• 한국재료학회지
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• 제20권6호
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• pp.319-325
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• 2010

3-D IC integration enables the smallest form factor and highest performance due to the shortest and most plentiful interconnects between chips. Direct metal bonding has several advantages over the solder-based bonding, including lower electrical resistivity, better electromigration resistance and more reduced interconnect RC delay, while high process temperature is one of the major bottlenecks of metal direct bonding because it can negatively influence device reliability and manufacturing yield. We performed quantitative analyses of the interfacial properties of Al-Al bonds with varying process parameters, bonding temperature, bonding time, and bonding environment. A 4-point bending method was used to measure the interfacial adhesion energy. The quantitative interfacial adhesion energy measured by a 4-point bending test shows 1.33, 2.25, and $6.44\;J/m^2$ for 400, 450, and $500^{\circ}C$, respectively, in a $N_2$ atmosphere. Increasing the bonding time from 1 to 4 hrs enhanced the interfacial fracture toughness while the effects of forming gas were negligible, which were correlated to the bonding interface analysis results. XPS depth analysis results on the delaminated interfaces showed that the relative area fraction of aluminum oxide to the pure aluminum phase near the bonding surfaces match well the variations of interfacial adhesion energies with bonding process conditions.

• Restorative Dentistry and Endodontics
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• 제19권2호
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• pp.641-654
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• 1994

This study was executed to evaluate adaptability of dentin bonding agents to dentinal wall with measuring contraction gap on interface between cavity wall and composite resin by SEM study. 6 kinds of dentin bonding agents were investigated for this study : Gluma, Super Bond C & B, All bond 2, Scotchbond multipurpose, Scotchbond 2 and Clearfil photo bond. 30 of fresh extracted teeth were randomly selected and divided into 6 groups with each 5. The round shaped cavities with 3mm dia. and 1.5mm depth were prepared on cementoenamel junction of buccal surface of teeth. Dentin bonding agents were applied to cavity wall and then the composite resin was filled in the cavity. Specimens were sectioned longitudinally on buccal surface. Sectioned aspects of specimens were impressioned with rubber base materials and finally precise replica were made of epoxy resin poured in negative impression. Contraction gaps were examined on interface between cavity wall and composite resin under condition of 200 and 2000 magnification of SEM. The results were as follows. 1. There were no gap on interface between enamel and composite resin in all specimens, but gaps were mainly exhibited on apical side of lateral wall of dentin of cavity. 2. In Gluma, 2 cases of 5 specimens exhibited excellent adaptation to the cavity wall, indicating no gaps on interface between cavity wall and composite resin. The other specimens showed gaps with range of $0{\sim}15{\mu}m$ width. 3. In Super Bond C & B, gaps with range of $0{\sim}10{\mu}m$ width were mainly exhibited on apical side of lateral wall of dentin of cavity. 4. In All bond 2, all specimens showed the most exellent adaptation to cavity wall when compared to the other materials, indicating no gap interface between cavity wall and composite resin. 5. In Scotchbond multipurpose, gaps with range of $0{\sim}10{\mu}m$ width were locally located on cavity wall. 6. In Scotchbond 2, all specimens showed great amount of gap with range of $5{\sim}25{\mu}m$, indicating the worst adaptation to cavity wall compared to the other materials. 7. In Clearfil photo bond, 2 case of 5 specimens exhibited exellent adaptation to cavity wall, indicating no gap. the other specimens showed gap with range of $0{\sim}15{\mu}m$ width on inferface between cavity wall and composite resin.

• 접착 및 계면
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• 제7권4호
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• pp.60-64
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• 2006

In modern vehicle construction the search for means of weight reduction, improving durability, increasing comfort and raising body stiffness are issues of priority to the design engineer. The intelligent usage of many materials such as high strength steel, light-alloys and plastics enables a significant vehicle weight reduction to be achieved. The classical joining techniques used in the automobile industry need to be newly-evaluated since they often do not present workable solutions for such mixed-material connections, for example aluminium/steel. Calculation/simulation methods have made progress as a key factor for broader and more cost-effective implementation of structural bonding. This will lead to reduction of spotwelds and accelerate the car development. A special focus of the paper is the use of high strength steel grades. It will be shown that adhesive bonding is a key tool for yielding the potential of advanced high strength steel for low gauging without compromising the stiffness. The latest status of adhesive development has been described. Improvements with physical strength and glass temperature as well as of process relevant properties are shown. Also the situation regarding occupational hygiene is treated, showing that by further spotweld point reduction the emission around the working area can be even lowered against the current praxis. High performing lightweight design cannot longer do without high performing crash durable adhesives.

• Advances in materials Research
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• 제6권3호
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• pp.245-255
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• 2017

High energy ball milling is employed to produce iron matrix- multiwall carbon nanotube (MWCNT) reinforced composite. The damage caused to MWCNT due to harsh ball milling condition and its influence on interfacial bonding is studied. Different amount of MWCNT is used to find the optimal percentage of MWCNT for avoidance of the formation of chemical reaction product at the matrix - reinforcement interface. Effect of process control agent is assessed by the use of different materials for the purpose. It is observed that ethanol as a process control agent (PCA) causes degradation of MWCNT reinforcements after milling for two hours whereas solid stearic acid used as process control agent, allows satisfactory conservation of MWCNT structure. It is further noted that at a high MWCNT content (~ 2wt.%), high energy ball milling leads to reaction of iron and carbon and forms iron carbide (cementite) at the iron-MWCNT interface. At low percentage of MWCNT, dissolution of carbon in iron takes place and the amount of reinforcement in iron matrix composite becomes negligibly small. However, under the present ball milling condition (ball to metal ratio~ 6:1 and 200 rpm vial speed) iron-1wt.% MWCNT composite of good interfacial bonding can retain the tubular structure of reinforcing MWCNT.

• 접착 및 계면
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• 제23권4호
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• pp.101-107
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• 2022

Adhesive joints have many advantages such as weight savings, corrosion and fatigue resistance and now developed even withstand of high impact and dynamic loads. However, an adhesion has cumbersome and complicated surface preparation processes. The surface preparation step is critical in adhesive joint manufacturing in order to obtain the prescribed strength for adhesive joints. In this study, it was attempted to simplify and reduce the number of surface preparation steps, and abrasion and rapid adhesive application (ARAA) process is developed for an alternative solution. The abrasion processes are performed only for creating surface roughness in standard procedures (SP), although the abrasion processes cause surface activation itself. The results showed that there is no need the long procedures in laboratory or chemical agents for adhesion. After the abrasion process, the attracted and highly reactive fresh surface layer obtained, and its effect on bonding success is observed and analyzed in this research, in light of the essential physic and adhesion theories. Al 6061 aluminum adherends and epoxy-based adhesives were chosen for bonding processes, which is mostly used in light vehicle parts. The adherends were cleaned, treated and activated only with abrasion, and after the adhesive application the specimens were tested under quasi-static loading. The satisfied ARAA results were compared with that of the specimens fabricated by the standard procedure (SP) of adhesion processes of high impact loads.

• 소성∙가공
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• 제20권1호
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• pp.64-72
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• 2011

In this study, we have investigated bonding of metal and plastic parts with single planar interface. This is facilitated by surface processing of aluminum sheet, which consists of slitting and punching, followed by insert-molding of polybuthylelne terephthalate(PBT). An injection mold has been built to fabricate specimen. After processing of the specimen, tensile and bending shear adhesion tests have been fulfilled according to KS M3734 and KS M3723, respectively. We also have conducted simulation of tensile and bending shear adhesion tests. Based on the tests results, the proposed bonding method outperforms existing methods based on adhesion.

• 한국펄프종이공학회:학술대회논문집
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• 한국펄프종이공학회 2006년도 PAN PACIFIC CONFERENCE vol.2
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• pp.423-426
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• 2006

Paper has fibers and fines network structure and it is strongly affected by interface bonding between fibers. Depending on the inter-fiber bonding, paper bulk is determined. Fines play an important roll in Campbell and consolidation effect through wet pressing and drying operations. Refined Sw-BKP, Hw-BKP and BCTMP fines were used to investigate the fines effect. Wet-web strength, breaking length, scattering coefficient, and hydrodynamic specific volume were measured. According to the result of experiments, chemical and morphological compositions of fines do not strongly affect to wet-web forming, but strongly affect to drying operations which form hydrogen bonding among fiber-fines-fiber matrixes. Paper bulk should be controlled by the extent of hydrogen bonding between fibers during drying operations.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 춘계학술대회 논문집
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• pp.411-414
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• 1998

In this paper, the silicon-nitride membrane structure for IR sensor was fabricated through the etching and the direct bonding. The PT layer as a IR detection layer was deposited on the membrane and its characteristics were measured. The attack of PT layer during the etching of silicon wafer as well as the thermal isolation of the IR detection layer can be solved through the method of bonding/etching of silicon wafer. Because the PT layer of c-axial orientation rained thermal polarization without polling, the more integration capability can be achieved. The surface roughness of the membrane was measured by AFM, the micro voids and the non-contacted area were inspected by IR detector, and the bonding interface was observed by SEM. The polarization characteristics and the dielectric characteristics of the PT layer were measured, too.

• 마이크로전자및패키징학회지
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• 제30권1호
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• pp.55-62
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• 2023

본 연구에서는 서로 다른 Pore per inch (PPI, 1 inch 당 pore의 수)를 갖는 Ni-foam 사이에 Sn-3.0Ag-0.5Cu(wt.%, SAC305) 솔더 침지 공정을 수행하여 Ni-foam/SAC305 복합 솔더를 제조한 후, 이를 천이액상 확산 접합(Transient liquid Phase bonding, TLP bonding) 공정에 적용하여 형성된 접합부의 미세구조 분석 및 기계적 특성 평가가 수행되었다. 제조된 Ni-foam/SAC305 복합 솔더 프리폼 (Solder preform)은 Ni-foam 및 SAC305로 구성되었으며, Ni-foam 계면에는 (Ni,Cu)₃Sn₄ 조성의 금속간 화합물이 형성되었다. TLP 접합 공정 수행 시, Ni-foam 계면의 금속간 화합물은 (Ni,Cu)₃Sn₄+Au로 변환 되었으며, 접합 시간이 증가할수록 Ni-foam과 SAC305가 지속적으로 반응하면서 접합부는 금속간 화합물로 변환되었다. 130 PPI Ni-foam/SAC305 복합 솔더 접합부가 가장 빠른 속도로 금속간 화합물로 변화되는 것을 확인하였다. 기계적 특성에 미치는 Ni-foam의 영향을 확인하기 위해 전단 시험 수행 결과, TLP 접합 초기에 모든 조건의 솔더 접합부는 50 MPa 이상의 우수한 기계적 특성을 나타내었으며, 접합 시간이 증가할수록 전단 강도는 증가하는 경향을 나타내었다.

• Journal of Welding and Joining
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• 제29권6호
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• pp.65-70
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• 2011

The effect of flip chip bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip chip bonding temperature was performed at $260^{\circ}C$ and $300^{\circ}C$ with various bonding times of 5, 10, and 20 sec. AuSn, $AuSn_2$ and $AuSn_4$ IMCs were formed at the interface of joints and (Au, Cu)$_6Sn_5$ IMC was observed near Cu pad side in the joint. At bonding temperature of $260^{\circ}C$, $AuSn_4$ IMC was dominant in the joint compared to other Au-Sn IMCs as bonding time increased. At bonding temperature of $300^{\circ}C$, $AuSn_2$ IMC clusters, which were surrounded by $AuSn_4$ IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between $AuSn_2$ and $AuSn_4$ IMCs regardless bonding conditions.