• Computers and Concrete
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• v.4 no.2
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• pp.119-134
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• 2007

External bonding of steel or FRP plates to reinforced concrete (RC) structures has been a popular method for strengthening RC structures; however, unexpected premature failure often occurs due to debonding between the concrete and the epoxy. We proposed a Coulomb criterion with a constant failure surface as the debonding failure criterion for the concrete-epoxy interface. Diagonal shear bonding tests were conducted to determine the debonding properties that were related to the failure criterion, such as the angle of internal friction and the coefficient of cohesion. In addition, an interface element that utilized the Coulomb criterion was implemented in a nonlinear finite element analysis program to simulate debonding failure behavior. Experimental studies and numerical analysies on RC beams strengthened by an externally bonded steel or FRP plate were used to determine the range of the coefficient of cohesion. The results that were presented prove that premature failure loads of strengthened RC beams can be predicted with using the bonding properties and the finite element program with including the proposed Coulomb criterion.

• Proceedings of the KOSOMBE Conference
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• v.1996 no.05
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• pp.133-136
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• 1996

We investigated how hydroxyapatite (HA) coating onto a porous super stainless steel (S.S.S, 22Cr-20Ni-6Mo-0.25N) affects bone ingrowth in a dog transcortical femoral model. Implants were histologically evaluated after 4 and 48 weeks of implantation, and the bone bonding strength at the bone/implant interface was examined by employing the pull-out test. The direct osseous tissue bonding onto the HA-coated S.S.S was observed, but the uncoated stainless steels had thin fibrous tissue layers. The mean interface strength of the HA-coated S.S.S was 1.5 and 2.5 times greater than those of the S.S.S and the 316L SS after one year of implantation, respectively. In preliminary studies, no toxic responce was observed from a cytotoxicity test of the S.S.S, having similar corrosion resistance to titanium. Our results suggest that early osteoconductive nature of HA coating may induce long term osteointegration for a bioinert substrate.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.11-15
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• 2013

The wafer bonding process becomes a flexible approach to material and device integration. The bonding strength in 3-dimensional process is crucial factor in various interface bonding process such as silicon to silicon, silicon to metals such as oxides to adhesive intermediates. A measurement method of bonding strength was proposed by utilizing AFM applied CNT probe tip which indicated the relative simplicity in preparation of sample and to have merit capable to measure regardless type of films. Also, New Tool was utilized to measure of tip radius. The cleaned $SiO_2$-Si bonding strength of SPFM indicated 0.089 $J/m^2$, and the cleaning result by RCA 1($NH_4OH:H_2O:H_2O_2$) measured 0.044 $J/m^2$, indicated negligible tolerance which verified the possibility capable to measure accurate bonding strength. And it could be confirmed the effective bonding is possible through SPFM cleaning.

• Journal of Powder Materials
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• v.20 no.2
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• pp.114-119
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• 2013

In the DBC (direct bonding of copper) process the oxygen partial pressure surrounding the AlN/Cu bonding pairs has been controlled by Ar gas mixed with oxygen. However, the direct bonding of Cu with sound interface and good adhesion strength is complicated process due to the difficulty in the exact control of oxygen partial pressure by using Ar gas. In this study, we have utilized the in-situ equilibrium established during the reaction of $2CuO{\rightarrow}Cu_2O$ + 1/2 $O_2$ by placing powder bed of CuO or $Cu_2O$ around the Cu/AlN bonding pair at $1065{\sim}1085^{\circ}C$. The adhesion strength was relatively better in case of using CuO powder than when $Cu_2O$ powder was used. Microstructural analysis by optical microscopy and XRD revealed that the interface of bonding pair was composed of $Cu_2O$, Cu and small amount of CuO phase. Thus, it is explained that the good adhesion between Cu and AlN is attributed to the wetting of eutectic liquid formed by reaction of Cu and $Cu_2O$.

• Restorative Dentistry and Endodontics
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• v.22 no.1
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• pp.447-463
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• 1997

The purpose of this study was to evaluate the effectiveness of copal varnish and five bonding agents(Scotchbond Multi-Purpose Plus Dental Adhesive System, Panavia 21, All Bond 2, Superbond D-Liner II plus, Fuji Duet) in reducing microleakage under amalgam restorations. Class V cavity were prepared on both buccal and lingual surface of sixty extracted human molars with cementum margin and were filled with different kinds of liners and amalgam. All teeth were stored at $37^{\circ}C$ in physiologic saline solution. After 1 week they were thermally stressed for 500 cycles between 5 and $55^{\circ}C$ in baths containing 0.5 % basic fuchsin dye. The dye penetrations were observed with a stereomicroscope. Scanning electron micrographs were taken of representative tooth sections from each group to assess the nature of the tooth/liner/amalgam interface. The statistical test were applied to the results using a one way analysis variance (ANOVA) and Duncan's multiple range test. The results were as follows ; 1. In all groups, the enamel margin showed significantly lower leakage value than the cementum margin (p<0.05). 2. At the dentin and enamel margins, the leakage value of Copalite-lined group showed significantly higher than that of no liner group (p<0.05), but showed significantly lower than that of bonding agent lined-groups (p<0.05). 3. There was no significant difference between the bonding agent lined-groups (p>0.05). 4. On the backscattered scanning electron microscopy observation, discontinuous gaps were observed between amalgam and dentin in the bonding agent-lined amalgam restorations and the bonding agents appeared to fill the gap space and were mixed with amalgam particles. At the amalgam/tooth interface, unsealed dentin and continuous gaps were found in both unlined and Copalite-lined restorations.

• Restorative Dentistry and Endodontics
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• v.23 no.1
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• pp.468-476
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• 1998

The purpose of this study was to observe the morphologic change of dentinal surface, adhesion in interface between dentin and bonding agents, and penetration pattern of resin tags into dentinal tubles according to bonding procedure of ONE-STEP universal adhesive system. Ten extracted human molars were mounted in dental stone and sectioned to expose mid-coronal occlusal dentin and again sectioned tooth crown apically. Specimens were randomly assigned to three groups for dentin conditioning with 32% phoshoric acid, two coats of bonding agents after dentin conditioning, and bond of composite resin. The surfaces of dentin were treated with etch ant and applied bonding agent, and bonded composite resin according to the directions of manufacturer. Specimens which were boned composite were sectioned longitudinally for observing interfaces between resin and dentin. Two of specimens which were sectioned longitudinally were immersed in 6 N HCL for 30 seconds and 1% NaOCL for 12 hours to partially demineralize and deproteinize the dentin substrate. Each specimen was mounted on a brass stub, sputter-coated with gold and observed under SEM. The result were as follows : 1. On the dentinal surface which was conditioned with 32% phosphoric acid. the smear layer was completely removed. orifices of dentinal tubules were opened 3-$5{\mu}m$ wide. and dentinal surface was irregular. 2. On the dentinal surface which was applied ONE-STEP. bonding agent. resin particles were observed on the orifices of dentinal tubules and intertubular dentin. 3. There were close adaptation between dentin and resin and were the pattern which composite invaded into dentin. 4. 1-$3{\mu}m$-wide hybrid layer was visible in the interface between dentin and resin. 5. Long and funnel shaped resin tags were observed in demineralized specimens. and the surfaces of tags were rough.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.1
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• pp.58-68
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• 1998

Advantages of adhesively bonded joints and techniques of weight reduction have led to increasing use of structural adhesives such as LSI(large scale integration) package, automobile, aircraft in the various industries. In spite of such wide applications of adhesively bonded joints, the evaluation method of bonding strength has not been established. Stress singularity occurs at the interface edges of adhesively bonded joints and it is required to analyze it. In this paper, the stress singularity using 2-dimensional elastic boundary element method (BEM) with the changes of the lap length and adhesive for single lap joint was analyzed, and experiments of strength evaluation were carried out. As the results, the evaluating method of bonding strength considering stress singularity at interface edges of adhesively bonded joints and stress intensity factor of interface crack have been proposed in static and fatigue test.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.10a
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• pp.144-148
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• 2001

A proper estimation of the mechanical properties for composites has been required for better design/selection of constituents for composite materials. Present investigation shows the simulation results for ceramic reinforced metal matrix composite under uniaxial transverse tensile loading. The resulting transverse mean stress with the transverse mean strain was described for composites as a function of the volume fraction with two different types of interfacial bonding: (1)strongly bonded interface, and (2)no bonded interface. A two-dimensional finite element modeling and analysis were conducted based on the unit-cell concept with an assumption of a regular square arrangement of the reinforcement within the composite. The mean stress was generally increased with the ceramic volume fraction for composite with strong interface bonding. The micromechanics concept combined with finite element modeling for composite can be used in order to predict the transverse properties of composites with a priori known properties of constituents.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.11
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• pp.1014-1018
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• 2005

The purpose of this study is to obtain strong bond strength at the interface between piezoelectric substrates and semiconductor thin films to be applied for the manufacture of high-performance acoustic wave semiconductor coupled device. For this purpose, we have compared and examined the effects of different surface treatment methods on hydrophile properties at the surface of the piezoelectric substrates. Moreover, we have observed the effect of microwave and laser on the elimination of water molecules at the interface. As for the piezoelectric substrates, dry method for surface treatment was found to be superior in the control of hydrophilicity of the surface compared to wet method. On the other hand, both microwave and laser were found to be effective in the elimination of water molecules in the interface.

• Bulletin of the Korean Chemical Society
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• v.31 no.11
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• pp.3217-3220
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• 2010

The electronic structures and bonding configuration of histidine on Ge(100) have been investigated with various sample treatments using core-level photoemission spectroscopy (CLPES). Interpretation of the Ge 3d, C 1s, N 1s, and O 1s core level spectra being included in these systems revealed that both the imino nitrogen in the imidazole ring and the carboxyl group in the glycine moiety concurrently participate in the adsorption of histidine on a Ge(100) surface at 380 K. Moreover, we could clearly confirm that the imino nitrogen with a free lone pair in the imidazole group adsorbs on Ge(100) more strongly than the carboxyl group in the glycine moiety by examining systems annealed at various temperatures.