• 한국전산구조공학회논문집
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• 제15권3호
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• pp.389-398
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• 2002

동전모양의 균열이 이상복합 실린더 계면에 존재하는 혼합모드 조건(I, II)에 대해 유한요소법을 사용하여 에너지해방율을 구하였다. 두재료의 탄성비와 노치율을 변화시켜 상업용 FEM 프로그램인 ABAQUS로부터 얻은 결과를 가상 균열법과 J 적분법에 적용하였으며 에너지해방율을 구하여 무차원함수로 표현하였다. 모드 II의 무차원 에너지해방율($\sqrt{G_{II}E^*}/\sqrt[p]{\pi a}$)은 균열길이와 탄성비가 증가되면서 그 값이 증가됨을 알수 있었다. 반면, 모드 I의 무차원 에너지해방율($\sqrt{G_{I}E^*}/\sqrt[p]{\pi a}$)은 탄성비가 증가하면서 그 값이 감소하며, 두재료의 탄성비가 3 이상인 경우에 균열길이가 증가되면서 무차원 에너지해방율이 감소하다가 다시 증가하게 나타났다. 또한 수치해석된 결과치를 무한판 실린더의 응력확대계수에 대한 정해와 비교하여 본 해석의 신뢰성을 확보하였다.

• 한국안전학회지
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• 제38권2호
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• pp.1-7
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• 2023

Fiber-metal laminates (FMLs) and polymer matrix composites (PMCs) are formed in various ways. In particular, FMLs in which aluminum is laminated as a reinforced layer are widely used. Also, glass fiber-reinforced plastics (GFRPs) are generally applied as fiber laminates. The bonding interface layer between the aluminum and fiber laminate exhibits low strength when subjected to hot press fabrication in the event of delamination fracture at the interface. This study presents a simple method for strengthening the interface bonding between the aluminum metal and GFRP layer of FML composites. The surfaces of the aluminum interface layer are engraved with three kinds of patterns by using the laser machine before the hot press works. Furthermore, the effect of the laser patterns on the interfacial toughness is investigated. The interfacial toughness was evaluated by the energy release rate (G) using an asymmetric double cantilever bending specimen (ADCB). From the experimental results, it was shown that the strip type pattern (STP) has the most proper pattern shape in GFRP/Al FML composites. Therefore, this will be considered a useful method for the safety assessment of FML composite structures.

• Composites Research
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• 제29권2호
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• pp.45-52
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• 2016

섬유금속적층판과 같은 하이브리드 소재는 여러 방향의 하중에 의한 접착층의 파괴로 인해 층간분리가 발생할 수 있다. 모든 하중은 수직 방향의 응력과 면내 두 방향의 전단 응력으로 분해할 수 있으며, 이러한 하중은 접착층의 모드 I, II, III 파괴를 일으킨다. 따라서 하중에 의한 층간분리 현상을 예측하기 위해, 접착층의 모드별 임계 에너지 해방률을 도출하는 것이 중요하다. 본 연구에서는 접착층의 모드 I 임계 에너지 해방률을 측정하기 위해 double cantilever beam 시험을 수행하였으며, 모드 II 임계 에너지 해방률을 측정하기 위해 end-notched flexure 시험을 수행하였다. 또한, 실험으로부터 도출한 임계 에너지 해방률을 ABAQUS의 응집영역모델에 적용하여 유한요소해석을 수행하였으며, 실제 실험 결과와의 비교를 통해 층간분리 현상에 대한 수치해석 기법 적용의 유효성을 입증하였다.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2013년도 추계학술대회 논문집
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• pp.206-213
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• 2013

본 논문에서는 적분변환법을 이용하여 면외전단 충격하중이 작용하는 두 개의 서로 다른 압전재료층 사이의 기능경사압전재료 접합층 내부 균열에 대한 과도응답 해석 을 수행한다. 기능경사압전재료의 물성치는 두께 방향을 따라 연속적으로 변하는 것으로 가정한다. 라플라스 변환과 푸리에 변환을 이용하여 문제를 복합적분방정식으로 구성하고, 수치해석을 위해 복합적 분방정식을 제 2 종 프레드홀름 적분방정식으로 표현한다. 전기적 하중, 재료물성 치의 변화율, 각 접합층의 두께가 균열의 과도응답에 미치는 영향을 보기 위해 동에너지 해방률에 대한 수치해석 결과를 제시한다.

• 한국표면공학회지
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• 제50권5호
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• pp.360-365
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• 2017

In this study, ion release and biocompatibility of sintered Ni-Cr-Ti alloy for dental prosthodontics have been researched by corrosion and cell culture test. The microstructures of the alloys were observed by optical microscope, and corrosion behavior was investigated using potentiostat (Model PARSTAT 2273, EG&G, USA). Cell culture was carried out using hGf cell in DMEM (Welgene Inc., South Korea) supplemented with 10% fetal bovine serum (FBS) (Welgene Inc., South Korea) and antibiotic antimycotic solution (Welgene Inc., South Korea). After corrosion and cell culture test, surface morphologies were observed by field-emission scanning electron microscopy. For wettability behaviors, contact angles were measured by wettability test. As the content of Ti increased, the number of pit decreased and the corrosion resistance was improved from anodic polarization test, also, polarization resistance of samples containing Ti remarkably improved as compared with the alloy not containing Ti. The sintered alloy showed a low contact angle due to the pores formed on the surface. The addition of Ti element showed that the cell survival rate was better than that of the control group.

• Journal of Mechanical Science and Technology
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• 제18권9호
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• pp.1500-1511
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• 2004

In this paper, the anti-plane transient response of a central crack normal to the interface between a piezoelectric ceramics and two same elastic materials is considered. The assumed crack surfaces are permeable. By virtue of integral transform methods, the electro elastic mixed boundary problems are formulated as two set of dual integral equations, which, in turn, are reduced to a Fredholm integral equation of the second kind in the Laplace transform domain. Time domain solutions are obtained by inverting Laplace domain solutions using a numerical scheme. Numerical values on the quasi-static stress intensity factor and the dynamic energy release rate are presented to show the dependences upon the geometry, material combination, electromechanical coupling coefficient and electric field.

• 한국기계가공학회지
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• 제20권3호
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• pp.16-23
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• 2021

The fracture characteristic of the bonded interface under the application of a sliding load to a double cantilevered specimen manufactured using lightweight material was examined. Inhomogeneously bonded materials such as Al6061-T6, CFRP, and CFRP-Al were employed. In the experiment, the specimen was loaded on both directions by applying a shearing load to the bonding interface. The experimentally obtained stress, specific strength and energy release rate values were examined. CFRP exhibited excellent specific strength. The experimental results demonstrated that the inhomogeneous bonded material CFRP-Al exhibited an overall high performance in comparison with the single materials.

• 대한기계학회논문집A
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• 제25권6호
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• pp.949-958
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• 2001

A semi-infinite interfacial crack propagated with constant velocity in two bonded anisotropic strips under out-of-plane clamped displacements is analyzed. Using Fourier integral transform the problem is formulated and the Wiener-Hopf equation is derived. By solving this equation the asymptotic stress and displacement fields near the crack tip are obtained, where the results get more general expressions applicable not only to isotropic/orthotropic materials but also to the extent of the anisotropic material having one plane of elastic symmetry for the interfacial crack. The dynamic stress intensity factor is obtained as a closed form, which is decreased as the velocity of crack propagation increases. The critical velocity where the stress intensity factor comes to zero is obtained, which agrees with the lower value between the critical values of parallel crack merged in the material 1 and 2 adjacent to the interface. Using the near tip fields of stresses and displacements, the dynamic energy release rate is also obtained as a form of the stress intensiy factor.

• Journal of Mechanical Science and Technology
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• 제16권2호
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• pp.165-174
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• 2002

In the present study, interfacial cracks between an isotropic and orthotropic material, subjected to static far field tensile loading are analyzed using the technique of photoelasticity. The fracture parameters are extracted from the full-field isochromatic data and the same are compared with that obtained using boundary collocation method. Dynamic photoelasticity combined with high-speed digital photography is employed for capturing the isochromatics in the case of propagating interfacial cracks. The normalized stress intensity factors for static cracks are greate. when ${\alpha}$: 90$^{\circ}$(fibers perpendicular to the interface) than when ${\alpha}$=0$^{\circ}$(fibers parallel to the interface), and those when ${\alpha}$=90$^{\circ}$are similar to ones of isotropic material. The dynamic stress intensity factors for interfacial propagating cracks are greater when ${\alpha}$=0$^{\circ}$ than ${\alpha}$=90$^{\circ}$. For the velocity ranges (0.1 < C/C$\sub$s1/<0.7) observed in this study, the complex dynamic stress intensity factor │K$\sub$D/│increases with crack speed c, however, the rate of increase of │K$\sub$D/│with crack speed is not as drastic as that reported for homogeneous materials.

• 한국표면공학회지
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• 제32권6호
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• pp.647-657
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• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, black-oxide layer was formed on the leadframe surface by chemical oxidation of leadframe, and then oxidized leadframe sheets were molded with EMC and machined to form SDCB (Sandwiched Double-Cantilever Beam) and SBN (Sandwiched Brazil-Nut) specimens. SDCB and SBN specimens were designed to measure the adhesion strength between leadframe and EMC in terms of critical energy-release rate under quasi-Mode I ($G_{IC}$ ) and mixed Mode loading ($G_{C}$ /) conditions, respectively. Results showed that black-oxide treatment of Cu-based leadframe initially introduced pebble-like X$C_2$O crystals with smooth facets on its surface, and after the full growth of $Cu_2$O layer, acicular CuO crystals were formed atop of the $Cu_2$O layer. According to the result of SDCB test, $Cu_2$O crystals on the leadframe surface did not increase ($G_{IC}$), however, acicular CuO crystals on the $Cu_2$O layer enhanced $G_{IC}$ considerably. The main reason for the adhesion improvement seems to be associated with the adhesion of CuO to EMC by mechanical interlocking mechanism. On the other hand, as the Mode II component increased, $G_{C}$ was increased, and when the phase angle was -34$^{\circ}$, crack Kinking into EMC was occured.d.