• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1069-1070
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• 2008

At the coupling area linking high speed line and conventional line, according to distance between trains due to speed limit of conventional line, the power load of substation supplying to this conventional line increase. At the coupling area between Kimcheon SS and Kyoungsan SS, train operation have problems caused by instantaneous voltage drop. So, this paper propose evaluation method of maximum load capacity at current normal feeding condition.

• The Transactions of the Korean Institute of Electrical Engineers A
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• v.53 no.5
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• pp.266-274
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• 2004

This paper presents a scheme for the interconnection of dispersed generator systems(DGs) based on load .unbalance and load model in composite distribution systems. Groups of each individual load model consist of residential, industrial, commercial, official and agricultural load. The unbalance is involved with many single-phase line segment. . Voltage profile improvement and system loss minimization by installation of DGs depend greatly on how they are placed and operated in the distribution systems. So, DGs can reduce distribution real power losses and replace large-scale generators if they are placed appropriately in the distribution systems. The main idea of solving fuzzy goal programming is to transform the original objective function and constraints into the equivalent multi-objectives functions with fuzzy sets to evaluate their imprecise nature for the criterion of power loss minimization, the number or total capacity of DGs and the bus voltage deviation, and then solve the problem using genetic algorithm. The method proposed is applied to IEEE 13 bus and 34 bus test systems to demonstrate its effectiveness.

• Journal of the Semiconductor & Display Technology
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• v.10 no.2
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• pp.73-81
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• 2011

We manufactured the inkjet printing system for the application into the nano Ag finger line interconnection process in Si solar cells. The home-made inkjet printer consists of motion part for XY motion stage with optical table, head part, power and control part in the rack box with pump, and ink supply part for the connection of pump-tube-sub ink tanknozzle. The ink jet printing system has been used to conduct the interconnection process of finger lines on Si solar cell. The nano ink includes the 50 nm-diameter. Ag nano particles and the viscosity is 14.4 cP at $22^{\circ}C$. After processing of inkjet printing on the finger lines of Si solar cell, the nano particles were measured by scanning electron microscope. After the heat treatment at $850^{\circ}C$, the finger lines showed the smooth surface morphology without micropores.

• Journal of Advanced Information Technology and Convergence
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• v.10 no.1
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• pp.37-43
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• 2020

This paper presents analysis of passive metal interconnection of the LNA block in CMOS integrated circuit. The performance of circuit is affected by the geometry of RF signal path. To investigate the effect of interconnection lines, a cascode LNA is designed, and circuit simulations with full-wave electromagnetic (EM) simulations are executed for different positions of a component. As the results, the position of an external capacitor (C_ex) changes the parasitic capacitance of electric coupling; the placement of component affects the circuit performance. This analysis of interconnection line is helpful to analyze the amount of electromagnetic coupling between the lines, and useful to choose the signal path in the layout design. The target of this work is the RF LNA enabling the seamless connection of wireless data network and the following standards have to be supported in multi-band (WCDMA: 2.11~ 2.17 GHz, CDMA200 1x : 1.84~1.87 GHz, WiBro : 2.3~2.4GHz) mobile application. This work has been simulated and verified by Cadence spectre RF tool and Ansoft HFSS. And also, this work has been implemented in a 0.13um RF CMOS technology process.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.29A no.7
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• pp.64-72
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• 1992

The capacitance for three-dimensional (3D) VLSI interconnection line is calculated. Capacitance is obtained by solving integral equation that is the product of Green's function and surface charge density. Surface charge density is assumed that constant in each subarea, and subarea is devided by rectangular size in interconnetion surfaces. Up to date, so this integral method using Green's function is calculated by Fourier integral transformation, that it cannot help making an error. In this paper, it is proposed to use direct integration instead of Fourier integral method. And we proved accuracy of this paper in comparision with conventional results.

• Environmental and Resource Economics Review
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• v.17 no.3
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• pp.167-199
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• 2008

There are many successful cases in power interconnection among European and South American countries. However, that is not the case in Northeast Asian countries. Even though there will be a considerable benefit in power interconnection in Northeast Asian countries, there will be some difficulties due to various interest relationship and constraints among countries in Northeast Asia. GTMax(Generation and Transmission Maximization) Program is a very useful tool to analyze competitive electricity market and power interconnection developed by Argonne National Laboratory under the Department of Energy in the USA. This study tried to verify applicability and usefulness by GTMax model to domestic electric power system and power transfer from Russia Far East by power interconnection. When the power by importing from Russia is 2,000MW(around 2% of domestic installed capacity in 2017), there is no impact on domestic electricity market because of small power transfer. The power by importing should be large enough for achieving greater cost reduction by power interconnection. Besides, it would be better to supply power to Kyung-In region directly in reducing overall cost when the power by importing from Russia are sold at low price. In the case of interconnecting Young-Dong region, if it is not possible to upgrade transmission line with power transfer capabilities between Young-Dong and Kyung-In region, then the power by importing from Russia can replace the power produced in Jung-Bu region and the relative benefit of importing power can be reduced.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2009.10a
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• pp.223-226
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• 2009

Various database and analysis system has been used for the cost effective maintenance of distribution facility but it is not effective because of the lack of interconnection among these systems. In order to overcome this problem this paper proposes reliability centered maintenance system based on the on-line monitoring of distribution system through intelligent distribution equipment. This system is made by the interconnection of distribution automation system, asset management system, failure analysis system and failure mode effect analysis system.

• Journal of the Korean Vacuum Society
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• v.5 no.2
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• pp.161-168
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• 1996

For the improvement of microelectronic thin film interconnection materials, dielectric passivation effects on the electromigration phenomena were studied. Using Al-1%Si, various shaped patterns were fabricated and dielectric passivation layers of several structures were deposited on the $SiO_2$ layer. Lifetime of straight pattern showed 2~5 times longer than the other patterns that had various line width and area. It is believed that the flux divergence due to the structural inhomogeneity and so the current crowding effects shorten the lifetime of thin film interconnections. The lifetime of thin film interconnections seems to depend on both the passivation materials and the passivation thickness. PSG/$SiO_2$ dielectric passivation layers showed longer lifetime than $Si_3N_4$ dielectric passivation layers. This results from the PSG on $SiO_2$ layer reduces stress and from the improvement of resistance to the moisture and to the mobile ion such as sodium. This is also believed that the lifetime of thin film interconnections seems to depend on the passivation thickness in case of the same deposition materials.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.24 no.9A
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• pp.1434-1441
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• 1999

This paper presents an equivalent circuit of the hairpin line filter for accurate analysis and design. Its validity was verified by computer simulations and filter design experiments. Though the various design equations for a hairpin line filter have been proposed, there has not been a practically simplified equivalent circuit because it is hard to effectively represent interconnection effects between non-adjacent elements. In this paper, all the open ports of the hairpin line filter circuit are changed to the short ports using circuit duality, and the resulting circuits are transformed to graph model. The further simplified circuit model is obtained from boundary conditions, and then the final equivalent circuit of the hairpin line filter is derived in a dual structure of the filter.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.1
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• pp.35-42
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• 2003

Differential signaling has become a popular choice for high-speed interconnection schemes on Printed Circuit Boards (PCBs), offering superior immunity to external noise. However, conventional differential transmission lines on PCBs have problems, such as crosstalk and radiated emission. To overcome these, we propose a Twisted Differential Line (TDL) structure on a multi-layer PCB. Its improved immunity to crosstalk noise and the reduced radiated emission has been successfully demonstrated by measurement. The proposed structure is proven to transmit 3 Gbps digital signals with a clear eye-pattern. Furthermore, it is subject to much less crosstalk noise and achieves a 13 dB suppression of radiated emission. Index Terms - Twisted Differential Line, Differential Signaling, Crosstalk, Radiated Emission, Transmission Line, Twisted Pair