. As TSV diameter increased, the von Mises stress at the edge of TSV increased. As bonding diameter increased, the von Mises stress at Si to Si bonding site increased. As pitch increased, the von Mises stress at Si to Si bonding site increased. The TSV height did not affect the von Mises stress. Therefore, it is expected that smaller Cu TSV diameter and pitch will ensure mechanical reliability because of the smaller chance of plastic deformation and crack initiation.

• Journal of the Korea institute for structural maintenance and inspection
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• v.27 no.1
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• pp.71-77
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• 2023

This study aims to investigate the structural performance of hollow-core slab (HCS) memebers with 400 mm thickness. To this end, a total of four HCS specimens were fabricated based on the individual mold method to provide shear reinforcement, unlike the extrusion method. The key variables were chosen as the presence of topping concrete, core-filling concrete, and shear reinforcements. The crack patterns and load-displacement responses of the test specimens were analyzed in detail. Test results showed that inclined shear cracking occurred all the specimens, and that the specimen with shear reinforcement on the web of HCS unit had higher strength and ductility than the specimen without shear reinforcement. In particular, shear reinforcements placed on the web of HCS unit effectively resisted not only to vertical shear force but also to horizontal shear force between the interface of HCS unit and topping concrete. In addition, it was discovered that the method in which shear reinforcements are placed on the web of HCS unit is more effective in improving structural performance than core-filling method.

• Journal of the Korea institute for structural maintenance and inspection
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• v.27 no.6
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• pp.182-192
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• 2023

In this study, the efficacy of Engineered Cementitious Composite(ECC) jacket for masonry fences subjected to lateral dynamic load was experimentally verified through a shaking table test, comparing it with the performance of an unreinforced masonry(URM) fence. Firstly, dominant frequencies, modal damping ratios and deformed shapes were identified through an impact hammer test. URM and ECC-strengthened fences with heights of 940mm and 970mm had natural frequencies of 6.4 and 35.3Hz, and first modal damping ratios of 7.0 and 5.3%, respectively. Secondly, a shaking table test was conducted in the out-of-plane direction, applying a historical earthquake, El Centro(1940) scaled from 25 to 300%. For the URM fence, flexural cracking occurred at the interface of brick and mortar joint(i.e., bed joint) at the ground motion scaled to 50%, and out-of-plane overturning failure followed during the subsequent test conducted at the ground motion scaled to 30%. On the other hand, the ECC-jacketed fence showed a robust performance without any crack or damage until the ground motion scaled to 300%. Finally, the base shear forces exerted upon the URM and ECC-jacketed fences by the ground motions scaled to 25~300% were evaluated and compared with the ones calculated according to the design code. In contrast to the collapse risk of the URM fence at the ground motion of 1,000-year return period, the ECC-jacketed fence was estimated to remain safe up to the 4,800-year return period ground motion.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.105-111
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• 2023

Electronic devices have been evolved to be mechanically flexible that can be endured repetitive deformation. This evolution emphasizes the importance of long-term reliability in metal wiring connecting electronic components, especially under bending fatigue in compressed environments. This study investigated methods to enhance adhesion between copper (Cu) and polyimide (PI) substrates, aiming to improve the reliability of copper wiring under such conditions. We applied oxygen plasma treatment and introduced a chromium (Cr) adhesion layer to the polyimide substrate. Our findings revealed that these adhesion enhancement methods significantly affect compression fatigue behavior. Notably, the chromium adhesion layer, while showing weaker fatigue characteristics at 1.5% strain, demonstrated superior performance at 2.0% strain with no delamination, outperforming other methods. These results offer valuable insights for improving the reliability of flexible electronic devices, including reducing crack occurrence and enhancing fatigue resistance in their typical usage environments.

• Computers and Concrete
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• v.33 no.5
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• pp.605-619
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• 2024

The increase of reclaimed asphalt pavement (RAP) content in recycled asphalt concrete (RAC) is accompanied by the degradation of low-temperature cracking resistance, which has become an obstacle to the development of RAC. This paper aims to reveal the meso-scale mechanisms of the low-temperature fracture behavior of RAC and provide a theoretical basis for the economical recycling of RAP. For this purpose, micromechanical heterogeneous peridynamic model of RAC was established and validated by comparing three-point bending (TPB) test results against corresponding numerical simulation results of RAC with 50% RAP content. Furthermore, the models with different aggregate shapes (i.e., average aggregates circularity (${\bar{C_r}}=1.00$, 0.75, and 0.50) and RAP content (i.e., 0%, 15%, 30%, 50%, 75%, and 100%) were constructed to investigate the effect of aggregate shape and RAP content on the low-temperature cracking resistance. The results show that peridynamic models can accurately simulate the low-temperature fracture behavior of RAC, with only 2.9% and 13.9% differences from the TPB test in flexural strength and failure strain, respectively. On the meso-scale, the damage in the RAC is mainly controlled by horizontal tensile stress and the stress concentration appears in the interface transition zone (ITZ). Aggregate shape has a significant effect on the low-temperature fracture resistance, i.e., higher aggregate circularity leads to better low-temperature performance. The large number of microcracks generated during the damage evolution process for the peridynamic model with circular aggregates contributes to slowing down the fracture, whereas the severe stress concentration at the corners leads to the fracture of the aggregates with low circularity under lower stress levels. The effect of RAP content below 30% or above 50% is not significant, but a substantial reduction (16.9% in flexural strength and 16.4% in failure strain) is observed between the RAP content of 30% and 50%. This reduction is mainly attributed to the fact that the damage in the ITZ region transfers significantly to the aggregates, especially the RAP aggregates, when the RAP content ranges from 30% to 50%.