• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.3
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• pp.576-583
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• 2018

Silicon carbide is considered to be a potentially useful material for high-temperature electronic devices, as its band gap is larger than that of silicon and the p-type and/or n-type conduction can be controlled by impurity doping. Particularly, porous n-type SiC ceramics fabricated from ${\beta}-SiC$ powder have been found to show a high thermoelectric conversion efficiency in the temperature region of $800^{\circ}C$ to $1000^{\circ}C$. For the application of SiC thermoelectric semiconductors, their figure of merit is an essential parameter, and high temperature (above $800^{\circ}C$) electrodes constitute an essential element. Generally, ceramics are not wetted by most conventional braze metals,. but alloying them with reactive additives can change their interfacial chemistries and promote both wetting and bonding. If a liquid is to wet a solid surface, the energy of the liquid-solid interface must be less than that of the solid, in which case there will be a driving force for the liquid to spread over the solid surface and to enter the capillary gaps. Consequently, using Ag with a relatively low melting point, the junction of the porous SiC semiconductor-Ag and/or its alloy-SiC and/or alumina substrate was studied. Ag-20Ti-20Cu filler metal showed promise as the high temperature electrode for SiC semiconductors.

• Journal of Advanced Marine Engineering and Technology
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• v.37 no.4
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• pp.409-417
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• 2013

Mu-communication board supported by multi-communication is designed with Atxmega 128A1 which is a low power energy consuming of 8-bit microcontroller. ATxmega128A1 microcontroller consists of 8 UART(Universal asynchronous receiver/transmitter) ports which can be setting appropriate user interface having command line interpreter(CLI) program with each port, 2 kbytes EEPROM, 128 kbytes flash memory, 8 kbytes SRAM. 8 URAT ports are used for the multi communication modem, GPS module, etc. and EEPROM is used for saving a configuration for program running, and flash memory of 128 kbytes is used for storing a Firm Ware, and 8 kbytes SRAM is used for stack, storing memory of global variables while program running. If we uses the hybrid communication of path optimization of VHF, TRS and CDMA to remote control AtoN(aid to navigation), it is able to remove the communication shadow area. Even though there is a shadow area for individual communication method, we can select an optimum communication method. The compatibility of data has been enhanced as using of same data frame per communication devices. For the test, 8640 of data has been collected from the each buoy during 30 days in every 5 minutes and the receiving rate of the data has shown more than 99.4 %.

• Progress in Medical Physics
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• v.20 no.2
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• pp.51-61
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• 2009

A Compton camera, which is based on the geometrical interpretation of Compton scattering, is a very promising gamma-ray imaging device considering its several advantages over the conventional gamma-ray imaging devices: high imaging sensitivity, 3-D imaging capability from a fixed position, multi-tracing functionality, and almost no limitation in photon energy. In the present study, a Monte Carlo-based, user-friendly Compton imaging simulator was developed in the form of a graphical user interface (GUI) based on Geant4 and $MATLAB^{TM}$. The simulator was tested against the experimental result of the double-scattering Compton camera, which is under development at Hanyang University in Korea. The imaging resolution of the simulated Compton image well agreed with that of the measured image. The imaging sensitivity of the measured data was 2~3 times higher than that of the simulated data, which is due to the fact that the measured data contains the random coincidence events. The performance of a stacking-structure type Compton camera was evaluated by using the simulator. The result shows that the Compton camera shows its highest performance when it uses 4 layers of scatterer detectors.

• Journal of Microbiology and Biotechnology
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• v.16 no.6
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• pp.901-910
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• 2006

Poly(3-hydroxybutyrate) [P(3HB)] is a microbial polyester intracellularly accumulated as distinct granules in numerous microorganisms as an energy and carbon storage material. Recombinant Escherichia coli harboring the heterologous P(3HB) biosynthesis genes accumulates large amounts of P(3HB) granules, yet the granule-associated proteins have not been identified. Therefore, this study reports on an analysis of the P(3HB) granule-associated proteome in recombinant E. coli. Fiye proteins out of 7 spots identified were found to be involved in functions of translation, heat-stress responses, and P(3HB) biosynthesis. Two of the major granule-associated proteins, IbpA/B, which are already known to bind to recombinant proteins forming inclusion bodies in E. coli, were further analyzed. Immunoblotting and immunoelectron microscopic studies with IbpA/B antibodies clearly demonstrated the binding and localization of IbpA/B to P(3HB) granules. IbpA/B seemed to play an important role in recombinant E. coli producing P(3HB) by stabilizing the interface between the hydrophobic P(3HB) granules and the hydrophilic cytoplasm. Thus, IbpA/B were found to act like phasins in recombinant E. coli, as they are the major proteins bound to the P(3HB) granules, affect the morphology of the granules, and reduce the amount of cytosolic proteins bound to the P(3HB) granules.

• Korean Journal of Materials Research
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• v.8 no.7
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• pp.648-652
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• 1998

TIG remelting was performed to harden the surface of automobile earn shaft. Multipass remelting was conducted in longitudinal direction under argon gas atmosphere. The microstructure of as-east earn shaft was gray iron which consisted of flake graphite and pearlitic matrix. The remelted area had microstructue of both fine pearlite and ledeburite structure that consisted of globular austenite and $Fe_3C$. Hardness for as-cast earn shaft had HRc 25~28, however it increased at remelted area to HRc 53~55. Black line was found at heat affected zone next to the fusion line, that is remelt area of previous pass, during multipass remelting. Black line was identified as graphite, which was transformed from $Fe_3C$. in the ledeburite structure. It is observed that all graphites were nucleated at $Fe_3C$. and matrix interface. High density energy laser remelting process was also applied to verify whether black line could be eliminated. However, black line was still existed as observed in TIG remelting process. Regraphitization was simulated on the ledeburitic structure specimen using Gleeble 1500 with conditions of 1100 and 100$0^{\circ}C$ for 0.5, I, 3, 5 and 1Osee. From the fact that graphite was formed even at the simulation condition of 100$0^{\circ}C$ for 0.5sec, it is seen that regraphitization is an inevitable phenomenon generated whatever processes used during multipass overlap remelting.

• Korean Journal of Materials Research
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• v.11 no.8
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• pp.671-678
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• 2001

All solid-state thin film micro supercapacitor, which consists of $RuO_2$/LiPON/$RuO_2$ multi layer structure, was fabricated on Pt/Ti/Si substrate using a $RuO_2$ electrode. Bottom $RuO_2$ electrode was grown by dc reactive sputtering system with increasing $O_2/[Ar+O_2]$ ratio at room temperature, and a LiPON electrolyte film was subsequently deposited on the bottom $RuO_2$ electrode at pure nitrogen ambient by rf reactive sputtering system. Room temperature charge-discharge measurements based on a symmetric $RuO_2$/LiPON/$RuO_2$ structure clearly demonstrates the cyclibility dependence on the microstructure of the $RuO_2$ electrode. Using both glancing angle x-ray diffraction (GXRD) and transmission electron microscopy (TEM) analysis, it was found that the microstructure of the $RuO_2$ electrode was dependent on the oxygen flow ratio. In addition, x- ray photoelectron spectroscopy(XPS) examination shows that the Ru-O binding energy is affected by increasing oxygen flow ratio. Furthermore, TEM and AES depth profile analysis after cycling demonstrates that the interface layer formed by interfacial reaction between LiPON and $RuO_2$ act as a main factor in the degradation of the cyclibility of the thin film micro-supercapacitor.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.2 s.31
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• pp.23-28
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• 2004

We utilized Ag capping layer for fluxless bonding. To investigate the effect of Ag capping layer, two sets of sample were used. One set was bare In and Sn solders. The other set was In and Sn solders with Ag capping layer. In ($10{\mu}m$) and Sn ($10{\mu}m$) solders were deposited on Cu/Ti/Si substrate using thermal-evaporation, and Ag ($0.1{\mu}m$) capping layers were deposited on In and Sn solders. Solder joints were made by joining two In and Sn deposited specimens at $130^{\circ}C$ for 30 s under 0.8, 1.6, 3.2 MPa using thermal compression bonder. The contact resistance was measured using four-point probe method. The shear strength of the solder joints was measured by the shear test of cross-bar sample in the direction. The microstructure of the solder joints was characterized with SEM and EDS. In and Sn solders without Ag capping layers were only bonded at $130^{\circ}C$ under high bonding pressure. Also the shear strength of the In-Sn solder joints under was lower than that of the Ag/In-Ag/Sn solder joints. The resistance of the solder joints was $2-4\;m{\Omega}$ The solder joints consisted of In-rich phase and Sn-rich phase and the intermixed compounds were found at the interface. As bonding pressure increased, the intermixed compounds formed more.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.59-64
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• 2013

In-situ annealing tests of Cu/Ni/Au/Sn-Ag/Cu micro-bump for 3D IC package were performed in an scanning electron microscope chamber at $135-170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). The IMC growth behaviors of both $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ follow linear relationship with the square root of the annealing time, which could be understood by the dominant diffusion mechanism. Two IMC phases with slightly different compositions, that is, $(Cu,Au^a)_6Sn_5$ and $(Cu,Au^b)_6Sn_5$ formed at Cu/solder interface after bonding and grew with increased annealing time. By the way, $Cu_3Sn$ and $(Cu,Au^b)_6Sn_5$ phases formed at the interfaces between $(Cu,Ni,Au)_6Sn_5$ and Ni/Sn, respectively, and both grew with increased annealing time. The activation energies for $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ IMC growths during annealing were 0.69 and 0.84 eV, respectively, where Ni layer seems to serve as diffusion barrier for extensive Cu-Sn IMC formation which is expected to contribute to the improvement of electrical reliability of micro-bump.

• Journal of Dental Rehabilitation and Applied Science
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• v.22 no.2
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• pp.125-136
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• 2006

Statement of problem. The success of the bonding between electroforming gold and resin is dependent on the surface-conditioning technique but its effective technique has net been studied widely. Purpose. The purpose of the study was to evaluate the bond strength between the electroforming gold and resin with varying the surface-conditioning technique. Materials and methods. Sixty rectangular shaped metal specimens were made and one side of each specimen were gold hard plated. The sand-blasted specimens were divided into four experimental groups with fifteen specimens in each group and were treated as follows. Group 1: Silicoating (Rocatec, 3M ESPE)+ Sinfony (3M ESPE), Group 2: SR Link+ SR Adoro (Ivoclar Vivadent), Group 3: Tin plating (Microtin, Danville Engineering)+ SR Link+ SR Adoro, Group 4: Tin plating (Micro tin, Danville Engineering)+ Silicoating (Rocatec)+ Sinfony. Shear bond strength at metal-resin interface were measured using universal testing machine. Energy Dispersive x-ray analysis was done and scanning electron microscope images were taken and observed. Results and Conclusion. The following conclusions were drawn. 1. The mean shear bond strength values in order were 11.69MPa (Group 2), 22.35MPa (Group 3), 22.40MPa (Group 1) and 27.71MPa (Group 4). There was no significant difference in Group 1, Group 3 and Group 4(P>0.05). 2. In the EDX line analysis, the Au was detected on the surface of all specimen. $SnO_2$ showed on the surface of Group 2 and $SiO_2$ was detected on the surface of Group 1. 3. Increasing of roughness by sandblasting(Group 2), formation of micro-irregularities and tin crystals by electrolytic tin plating(Group 3) and formation of surface irregularities and $SiO_2$ layer(Group 1,4) were observed in SEM photo. 4. Tin plating(Group 3) and Rocatec treatment(Group 1) showed clinically effective shear bond strength(>20MPa), but when the two surface conditioning method were used together higher bond strength were achieved.

• International Journal of Internet, Broadcasting and Communication
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• v.12 no.2
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• pp.8-14
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• 2020

Recently, there was an increasing demand for an integrated access control system which is capable of user recognition, door control, and facility operations control for smart buildings automation. The market available door lock access control solutions need to be improved from the current level security of door locks operations where security is compromised when a password or digital keys are exposed to the strangers. At present, the access control system solution providers focusing on developing an automatic access control system using (RF) based technologies like bluetooth, WiFi, etc. All the existing automatic door access control technologies required an additional hardware interface and always vulnerable security threads. This paper proposes the user identification and authentication solution for automatic door lock control operations using camera based visible light communication (VLC) technology. This proposed approach use the cameras installed in building facility, user smart devices and IoT open source controller based LED light sensors installed in buildings infrastructure. The building facility installed IoT LED light sensors transmit the authorized user and facility information color grid code and the smart device camera decode the user informations and verify with stored user information then indicate the authentication status to the user and send authentication acknowledgement to facility door lock integrated camera to control the door lock operations. The camera based VLC receiver uses the artificial intelligence (AI) methods to decode VLC data to improve the VLC performance. This paper implements the testbed model using IoT open-source based LED light sensor with CCTV camera and user smartphone devices. The experiment results are verified with custom made convolutional neural network (CNN) based AI techniques for VLC deciding method on smart devices and PC based CCTV monitoring solutions. The archived experiment results confirm that proposed door access control solution is effective and robust for automatic door access control.