• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.374-375
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• 2006

This paper describes anodic bonding characteristics of MCA to Si-wafer using evaporated Pyrex #7740 glass thin-films for MEMS applications. Pyrex #7740 glass thin-films with the same properties were deposited on MCA under optimum RF sputter conditions (Ar 100 %, input power $1\;W/cm^2$). After annealing at $450^{\circ}C$ for 1 hr, the anodic bonding of MCA to Si-wafer was successfully performed at 600 V, $400^{\circ}C$ in $110^{-6}$ Torr vacuum condition. Then, the MCA/Si bonded interface and fabricated Si diaphragm deflection characteristics were analyzed through the actuation and simulation test. It is possible to control with accurate deflection of Si diaphragm according to its geometries and its maximum non-linearity being 0.05-0.08 %FS. Moreover, any damages or separation of MCNSi bonded interfaces did not occur during actuation test. Therefore, it is expected that anodic bonding technology of MCNSi-wafers could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

• Korean Journal of Materials Research
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• v.34 no.3
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• pp.125-137
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• 2024

Composite laminates are used in a wide range of applications including defense, automotive, aviation and aerospace, marine, wind energy, and recreational sporting goods. These composite beams still exhibit problems such as buckling, local deformations, and interlaminar delamination. To overcome these drawbacks, a novel viscoelastic autoclave bonding with tapered epoxy reinforcement polyurethane films is proposed. In existing laminates, compression face wrinkling and interlaminar delamination is caused in the sandwich beam. The unique viscoelastic autoclave spunbond interlayer bonding is designed to prevent face wrinkling and absorb and distribute stresses induced by external loads, thereby eliminating interlaminar delamination in the sandwich beam. Also, the existing special reinforcement causes stress concentrations, and the core is not effectively connected, which directly affects the stiffness of the beam. To address this, a novel tapered epoxy polyurethane reinforcement adhesive film is proposed, whose reinforcement thickness gradually tapers as it enters the core material. This minimizes stress concentrations at the interface, preventing excessive adhesive squeeze-out during the bonding process, and improves the stiffness of the beam. Results indicate the proposed model avoids the formation of micro cracks, interlaminar delamination, buckling, and local deformations, and effectively improves the stiffness of the beam.

• Transactions of Materials Processing
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• v.20 no.2
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• pp.140-145
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• 2011

The aim of the present study is to derive optimized post heat treatment temperatures to get a proper formability for Ti/STS409L/Ti clad materials. These clad materials were fabricated by cold rolling followed by a post heat treatment process for 10 minutes at temperatures ranging from $500^{\circ}C$ to $850^{\circ}C$. The microstructure of the interface was observed using a Scanning Electron Microscope(SEM) and an Energy Dispersive X-ray Analyser(EDX) in order to investigate the effects of post heat treatment on the bonding properties of the Ti/STS409L/Ti clad materials. Diffusion bonding was observed at the interfaces with a diffusion layer thickness increasing with the post heat treatment temperature. The diffusion layer was composed of a type of(${\varepsilon}+{\zeta}$) intermetallic compound containing additional elements, namely, Fe, Ti and Ni. The micro Knoop hardness of the Ti/STS409L interfaces was found to increase with heat treatment up to $800^{\circ}C$ and then decrease for temperatures rising up to $850^{\circ}C$. The tensile strength was shown to decrease for heat treatment temperature increasing to $750^{\circ}C$ and then increase rapidly for temperature rising up to $850^{\circ}C$. A post heat treatment temperature range of $700{\sim}750^{\circ}C$ was found to optimize the formability of Ti/STS409L/Ti clad materials.

• The korean journal of orthodontics
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• v.12 no.2
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• pp.139-144
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• 1982

As adhesive systems were improved, a great variety of bracket bases were available. The purpose of this study was to evaluate the adhesive porperties of 3 types of direct-bonding brackets by testing the tensile stremgth. 60 noncarious premolars extracted for orthodontic treatment were used. The tensile strength was tested by Tensilon/UTM-1-10000C after 24 hours from bonding. Following results were obtained; There was no difference between the tensile strength of foil-mesh base bracket and photoetched base bracket statisstically. However, the accurate test result of plastic bracket could not be obtained due to the distortion of bracket wing during testing. Of the failure in fail-mesh base bracket and photo-etched base bracket, the combination type of failure, where part of the adhesive remained on the tooth and part on the bracket was the most common type (50%, 50%), The second type of failure occured at the bracket-adhesive interface (30%, 35%) and the last type of failure occured at the adhesive-tooth interface (20%, 15%).

• Journal of Adhesion and Interface
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• v.17 no.3
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• pp.104-109
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• 2016

Compare AC corona and DC corona treatment effects, polyester fabrics were AC corona treated with different current intensity (5, 10, 15 A) and feeding speed (5, 10, 15 m/min) as the same DC corona treatment conditions of the preceding research. We confirmed the surface change of polyester fabrics using scanning electron microscopy (SEM) and X-ray photoelectron spectrometer (XPS), and the change of physical properties through measuring the dry and wet bonding strength. The surface changes of polyester fabrics by treating in air atmosphere with AC corona discharge are shown similar tendency with DC corona discharge. Generally dry bonding strength were increased with increasing current intensity and feeding speed, but wet bonding strength were increased with increasing current intensity and decreasing feeding speed in both AC and DC corona treatment. When the current is 20 A, carbonization occurs in DC corona discharge but carbonization does not occur in DC corona discharge.

• Journal of the Korean Vacuum Society
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• v.14 no.2
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• pp.91-96
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• 2005

The silicon-on-insulator (SOI) wafer fabrication technique has been developed by using ion-cut process, based on proton implantation and wafer bonding techniques. It has been shown by SRIM simulation that 65keV proton implantation is required for a SOI wafer (200nm SOI, 400nm BOX) fabrication. In order to investigate the optimum proton dose and primary annealing condition for wafer splitting, the surface morphologic change has been observed such as blistering and flaking. As a result, effective dose is found to be in the $6\~9\times10^{16}\;H^+/cm^2$ range, and the annealing at $550^{\circ}C$ for 30 minutes is expected to be optimum for wafer splitting. Direct wafer bonding is performed by joining two wafers together after creating hydrophilic surfaces by a modified RCA cleaning, and IR inspection is followed to ensure a void free bonding. The wafer splitting was accomplished by annealing at the predetermined optimum condition, and high temperature annealing was then performed at $1,100^{\circ}C$ for 60 minutes to stabilize the bonding interface. TEM observation revealed no detectable defect at the SOI structure, and the interface trap charge density at the upper interface of the BOX was measured to be low enough to keep 'thermal' quality.

• Journal of Korea Foundry Society
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• v.32 no.1
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• pp.50-56
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• 2012

Fusion bonding of cast iron and Al alloy is an effective way to improve the properties such as low inertia, high efficiency and corrosion resistance in machinery parts. In case of fusion bonding, intermetallic compound layers are formed at the interface between cast iron and Al alloy interface. It is important to control the intermetallic compound layers for improving bonding strength. The formation behavior of intermetallic compound layer by heat treatment has been investigated. Heat treatment was performed at temperature from $600^{\circ}C$ to $800^{\circ}C$ with $100^{\circ}C$ interval for an hour to investigate the phase transformation during heat treatment. Heat treated specimens were analyzed by using FE-SEM, EPMA and EDS. The EPMA/WDS results revealed that various phases were formed at the interface, which exhibited 4 distinct intermetallic compound layers such as ${\tau}_6-Al_{4.5}FeSi$, ${\tau}_2-Al_3FeSi$, ${\tau}_{11}-Al_5Fe_2Si $and ${\eta}-Al_5Fe_2$. Also, fine precipitation of ${\tau}_1-Al_2Fe_3Si_3$ phase was formed between ${\tau}_{11}$ and ${\eta}$ layer. The phase fraction in intermetallic compound layer was changed by heat treatment temperature. At $600^{\circ}C$, intermetallic compound layer of ${\tau}_6$ phase was mainly formed with increasing heat treatment time. With increasing heat treatment temperature to $800^{\circ}C$, however, ${\tau}_2$ phase was mainly distributed in intermetallic compound layer. ${\tau}_1$ phase was remarkably decreased with increasing heat treatment time and temperature.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.4
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• pp.413-420
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• 2012

An aluminum foil-laminated sheet is a laminated steel sheet on which aluminum foil is adhesively bonded. It is usually used on the outer panel of home appliances to provide an aluminum feeling and appearance on the surface of the product. The delamination of aluminum foil is one of the main problems during the stretch forming process. The purpose of this study is was to determine the delamination limit of an aluminum foil-laminated sheet in the stretch forming process. The delamination was dependent on the bonding strength between aluminum foil and steel sheet. The fracture behavior of the interface between the aluminum foil and the steel sheet was described by a cohesive zone model. A finite element was conducted with the cohesive zone model to analyze the relationship between the delamination limit and the bonding strength of the interface. The interface bonding strength was evaluated by lap shear and T-peel test. The delamination limit of the aluminum foil-laminated sheet was determined by using the bonding strength of the steel sheet. The delamination limit was also verified by the Erichsen test.

• Journal of the Korean Ceramic Society
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• v.40 no.8
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• pp.784-790
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• 2003

Present investigation shows the analysis results for ceramic reinforced metal matrix composite under uniaxial transverse tensile loading. The resulting deformation, the projected damage type, and stress-strain behavior were computed depending on microstructure details such as the type of periodic reinforcement array, and the type of interface bonding. A two-dimensional finite element analysis was conducted based on the unit-cell of square, hexagonal, or diagonal periodic away For composite with strong interface bonding, the transverse stress vs. strain curve was generally increased with the increase of the ceramic volume fraction. For the composite with weakly bonded interface, however, the transverse stress vs. strain curve was reduced against the ceramic volume fraction. The decrease was caused by the interface debonding-induced stiffness reduction of the composite. For the composite of weakly bonded interface, the relative reduction rate in the final limit stress for hexagonal array was larger than that for square array. Outcome of the present study was compared favorably with the published literature data.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.299-303
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• 2001

Adherend-adhesive interface failure will occur on a macroscale when surface preparation or material quality are poor. It is well known that the stress singularity occurs at the edges of interface between the adhernds and the adhesive, and that crack will initiate from these positions. Also if bubbles are created and remained in the adhesive layer during the bonding process, the stress concentrates around these hole defects. In this paper, the effects of the hole defects on the SIF of interface crack were examined. From results, SIF increased with the hole defects near the interface crack and increased with an decreae in the upper adherend thickness, an increase in the center adhesive thickness.