• Title/Summary/Keyword: Interface Release Rate

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Determination of Energy Release Rate of Penny-shaped Interface Crack on Bimaterial Cylinder (동전모양 균열이 존재하는 이상복합체의 에너지해방율 산정)

  • 양성철;서영찬;박종원
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.15 no.3
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    • pp.389-398
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    • 2002
  • The mixed mode problem (I and II) of a peny-shaped interface cracks in remote tension loading on a bi-material cylinder is studied using finite element method. The energy release rates for the tip of the crack in the interface were calibrated for several different moduli combinations and crack ratios using the modified crack closure integral technique and J-integral method, with numerical results obtained from a commercial finite element program. Numerical results show that non-dimensional value of$\sqrt{G_{II}E^*}/\sqrt[p]{\pi a}$ increases as the crack size or moduli ratio increases. Meanwhile, non-dimensional value of$\sqrt{G_{I}E^*}/\sqrt[p]{\pi a}$ decreases as the moduli ratio increases, but above the moduli ratio of 3 its value decreases then increases again as the crack size increases. Reliability of the numerical analysis in this study was acquired with comparison to an analytical solution for the peny-shaped interface crack in an infinite medium.

Effect of Bonding Surface Laser Patterns on Interfacial Toughness of GFRP/Al Composite (GFRP/Al 복합재료의 접합부 레이저 패턴이 계면인성에 미치는 영향)

  • Woo Yong Sim;Yu Seong Yun;Oh Heon Kwon
    • Journal of the Korean Society of Safety
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    • v.38 no.2
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    • pp.1-7
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    • 2023
  • Fiber-metal laminates (FMLs) and polymer matrix composites (PMCs) are formed in various ways. In particular, FMLs in which aluminum is laminated as a reinforced layer are widely used. Also, glass fiber-reinforced plastics (GFRPs) are generally applied as fiber laminates. The bonding interface layer between the aluminum and fiber laminate exhibits low strength when subjected to hot press fabrication in the event of delamination fracture at the interface. This study presents a simple method for strengthening the interface bonding between the aluminum metal and GFRP layer of FML composites. The surfaces of the aluminum interface layer are engraved with three kinds of patterns by using the laser machine before the hot press works. Furthermore, the effect of the laser patterns on the interfacial toughness is investigated. The interfacial toughness was evaluated by the energy release rate (G) using an asymmetric double cantilever bending specimen (ADCB). From the experimental results, it was shown that the strip type pattern (STP) has the most proper pattern shape in GFRP/Al FML composites. Therefore, this will be considered a useful method for the safety assessment of FML composite structures.

Evaluation of Fracture Behavior of Adhesive Layer in Fiber Metal Laminates using Cohesive Zone Models (응집영역모델을 이용한 섬유금속적층판 접착층의 모드 I, II 파괴 거동 물성평가)

  • Lee, Byoung-Eon;Park, Eu-Tteum;Ko, Dae-Cheol;Kang, Beom-Soo;Song, Woo-Jin
    • Composites Research
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    • v.29 no.2
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    • pp.45-52
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    • 2016
  • An understanding of the failure mechanisms of the adhesive layer is decisive in interpreting the performance of a particular adhesive joint because the delamination is one of the most common failure modes of the laminated composites such as the fiber metal laminates. The interface between different materials, which is the case between the metal and the composite layers in this study, can be loaded through a combination of fracture modes. All loads can be decomposed into peel stresses, perpendicular to the interface, and two in-plane shear stresses, leading to three basic fracture mode I, II and III. To determine the load causing the delamination growth, the energy release rate should be identified in corresponding criterion involving the critical energy release rate ($G_C$) of the material. The critical energy release rate based on these three modes will be $G_{IC}$, $G_{IIC}$ and $G_{IIIC}$. In this study, to evaluate the fracture behaviors in the fracture mode I and II of the adhesive layer in fiber metal laminates, the double cantilever beam and the end-notched flexure tests were performed using the reference adhesive joints. Furthermore, it is confirmed that the experimental results of the adhesive fracture toughness can be applied by the comparison with the finite element analysis using cohesive zone model.

Transient Response of a Crack in a Functionally Graded Piezoelectric Strip between Two Dissimilar Piezoelectric Strip (두 개의 서로 다른 압전재료층 사이의 기능경사압전재료 접합층 내부 균열에 대한 과도응답 해석)

  • Shin, Jeong Woo;Lee, Young-Shin;Kim, Sung Joon
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2013.10a
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    • pp.206-213
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    • 2013
  • Transient response of a crack in a functionally graded piezoelectric material (FGPM) interface layer between two dissimilar homogeneous piezoelectric layers under anti-plane shear is analyzed using integral transform approaches. The properties of the FGPM layer vary continuously along the thickness. Laplace and Fourier transforms are used to reduce the problem to two sets of dual integral equations, which are then expressed to the Fredholm integral equations of the second kind. Numerical values on the dynamic energy release rate (DERR) are presented for the FGPM to show the effects on electric loading, gradient of the material properties, and thickness of the layers. Computed results yield following conclusions: (a) the DERR increases with the increase of the gradient of the material properties of the FGPM layer; (b) certain direction and magnitude of the electric impact loading impedes crack extension; (c) increase of the thickness of the FGPM layer and the homogeneous piezoelectric layer which has larger material properties than those of the crack plane are beneficial to increase of the resistance of transient fracture of the FGPM layer.

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Ion Release and Biocompatibility of Sintered Ni-Cr-Ti Alloy for Dental Prosthodontics (치과보철용 Ni-Cr-Ti소결체합금의 이온용출과 생체적합성)

  • Choe, Han-Cheol;Kim, Seung-Hui
    • Journal of the Korean institute of surface engineering
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    • v.50 no.5
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    • pp.360-365
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    • 2017
  • In this study, ion release and biocompatibility of sintered Ni-Cr-Ti alloy for dental prosthodontics have been researched by corrosion and cell culture test. The microstructures of the alloys were observed by optical microscope, and corrosion behavior was investigated using potentiostat (Model PARSTAT 2273, EG&G, USA). Cell culture was carried out using hGf cell in DMEM (Welgene Inc., South Korea) supplemented with 10% fetal bovine serum (FBS) (Welgene Inc., South Korea) and antibiotic antimycotic solution (Welgene Inc., South Korea). After corrosion and cell culture test, surface morphologies were observed by field-emission scanning electron microscopy. For wettability behaviors, contact angles were measured by wettability test. As the content of Ti increased, the number of pit decreased and the corrosion resistance was improved from anodic polarization test, also, polarization resistance of samples containing Ti remarkably improved as compared with the alloy not containing Ti. The sintered alloy showed a low contact angle due to the pores formed on the surface. The addition of Ti element showed that the cell survival rate was better than that of the control group.

Transient Response of a Permeable Crack Normal to a Piezoelectric-elastic Interface: Anti-plane Problem

  • Kwon, Soon-Man;Lee, Kang-Yong
    • Journal of Mechanical Science and Technology
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    • v.18 no.9
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    • pp.1500-1511
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    • 2004
  • In this paper, the anti-plane transient response of a central crack normal to the interface between a piezoelectric ceramics and two same elastic materials is considered. The assumed crack surfaces are permeable. By virtue of integral transform methods, the electro elastic mixed boundary problems are formulated as two set of dual integral equations, which, in turn, are reduced to a Fredholm integral equation of the second kind in the Laplace transform domain. Time domain solutions are obtained by inverting Laplace domain solutions using a numerical scheme. Numerical values on the quasi-static stress intensity factor and the dynamic energy release rate are presented to show the dependences upon the geometry, material combination, electromechanical coupling coefficient and electric field.

Fracture Characteristic of Double Cantilever Beam Specimen Using Lightweight Material at Sliding Mode (미끄러짐 모드에서의 경량 재료를 이용한 이중외팔보 시험편의 파손 특성)

  • Kim, Jae-Won;Cho, Jae-Ung
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.20 no.3
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    • pp.16-23
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    • 2021
  • The fracture characteristic of the bonded interface under the application of a sliding load to a double cantilevered specimen manufactured using lightweight material was examined. Inhomogeneously bonded materials such as Al6061-T6, CFRP, and CFRP-Al were employed. In the experiment, the specimen was loaded on both directions by applying a shearing load to the bonding interface. The experimentally obtained stress, specific strength and energy release rate values were examined. CFRP exhibited excellent specific strength. The experimental results demonstrated that the inhomogeneous bonded material CFRP-Al exhibited an overall high performance in comparison with the single materials.

Dynamic Interfacial Crack in Bonded Anisotropic Strip Under Out-of-Plane Deformation (면외변형하의 이방성 띠판에 대한 동적계면균열)

  • Park, Jae-Wan;Choe, Seong-Ryeol
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.25 no.6
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    • pp.949-958
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    • 2001
  • A semi-infinite interfacial crack propagated with constant velocity in two bonded anisotropic strips under out-of-plane clamped displacements is analyzed. Using Fourier integral transform the problem is formulated and the Wiener-Hopf equation is derived. By solving this equation the asymptotic stress and displacement fields near the crack tip are obtained, where the results get more general expressions applicable not only to isotropic/orthotropic materials but also to the extent of the anisotropic material having one plane of elastic symmetry for the interfacial crack. The dynamic stress intensity factor is obtained as a closed form, which is decreased as the velocity of crack propagation increases. The critical velocity where the stress intensity factor comes to zero is obtained, which agrees with the lower value between the critical values of parallel crack merged in the material 1 and 2 adjacent to the interface. Using the near tip fields of stresses and displacements, the dynamic energy release rate is also obtained as a form of the stress intensiy factor.

Static and Dynamic Fracture Analysis for the Interface Crack of Isotropic-Orthotropic Bimaterial

  • Lee, Kwang-Ho;Arun Shukla;Venkitanarayanan Parameswaran;Vijaya Chalivendra;Hawong, Jae-Sug
    • Journal of Mechanical Science and Technology
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    • v.16 no.2
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    • pp.165-174
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    • 2002
  • In the present study, interfacial cracks between an isotropic and orthotropic material, subjected to static far field tensile loading are analyzed using the technique of photoelasticity. The fracture parameters are extracted from the full-field isochromatic data and the same are compared with that obtained using boundary collocation method. Dynamic photoelasticity combined with high-speed digital photography is employed for capturing the isochromatics in the case of propagating interfacial cracks. The normalized stress intensity factors for static cracks are greate. when ${\alpha}$: 90$^{\circ}$(fibers perpendicular to the interface) than when ${\alpha}$=0$^{\circ}$(fibers parallel to the interface), and those when ${\alpha}$=90$^{\circ}$are similar to ones of isotropic material. The dynamic stress intensity factors for interfacial propagating cracks are greater when ${\alpha}$=0$^{\circ}$ than ${\alpha}$=90$^{\circ}$. For the velocity ranges (0.1 < C/C$\sub$s1/<0.7) observed in this study, the complex dynamic stress intensity factor │K$\sub$D/│increases with crack speed c, however, the rate of increase of │K$\sub$D/│with crack speed is not as drastic as that reported for homogeneous materials.

Fracture Toughness of Leadframe/EMC Interface (리드프레임/EMC 계면의 파괴 인성치)

  • 이호영;유진
    • Journal of the Korean institute of surface engineering
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    • v.32 no.6
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    • pp.647-657
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    • 1999
  • Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, black-oxide layer was formed on the leadframe surface by chemical oxidation of leadframe, and then oxidized leadframe sheets were molded with EMC and machined to form SDCB (Sandwiched Double-Cantilever Beam) and SBN (Sandwiched Brazil-Nut) specimens. SDCB and SBN specimens were designed to measure the adhesion strength between leadframe and EMC in terms of critical energy-release rate under quasi-Mode I ($G_{IC}$ ) and mixed Mode loading ($G_{C}$ /) conditions, respectively. Results showed that black-oxide treatment of Cu-based leadframe initially introduced pebble-like X$C_2$O crystals with smooth facets on its surface, and after the full growth of $Cu_2$O layer, acicular CuO crystals were formed atop of the $Cu_2$O layer. According to the result of SDCB test, $Cu_2$O crystals on the leadframe surface did not increase ($G_{IC}$), however, acicular CuO crystals on the $Cu_2$O layer enhanced $G_{IC}$ considerably. The main reason for the adhesion improvement seems to be associated with the adhesion of CuO to EMC by mechanical interlocking mechanism. On the other hand, as the Mode II component increased, $G_{C}$ was increased, and when the phase angle was -34$^{\circ}$, crack Kinking into EMC was occured.d.

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