• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.1-6
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• 2022

The mobile device industry demands much higher levels of integration and lower costs coupled with a growing awareness of the complete system's configuration. A subsystem module package is similar to a board-level circuit that integrates a system function in a package beyond a System-in-Package (SiP) design. It is an advanced IC packaging solution to enhance the PDN and achieve a smaller form factor. Unlike a system-level design with a decoupling capacitor, a subsystem module package system needs to redefine the role of the capacitor and its configuration for PDN performance. Specifically, the design of package's form factor should include careful consideration of optimal PDN performance and the number of components, which need to define the decoupling capacitor's value and the placement strategy for a low impedance profile with associated cost benefits. This paper will focus on both the static case that addresses the voltage (IR) drop and AC analysis in the frequency domain with three specific topics. First, it will highlight the role of simulation in the subsystem module design for the PDN. Second, it will compare the performance of double-sided component placement (DSCP) motherboards with the subsystem module package and then prove the advantage of the subsystem module package. Finally, it will introduce three-terminal decoupling capacitor (decap) configurations of capacitor size, count and value for the subsystem module package to determine the optimum performance and package density based on the cost-effective model.

• Proceedings of the Korea Contents Association Conference
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• 2014.06a
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• pp.435-436
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• 2014

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.710-713
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• 2004

The design, simulation, modeling and measurement of a low temperature co-fired ceramic (LTCC) RF switch module for GSM applications is presented in this paper. RF switch module is constructed using a Rx/Tx switching circuit and integrated low pass filter. The low pass filter function was designed to operate in th GSM band. Insertion and return loss of the low pass filter were designed less than 0.3 dB and better than 12.7 dB at 900 MHz. The RF switch module contained 10 embedded passives and 3 surface mount components integrated on $4.6{\times}4.8{\times}1.2$ nm, 6-layer multi-layer integrated circuit. The insertion loss of switch module was measured at 900 MHz was 11 dB.

• Journal of the Korean Society of Industry Convergence
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• v.25 no.6_1
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• pp.927-939
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• 2022

This study was conducted to develop a Web-GIS based monitoring module of smart city that can effectively respond, manage and improve situation in all stages of illegal dumping management on a city scale. First, five technologies were set for the core technical elements of the module configuration. Five core technical elements are as follows; video screening technology based on motion vector analysis, human behavior detection based on intelligent video analytics technology, mobile app for receiving civil complaints about illegal dumping, illegal dumping risk model and street cleanliness map, Web-GIS based situation monitoring technology. The development contents and results for each set of core technical elements were evaluated. Finally, a Web-GIS based 'illegal dumping monitoring module' was proposed. It is possible to collect and analyze city data at the local government level through operating the proposed module. Based on this, it is able to effectively detect illegal dumpers at relatively low cost and identify the tendency of illegal dumping by systematically managing habitual occurrence areas. In the future, it is expected to be developed in the form of an add-on module of the smart city integration platform operated by local governments to ensure interoperability and scalability.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.1
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• pp.31-39
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• 2001

W polymetal gate technology for giga bit DRAM are presented. Key module processes for polymetal gate are studied in detail. $W/WN_x/poly-silicon$ adopted for a word line of 256Mbit DRAM has good gate oxide integrity and junction leakage characteristics through full integration, which is comparable to those of conventional $WSi_x$/Poly-silicon gate process. These results undoubtedly show that $W/WN_x/poly-silicon$ is the strongest candidate as a word line for Giga bit DRAM.

• Bioinformatics and Biosystems
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• v.2 no.2
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• pp.62-65
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• 2007

We present here the strategy of data integration for inference of genetic regulatory modules. First, we construct all possible combinations of regulators of genes using chromatin-immunoprecipitation(ChIP)-chip data. Second, hierarchical clustering method is employed to analyze mRNA expression profiles. Third, integration method is applied to both of the data. Finally, we construct a genetic regulatory module which is involved in the function of ribosomal protein synthesis.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.641-642
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• 2006

• Bulletin of the Korean Space Science Society
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• 2008.10a
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• pp.26.4-27
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• 2008

The completion ('initiation' de facto) of the KASI Orbit Propagator and Estimator (KASIOPEA) has been delayed for several reasons unfortunately. Due to the lack of working staffs and the Division priority rearrangement, the initial plan was dismantled and ignored for many years. However, fundamental researches regarding the essential parts of KASIOPEA has been done by author. The numerical integration module of the KASIOPEA is the most sensitive part in the precision of the final output in general. There is no silver bullet in the numerical integration in an orbit propagation as a non-stiff ODE case. Many numerical integration method like single-step methods, multi-step method, and extrapolation methods have been used in overly populated orbit propagator or estimator. In this study, several popular methods from single-step, multi-step, and extrapolation methods have been tested in numerical accuracy and stability.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.10
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• pp.2501-2513
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• 1994

In this paper, a compact, light-weight, universal, spherical 3-degree-of-freedom, parallel-structured manual controller with high reflecting-force capability is implemented. First, the position analysis, kinematic modeling and analysis, force reflecting transformation, and applied force control schemes for a parallel structured 3 degree-of-freedom spherical system have been described. Then, a brief description of the system integration, its actual implementation hardware, and its preliminary analysis results are presented. The implemented parallel 3 degree-of-freedom spherical module is equipped with high gear-ratio reducers, and the friction due to the reducers is minimized by employing a force control algorithm, which results in a "power steering" effect for enhanced smoothness and transparency (for compactness and reduced weight).d weight).

• KIEAE Journal
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• v.6 no.4
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• pp.17-24
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• 2006

The application of photovoltaics into building as integrated building components has been paid more attention worldwide. Photovoltaics or solar electric modules are solid state devices, directly converting solar radiation into electricity; the process does not require fuel and any moving parts, and produce no pollutants. And the prefab building method is very effective because the pre- manufactured building components is simply assembled to making up buildings in the construction fields especially the sandwich panel. Architecture considerations for the integration of PV module to building envelope such as building structure, construction type, safety, regulation, maintenance etc. have been carefully refelected from the early stage of BIPV module design. Trial product of BIPV module are manufactured and sample construction details for demonstration building are purposed. Therefore, this paper intends to advanced its practical use by proposing how to get integrated PV system which can be applied to prefab building material, and how to apply it.