• Journal of Power System Engineering
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• v.14 no.2
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• pp.28-33
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• 2010

In this research, cascade liquefaction process was simulated using two-staged direct expansion with inter-cooler. Evaporated gaseous refrigerant which has low pressure and temperature from the inter-cooler is mixed with gaseous refrigerant from outlet of 1st compressor, and flows into 2nd compressor. Therefore this prevents superheating compression. Compressor work of process which includes inter-cooler to all cycles shows the lowest value of 338.68 MW and it is lower 16.34% than that of basic process. Refrigeration capacity shows decreasing tendency as applied inter-cooler and that of process which includes inter-cooler to all cycles shows the lowest value of 449 MW. COP was increased when the inter-cooler was applied, and process which includes inter-cooler to all cycles shows highest value of 1.33. It shows that COP was increased because decrement of compressor work by applying inter-cooler was higher than decrement of refrigeration capacity.

• Journal of Distribution Research
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• v.6 no.1
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• pp.22-35
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• 2001

The focus of Business Process Re-engineering (BPR) has been extended to inter-business process that cuts across independent companies. Combined with Supply Chain Management (SCM), inter-business process reengineering (IBPR) focuses on synchronization of business activities among trading partners to achieve performance improvements in inventory management and cycle time. This paper reviews the business process reengineering movement from the historical perspective and presents a case of inter-business process reengineering using the latest internet-based Business-to- Business (B2B) technology based on Collaborative Planning, Forecasting, and Replenishment (CPFR). The case demonstrates how CPFR technology reengineers the distribution process between Heineken USA and its distributors. As world's first implementor of web-based collaborative planning system, Heineken USA reduces cycle time from determining the customer need to delivery of the need by 50% and increases sales revenue by 10％. B2B commerce on the internet is predicted to grow from $90 billion in 1999 to $2.0 trillion in 2003. This paper provides the management with the bench-marking case on inter-business process reengineering using B2B e-commerce technology.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.981-983
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• 2003

Using the conventional standard CMOS logic process, the high voltage MOSFET to drive top emission OLEDs was fabricated for the silicon-based organic electroluminescent display. The drift region of the conventional high voltage MOSFET was implemented by the n-well of the logic process. The measurement result shows a good saturation characteristic up to 50 V without breakdown phenomena.

• The Journal of Society for e-Business Studies
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• v.9 no.4
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• pp.53-64
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• 2004

Today's enterprises take processes beyond their own organizational boundaries in order to electronically trade goods and services with partners under the concept of B2B e-commerce. In this environment, inter-organizational business processes are required and should be well defined not only in public processes between partners but in private processes within individual partners. For this purpose, we propose the method to represent inter-organizational business processes. First of all, a feasible modeling method for the inter-organizational workflow for B2B e-commerce is developed. This method is proposed based on BPSS in ebXML so that the binary and multiparty collaborations share a common process. In this method, message flows and control flows are separated in order to facilitate the design procedure of the inter-organizational workflow process. Second, a well-structured process modeling algorithm to design a well-structured inter-organizational workflow process is proposed. In the algorithm, a process is transformed to a Petri-net-based process model. This algorithm employs well-behaved modeling blocks, well-behaved control structures, and business transactions to develop well-structured process models by a top-down design.

• Journal of Information Display
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• v.5 no.1
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• pp.28-33
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• 2004

A high voltage NMOSFET is proposed to drive top emission organic light emitting device (OLED) used in the organic electroluminescent (EL) display on the single crystal silicon substrate. The high voltage NMOSFET can be fabricated by utilizing a simple layout technique with a standard CMOS logic process. It is clearly shown that the maximum supply voltage ($V_{DD}$) required for the pixel-driving transistor could reach 45 V through analytic and experimental methods. The high voltage NMOSFET was fabricated by using a standard 1.5 ${\mu}m$, 5 V CMOS logic process. From the measurements, we confirmed that the high voltage NMOSFET could sustain the excellent saturation characteristic up to 50 V without breakdown phenomena.

• The Journal of Information Systems
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• v.27 no.1
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• pp.111-131
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• 2018

Purpose This study empirically investigated the impact of information technology(IT) capability on the co-innovation with suppliers and the effects of the co-innovation with suppliers on the product and process innovations in manufacturing firms. We demonstrated that IT promotes innovations trough the sharing of knowledge with suppliers. Design/methodology/approach The empirical data were collected through post-survey. 97 valid survey data were finally collected. With a multiple-regression analysis, we confirmed the influence relationships among critical variables. Findings In the empirical results, it was found that IT integration positively and significantly influences the amount of inter-organizational information exchange with suppliers. The results showed that the inter-organizational information flow with suppliers has a positive and significant impact on the inter-organizational learning with suppliers. It was also observed that the inter-organizational learning with suppliers facilitates and promotes the co-innovation with suppliers. From these results, it is concluded that the co-innovation with suppliers is activated through the knowledge transfer or sharing caused by an inter-organizational information flow or learning. Finally, the positive effects of the co-innovation with suppliers on the product and process innovations were empirically confirmed. Thus, it is suggested that IT capability influences innovations through the co-innovation with suppliers caused by an inter-organizational information flow.

• Industrial Engineering and Management Systems
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• v.1 no.1
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• pp.29-45
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• 2002

In this study, we consider infinite supply of raw materials and backlogged demands as given two boundary conditions. And we need not make any specific assumptions about the inter-arrival of external demand and service time distributions. We propose a numeric model and an algorithm in order to compute the first two moments of inter-departure process. Entropy enables us to examine the convergence of this process and to derive measurable relations of this process. Also, lower bound on the variance of inter-departure process plays an important role in proving the existence and uniqueness of an optimal solution for a numeric model and deriving the convergence order of augmented Lagrange multipliers method applied to a numeric model. Through these works, we confirm some structural properties and numeric examples how the validity and applicability of our study.

• Korean Management Science Review
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• v.15 no.2
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• pp.109-124
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• 1998

Recently, as the importance placed on the design phase of system development has increased, the use of diagrams to design the overall system before implementing the actual program code has seen a proportionate increase. This study focuses on the diverse diagrams depicting organizational processes when integrating multiple processes of individual organizations to form an Inter-Organizational System(IOS). In this study, we attempt to identify the critical representation features of process diagrams that enable the effective integration of Inter-Organizational processes. In particular, the effect of the mapping relationship between the representation features of different diagrams to be integrated was tested empirically in a laboratory setting. The experimental task consisted of integrating the processes of two organization based upon the given process diagrams. Actual business processes were selected from real world cases and process diagrams were formulated based upon existing object-oriented notation. An analysis of the errors committed by the subjects during the integration process indicated that the mapping relationship between the diagram features representing the respective organizational processes had a significant impact upon the final integration outcome. Based upon these results, the present study provides a guideline for process diagrams that are crucial to effective Inter-Organizational process implementation and maintenance.

• Journal of Advanced Marine Engineering and Technology
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• v.34 no.1
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• pp.46-52
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• 2010

In this study, several types of natural gas liquefaction processes using two staged Inter-cooler are simulated and designed to secure a competitiveness in the industry of natural gas liquefaction plant. These processes are based on basic cascade process, and all of these are improved with two staged compressors type. One of types is applied Inter-cooler to each cycle such as propane, ethylene, methane, the other type is applied Inter-cooler to whole cycle. These processes are compared characteristics of performance with basic process. Cascade process with two staged Inter-cooler in the whole cycle is on the top ranked with increment ratio of COP about 13.7 ~ 20.5%, and yield efficiency of this process are improved comparing with the basic process by 23.8% ~ 35% lower specific power, respectively.

• Transactions on Electrical and Electronic Materials
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• v.3 no.3
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• pp.14-17
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• 2002

The HDP (High Density Plasma) CVD process consists of a simultaneous sputter etch and chemical vapor deposition. As CMOS process continues to scale down to sub- quarter micron technology, HDP process has been widely used fur the gap-fill of small geometry metal spacing in inter-metal dielectric process. However, HBP CVD system has some potential problems including plasma-induced damage. Plasma-induced gate oxide damage has been an increasingly important issue for integrated circuit process technology. In this paper, thin gate oxide charge damage caused by HDP deposition of inter-metal dielectric was studied. Multiple step HDP deposition process was demonstrated in this work to prevent plasma-induced damage by introducing an in-situ top SiH$_4$ unbiased liner deposition before conventional deposition.