• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.7
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• pp.1384-1392
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• 2002

Single fiber pull-out technique has been commonly used to characterize the mechanical behavior of interface in fiber reinforced composite materials. An improved analysis considering the effects of transversely isotropic properties of fiber and the effects of thermal residual stresses in both radial and axial directions along the fiber/matrix interface is developed for the single fiber pull-out test. Although the stress transfer properties across the interface is not much affected by considering the transversely isotropic properties of fiber, interfacial debonding is notably encouraged by the effect. The interfacial shear stress that plays an important role in interfacial debonding is very much affected by the component of axial thermal residual stress in the bonded region, which can induce a two-way debonding mechanism.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.5 no.4
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• pp.53-62
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• 1996

Recently, ceramic / metal bonded joints have led to inccreasing use of structural materials such as automobile, heat engine in various industries. In this paper, a method to analyze an interface crack under both residual stresses and applied loading was proposed. and some results of boundary element method(BEM) analysis Were presented, Fracture thoughness tests of ceramic/metals bonded joints with an interface crack Were carried out, and the stress intensity factors of these joints Ware analyzed by BEM. Also crack propagtion direction was simulated numerically by using BEM. Crack propagation angle was able to easily determine based on the maximum stress concept. The prediction of fracture strength by the fracture thoughness of the ceramics/metals bonded joints was proposed.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.6
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• pp.117-125
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• 1998

The paper attempts to estimate the incubation time of a cavity in the interface between a power law creep particle and an elastic matrix subjected to a uniaxial stress. Since the power law creep particle is time dependent, the stresses in the interface relax. The volume free energy associated with Helmholtz free energy includes strain energies caused by applied stress and dislocations piled up in interface(DPI). The energy due to DPI is found by modifying the result of Dundurs and Mura[4]. The volume free energies caused by both applied stress and DPI are a function of the cavity size(r) and elapsed time(t) and arise from stress relaxation in the interface. Critical radius $r^*$ and incubation time $t^*$ to maximise Helmholtz free energy is found in present analysis. Also, kinetics of cavity formation are investigated using the results obtained by Riede [7]. The incubation time is defined in the analysis as the time required to satisfy both the thermodynamic and kinetic conditions. Through the analysis it is found that 1) strain energy caused by the applied stress does not contribute significantly to the thermodynamic and kinetic conditions of a cavity formation, 2) in order to satisfy both thermodynamic and kinetic conditions, critical radius $r^*$ decreases or holds constant with increase of the time until the kinetic condition(eq. 2.3) is satisfied. there for the cavity may not grow right after it is formed, as postulated by Harris [15], and Ishida and Mclean [16], 3) the effects of strain rate exponent (m), material constant $\sigma$0, volume fraction of the particle to matrix(f)and particle size on the incubation time are estimated using material constants of the copper as matrix.

• Korean Journal of Materials Research
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• v.11 no.12
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• pp.1009-1013
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• 2001

The effects of coupling agent on the interface characteristics between epoxy resin and natural zeolite were studied by SEM, optical microscope and universal testing machine (UTM). Epoxy resin as a matrix was diglycidyl ether of bisphenol A (DGEBA)/4,4'-methylene dianiline (MDA)/malononitrile (MN) system and natural zeolite as an inorganic fillet was produced in Korea. With the increment of zeolite content, tensile strength decreased and it was due to the different elastic moduli of two materials. When external stress was loaded on the composites, the stress concentrated on the weakly bonded interface and crack grew easily. To improve the interface characteristics, the surface of the natural zeolite was treated with the silane coupling agent and it was found that the tensile strength was increased. The morphology of the interface showed that the bonding characteristics were modified by coupling agent.

• Proceedings of the KIEE Conference
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• 1988.07a
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• pp.346-349
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• 1988

Conductance technique is the moat accurate method and gives more detailed information about interface of the MIS structure than other methods. With the measurement of the equivalent parallel conductance and capacitance, the characterization of Si-SiN interface is developed. The interface state density of Si-SiN is obtained by $8{\times}10^{11}$ - $6{\times}10^{12}(eV^{-1}cm^{-2}$). After the positive B-T stress is performed on the sample, the interface state density gets increased. The interface state density is not effected by the D.C. stress.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.12
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• pp.3828-3837
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• 1996

The dynamic problems of interface crack propagated with constant velocity along the interface of bimateraial composed of isotropic and orthotropicmaterial under antiplane loading condition are studied in this paper. The general dynamic stress fields and displacement fields of mode III are derived when interface crack between isotropic and orthotropic material is propagating with constant velocity. The general dynamic stress fields and displacement fields in isotropic material. Finally, the characteristics of interface crack propagation are studied with various properties of isotropic and orthotropic material and crack propagarion velocities.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 1999.04a
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• pp.19-26
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• 1999

This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate as the film absorbs moisture from the ambient environment. The rime-domain boundary element method is employed to investigate the behavior of interface stresses. The order of the free-edge singularity is obtained numerically for a given viscoelastic model. It is shown that the free-edge stress intensity factor is relaxed with time,'while the order of the singularity increases with time for the viscoelastic model considered.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 1999.10a
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• pp.437-443
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• 1999

This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate subjected to uniform temperature change. The viscoelastic film has been assumed to be thermorheologically simple. The time-domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The order of the free-edge singularity has been obtained numerically for a given viscoelastic model. It is shown that the free-edge stress intensity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2003.10a
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• pp.383-388
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• 2003

This paper deals with the singular stresses developed in a polymer coating on concrete due to temperature change. The boundary element method is employed to investigate the behavior of interface stresses. Numerical results show that very large stress gradients are present at the interface comer and such stress singularity dominates a very small region relative to layer thickness. Since the exceedingly large stresses at the interface corner cannot be borne by coating materials, local yielding or delamination can occur in the vicinity of free surface.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2002.11a
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• pp.27-33
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• 2002

The residual thermal stresses at the interface corner between the elastic substrate and the viscoelastic thin film due to cooling from cure temperature down to room temperature have been studied. The polymeric thin film was assumed to be thermorheologically simple. The boundary element method was employed to investigate the nature of stresses on the whole interface. Numerical results show that very large stress gradients are present at the interface comer and such stress singularity might lead to edge cracks or delamination.