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Static and Dynamic Fracture Analysis for the Interface Crack of Isotropic-Orthotropic Bimaterial  

Lee, Kwang-Ho (Department of Mechanical Engineering, Sangju National University)
Arun Shukla (Department of Mechanical Engineering and Applied Mechanics, University of Rhode Island)
Venkitanarayanan Parameswaran (Department of Mechanical Engineering and Applied Mechanics, University of Rhode Island)
Vijaya Chalivendra (Department of Mechanical Engineering and Applied Mechanics, University of Rhode Island)
Hawong, Jae-Sug (Department of Mechanical Engineering, Yeoungnam University)
Publication Information
Journal of Mechanical Science and Technology / v.16, no.2, 2002 , pp. 165-174 More about this Journal
Abstract
In the present study, interfacial cracks between an isotropic and orthotropic material, subjected to static far field tensile loading are analyzed using the technique of photoelasticity. The fracture parameters are extracted from the full-field isochromatic data and the same are compared with that obtained using boundary collocation method. Dynamic photoelasticity combined with high-speed digital photography is employed for capturing the isochromatics in the case of propagating interfacial cracks. The normalized stress intensity factors for static cracks are greate. when ${\alpha}$: 90$^{\circ}$(fibers perpendicular to the interface) than when ${\alpha}$=0$^{\circ}$(fibers parallel to the interface), and those when ${\alpha}$=90$^{\circ}$are similar to ones of isotropic material. The dynamic stress intensity factors for interfacial propagating cracks are greater when ${\alpha}$=0$^{\circ}$ than ${\alpha}$=90$^{\circ}$. For the velocity ranges (0.1 < C/C$\sub$s1/<0.7) observed in this study, the complex dynamic stress intensity factor │K$\sub$D/│increases with crack speed c, however, the rate of increase of │K$\sub$D/│with crack speed is not as drastic as that reported for homogeneous materials.
Keywords
Static and Dynamic Stress Intensity Factor; Interface Crack; Isotropic-Orthotropic Bimaterial Energy release Rate; Photoelasticity;
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