• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 1999년도 1st Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.127-154
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• 1999

Interconnect - Wire bonding-> Flip chip interconnect ; At research step, Au stud bump bonding seems to be more proper .Package -Plastic package-> $Z_{0}$ controlled land grid package -Flip Chip will be used for RF ICs and CSP for digital ICs -RF MCM comprised of bare active devices and integrated passive components -Electrical design skills are much more required in RF packaging .Passive Component -discrete-> integrated -Both of size and numbers of passive components must be reduced

• Journal of international Conference on Electrical Machines and Systems
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• 제2권3호
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• pp.275-282
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• 2013

Applications such as vibration isolation, gravity compensation, pick-and-place machines, etc., would benefit from (long-stroke) cylindrical/tubular permanent magnet (PM) actuators with integrated passive gravity compensation to minimize the power consumption. As an example, in component placing (pick-and-place) machines on printed circuit boards, passive devices allow the powerless counteraction of translator including nozzles or tooling bits. In these applications, an increasing demand is arising for high-speed actuation with high precision and bandwidth capability mainly due to the placement head being at the foundation of the motion chain, hence, a large mass of this device will result in high force/power requirements for the driving mechanism (i.e. an H-bridge with three linear permanent magnet motors placed in an H-configuration). This paper investigates a tubular actuator topology combined with passive gravity compensation. These two functionalities are separately introduced, where the combination is verified using comprehensive three dimensional (3D) finite element analyses.

• ETRI Journal
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• 제23권1호
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• pp.23-32
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• 2001

Examination of the statistical variation of integrated passive components is crucial for designing and characterizing the performance of multichip module (MCM) substrates. In this paper, the statistical analysis of parallel plate capacitors with gridded plates manufactured in a multilayer low temperature cofired ceramic (LTCC) process is presented. A set of integrated capacitor structures is fabricated, and their scattering parameters are measured for a range of frequencies from 50 MHz to 5 GHz. Using optimized equivalent circuits obtained from HSPICE, mean and absolute deviation is calculated for each component of each device model. Monte Carlo Analysis for the capacitor structures is then performed using HSPICE. Using a comparison of the Monte Carlo results and measured data, it is determined that even a small number of sample structures, the statistical variation of the component values provides an accurate representation of the overall capacitor performance.

• Journal of Advanced Marine Engineering and Technology
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• 제32권2호
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• pp.330-335
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• 2008

In this study, highly miniaturized short-wavelength transmission line employing periodically perforated ground metal (PPGM) structures were developed for application to miniaturized on-chip passive component on Si RFIC. The transmission line employing PPGM structure showed shorter wavelength and lower characteristic impedance than conventional coplanar-type transmission line. The wavelength of the transmission line employing PPGM structure was 57% of the conventional coplanar-type transmission line on Si Radio Frequency Integrated Circuit (RFIC) substrate. Basic characteristics of the transmission line employing PPGM structure were also investigated in order to evaluate its suitability for application to a development of miniaturized passive on-chip components. According to the results, it was found that the PPGM structure is a promising candidate for application to a development of miniaturized on-chip passive components on Si RFIC.

• KIEE International Transactions on Electrophysics and Applications
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• 제5C권4호
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• pp.176-179
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• 2005

The increasing demand for high density packaging technologies and the evolution to mixed digital and analogue devices has been the con-set of increasing research in thin film multi-layer technologies such as the passive components integration technology. In this paper, Cu and TaO thin film with RF sputtering was deposited for spiral inductor and MOM capacitor on the $SiO_2$/Si(100) substrate. MOM capacitor and spiral inductor were fabricated for L-C band pass filter by sputtering and lift-off. We are analyzed and designed thin films L-C passive components for band pass filter at 900 MHz and 1.8 GHz, important devices for mobile communication system. Based on the high-Q values of passive components, MOM capacitor and spiral inductors for L-C band pass filter, a low insertion loss of L-C passive components can be realized with a minimized chip area. The insertion loss was 3 dB for a 1.8 GHz filter, and 5 dB for a 900 MHz filter. This paper also discusses a analysis and practical design to thin-film L-C band pass filter.

• 마이크로전자및패키징학회지
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• 제27권4호
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• pp.47-54
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• 2020

활성 도파로와 수동 도파로의 집적은 광집적 회로의 구성에서 필수적인 요소이다. 이를 구현하기 위한 여러 기술 중 버트 조인트는 상당한 장점을 가지고 있다. 그러나 버트 조인트 접합은 높은 광손실을 야기하며, 두 도파로 간의 정렬에 있어서 정확한 공정 제어가 요구되는 구조이다. 본 논문에서는 레이저 다이오드와 spot size converter (SSC)로 구성된 집적 소자를 시뮬레이션하기 위해 beam propagation method을 이용하였다. 상이한 모드 특성을 갖는 두 SSC를 레이저 도파로와 연결하고, 광결합 효율을 시뮬레이션 하였다. 큰 근접장 모드를 가지는 SSC는 낮은 광결합 효율을 보여주나, 원거리 발산각 패턴이 좁고 더 대칭적이다. 테이퍼 구조의 수동 도파로는 원거리 발산각 패턴을 열화시키지 않고 버트 조인트에서 도파로 오프셋의 무의존성과 광결합 효율을 향상시키기 위해 이용되었다. 이를 바탕으로 89.6%의 높은 광결합 효율과 16°×16°의 좁은 원거리장 발산각을 얻을 수 있었다.

• Journal of Advanced Marine Engineering and Technology
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• 제36권1호
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• pp.157-165
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• 2012

본 연구에서는 MMIC 상에서 온칩용 수동소자의 개발을 위해서, 주기적으로 배치된 용량성 소자를 이용한 단파장 전송선로를 연구하였다. PACD 구조의 전송선로는 기존의 마이크로스트립 전송선로에 비해, 단파장 특성과 낮은 특성 임피던스를 나타내었다. PACD 구조의 전송선로 구조는 기존의 마이크로스트립 전송선로 파장의 8%의 파장 단축효과를 나타낸다. MMIC 상에서의 온칩용 수동소자로서의 적합성을 판단하기 위하여 이론적으로 PACD 선로구조의 손실특성, 유효유전율, 전파상수, 대역폭 등의 기본 특성을 분석하였다. 위의 결과들을 통하여 PACD 구조의 전송선로는 MMIC 상에서 온칩용 수동소자로서의 특성에 효과적임을 알 수 있다.

• Journal of Advanced Marine Engineering and Technology
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• 제32권6호
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• pp.964-973
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• 2008

In this study, a short-wavelength coplanar-type transmission line employing periodic ground structure (PGS) was developed for application to miniaturized on-chip passive component on Si Radio Frequency Integrated Circuit (RFIC). The transmission line employing PGS showed shorter wavelength and lower characteristic impedance than conventional coplanar-type transmission line. The wavelength of the transmission line employing PGS structure was 57 % of the conventional coplanar-type transmission line on Si substrate. Using the theoretical analysis. basic characteristics of the transmission line employing PGS (e.g., bandwidth. loss, impedance, and resonance characteristics) were also investigated in order to evaluate its suitability for application to a development of miniaturized passive on-chip components on silicon RFIC. According to the results. the bandwidth of the transmission line employing PGS was more than 895 GHz as long as T is less than 20${\mu}m$, and the resonance characteristic was observed in 1239 GHz, which indicates that the PPGM structure is a promising candidate for application to a development of miniaturized on-chip passive components on Si RFIC.

• 한국정보기술학회 영문논문지
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• 제10권1호
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• pp.37-43
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• 2020

This paper presents analysis of passive metal interconnection of the LNA block in CMOS integrated circuit. The performance of circuit is affected by the geometry of RF signal path. To investigate the effect of interconnection lines, a cascode LNA is designed, and circuit simulations with full-wave electromagnetic (EM) simulations are executed for different positions of a component. As the results, the position of an external capacitor (C_ex) changes the parasitic capacitance of electric coupling; the placement of component affects the circuit performance. This analysis of interconnection line is helpful to analyze the amount of electromagnetic coupling between the lines, and useful to choose the signal path in the layout design. The target of this work is the RF LNA enabling the seamless connection of wireless data network and the following standards have to be supported in multi-band (WCDMA: 2.11~ 2.17 GHz, CDMA200 1x : 1.84~1.87 GHz, WiBro : 2.3~2.4GHz) mobile application. This work has been simulated and verified by Cadence spectre RF tool and Ansoft HFSS. And also, this work has been implemented in a 0.13um RF CMOS technology process.

• 한국재료학회지
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• 제17권2호
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• pp.86-90
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• 2007

The organic-capped Ba-Ti-O nanolayers were coated uniformly on spherical Ni particles for multilayer ceramic capacitor (MLCC) applications via the formation of Ti-hydroxide nano-coating layers and their subsequent reaction with Ba-stearate at $180^{\circ}C$. The capping of organic shell on oxide coating layer changed the hydrophilic surface structure into hydrophobic one, which significantly improved the dispersion behavior in hydrophobic solvents such as terpineol and butanol. In addition, the uniform coating of Ba-Ti-O layer was advantageous to prevent Ni oxidation. This method provides a useful chemical route to fabricate organic-soluble Ba-Ti-O coated Ni particles for a highly integrated passive component.