• Title/Summary/Keyword: Interconnect Network

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An Investigation on Security Management Architecture of Home Gateway (홈 게이트웨이 보안 관리 방식에 관한 연구)

  • Kim, Hyun Cheol;An, Seong Jin;Jung, Jin Wook;Kim, Seung Hae;Ryu, Yoon Sik;Jun, Young Il
    • Convergence Security Journal
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    • v.3 no.3
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    • pp.67-74
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    • 2003
  • Home network technologies which interconnect various wire and wireless home appliances, access network technologies and service offer technologies are continuing growth. To provide secure services in the home, home network environment, access network environment, and various service and contents offer technologies are consist organically. Thesis of administration method of systematic and effective groove network is most urgent and important urea to offer safety and authoritativeness of home networking service in home network that strong certification and security function are required among these technologies. In this paper, we propose home gateway security management architecture and the way to use SNMPv3. Also, we propose structure and function of home network management system to support various home networking security scenarios.

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Performance evaluation of fieldbus protocol using simulation (시뮬레이션을 이용한 필드버스 프로토콜의 성능 평가)

  • Lee, Gyung-Chang;Kim, In-Joon;Lee, Seok
    • 제어로봇시스템학회:학술대회논문집
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    • 1997.10a
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    • pp.676-679
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    • 1997
  • Networking for manufacturing is gaining importance as a nerve system of computer-integrated manufacturing(CIM). Among the various network types, the most inexpensive type called fieldbus is specifically aimed to interconnect simple devices such as sensors and actuators. For this purpose, there are several choices of the protocol such as Profibus, FIP, Foundation Fieldbus, and IEC/ISA fieldbus. This paper presents the simulation results of Profibus and FIP. Both protocols has been simulated in order to evaluate the performance such as transmission delay and throughput under different protocol parameter setting and traffic conditions.

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Fabrication of Multimode Waveguide Devices for Optical Interconnection (광 연결용 다중모드 광도파로 소자의 제작)

  • 김상균;권민석;신상영
    • Proceedings of the Optical Society of Korea Conference
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    • 2001.02a
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    • pp.32-33
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    • 2001
  • 근거리 통신망에서 데이터 전송량이 매우 증가함에 따라 근거리 통신에도 광통신을 적용하려는 연구가 활발히 진행 중이다. 광통신을 근거리 통신에 적용하려는 분야로는 랜, 댁내 망 (home network), 광 연결 (optical interconnect), 광 클럭 분배 (optical clock distribution) 등이 있다 그 중에 댁내 망의 경우 플라스틱 광섬유 (plastic optical fiber)를 이용하여 가정 내에 광통신을 적용하려는 연구가 진행 중이다. (중략)

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Optical Interconnection and Clocking Using Planar-Integrated Free-Space Optics

  • Jahns, Jurgen;Gruber, Matthias;Lunitz, Barbara;Stolzle, Markus
    • Journal of the Optical Society of Korea
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    • v.7 no.1
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    • pp.1-6
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    • 2003
  • Integration and miniaturization at the systems level are key requirements for photonics applications. Here, we describe the concept of planar integration of free-space optical systems and its use as an optical interconnection technology. Two specific applications will be considered, a parallel chip-to-chip interconnect and an optical clock distribution network.

Automotive Diagnostic Gateway using Diagnostic over Internet Protocol

  • Lee, Young Seo;Kim, Jin Ho;Jeon, Jae Wook
    • IEIE Transactions on Smart Processing and Computing
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    • v.3 no.5
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    • pp.313-318
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    • 2014
  • Recently, Ethernet-based Diagnostic Over Internet Protocol (DoIP) was applied to automotive systems, and in-vehicle gateways have been introduced to integrate Ethernet with traditional in-vehicle networks, such as the local interconnect network (LIN), controller area network (CAN) and FlexRay. The introduction of in-vehicle gateways and of Ethernet based diagnostic protocols not only decreases the complexity of the networks, but also reduces the update time for ECU software reprogramming while enabling the use of a range of services, including remote diagnostics. In this paper, a diagnostic gateway was implement for an automotive system, and the performance measurements are presented. In addition, a range of applications provided by the diagnostic gateway are proposed.

Hybrid Test Data Transportation Scheme for Advanced NoC-Based SoCs

  • Ansari, M. Adil;Kim, Dooyoung;Jung, Jihun;Park, Sungju
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.15 no.1
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    • pp.85-95
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    • 2015
  • Network-on-chip (NoC) has evolved to overcome the issues of traditional bus-based on-chip interconnect. In NoC-reuse as TAM, the test schedulers are constrained with the topological position of cores and test access points, which may negatively affect the test time. This paper presents a scalable hybrid test data transportation scheme that allows to simultaneously test multiple heterogeneous cores of NoC-based SoCs, while reusing NoC as TAM. In the proposed test scheme, single test stimuli set of multiple CUTs is embedded into each flit of the test stimuli packets and those packets are multicast to the targeted CUTs. However, the test response packets of each CUT are unicast towards the tester. To reduce network load, a flit is filled with maximum possible test response sets before unicasting towards the tester. With the aid of Verilog and analytical simulations, the proposed scheme is proved effective and the results are compared with some recent techniques.

Remote Resource Control System based on Web Environment (웹 환경을 기반으로 한 원격 자원제어 시스템)

  • Lee, Gi-Jun;Jeong, Guk-Yeong;Jeong, Chae-Yeong
    • The KIPS Transactions:PartA
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    • v.8A no.2
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    • pp.91-98
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    • 2001
  • TCP/IP based remote system using internet presented the method to access and control all the types of resources connected to network system over time and space. In this paper, We studied a resource control method through a mutual communication of a system association composed of service user, provider, and manager of the network system for the web based remote control system. The service users require the resources, and its providers are a variety of devices and digital electronic products which can provide the services in a network system. The service manager who operates the whole system performs the role to interconnect its users with its providers. Through an experiment, an implemented system confirmed flexibility, stability, and extensibility of the method presented in this paper.

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CPU Technology and Future Semiconductor Industry (I) (CPU 기술과 미래 반도체 산업 (I))

  • Park, Sahnggi
    • Electronics and Telecommunications Trends
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    • v.35 no.2
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    • pp.89-103
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    • 2020
  • Knowledge of the technology, characteristics, and market trends of the latest CPUs used in smartphones, computers, and supercomputers and the research trends of leading US university experts gives an edge to policy-makers, business executives, large investors, etc. To this end, we describe three topics in detail at a level that can help educate the non-majors to the extent possible. Topic 1 comprises the design and manufacture of a CPU and the technology and trends of the smartphone SoC. Topic 2 comprises the technology and trends of the x86 CPU and supercomputer, and Topic 3 involves an optical network chip that has the potential to emerge as a major semiconductor chip. We also describe three techniques and experiments that can be used to implement the optical network chip.

CPU Technology and Future Semiconductor Industry (III) (CPU 기술과 미래 반도체 산업 (III))

  • Park, Sahnggi
    • Electronics and Telecommunications Trends
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    • v.35 no.2
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    • pp.120-136
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    • 2020
  • Knowledge of the technology, characteristics, and market trends of the latest CPUs used in smartphones, computers, and supercomputers and the research trends of leading US university experts gives an edge to policy-makers, business executives, large investors, etc. To this end, we describe three topics in detail at a level that can help educate the non-majors to the extent possible. Topic 1 comprises the design and manufacture of a CPU and the technology and trends of the smartphone SoC. Topic 2 comprises the technology and trends of the x86 CPU and supercomputer, and Topic 3 involves an optical network chip that has the potential to emerge as a major semiconductor chip. We also describe three techniques and experiments that can be used to implement the optical network chip.

CPU Technology and Future Semiconductor Industry (II) (CPU 기술과 미래 반도체 산업 (II))

  • Park, Sahnggi
    • Electronics and Telecommunications Trends
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    • v.35 no.2
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    • pp.104-119
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    • 2020
  • Knowledge of the technology, characteristics, and market trends of the latest CPUs used in smartphones, computers, and supercomputers and the research trends of leading US university experts gives an edge to policy-makers, business executives, large investors, etc. To this end, we describe three topics in detail at a level that can help educate the non-majors to the extent possible. Topic 1 comprises the design and manufacture of a CPU and the technology and trends of the smartphone SoC. Topic 2 comprises the technology and trends of the x86 CPU and supercomputer, and Topic 3 involves an optical network chip that has the potential to emerge as a major semiconductor chip. We also describe three techniques and experiments that can be used to implement the optical network chip.