References
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- Microelectronics Packaging Handbook Tummala, R.;Rymaszewski, E.J.
- HSPICE Users Manual Meta Software
- Proc. Electrical Performance of Electronic Packaging Accurate, High Speed Modeling of Integrated Passive Devices in Multichip Modules Poddar, R.;Brooke, M.
- Proc. Elec. Comp. Tech. Conf. Electrical and Mechanical Modeling of Embedded Capacitors Rao, Y.;Qu, J.;Wong, C.P.
- Proc. Int'l Conf. on Multichip Modules and High Density Packaging Modeling and mixed signal simulation of embedded passive components in high performance packages Sood, A.;Choi, K.L.;Haridass, A.;Na, N.;Swaminathan, M.
- IEEE MTT-S Int'l Microwave Symp. Digest v.3 Design of embedded passive components in Low-Temperature Cofired Ceramic on Metal (LTCC-M) technology Fathy, A.;Pendrick, V.;Ayers, G.;Geller, B.;Narayan, Y.;Thaler, B.;Chen, H.D.:Liberatore, M.J.;Prokop, J.;Choi, K.L.;Swaminathan, M.;Meixner, R.
- ETRI Journal v.22 no.1 Extraction of Passive Device Model Parameters Using Genetic Algorithms Yun, I.;Carastro, L.;Poddar, R.;Brooke, M.;May, G.;Hyun, K.;Pyun, K.
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- IEEE Trans. Advanced Packaging v.22 no.1 Accurate High Speed Empirically Based Predictive Modeling of Deeply Embedded Gridded Parallel Plate Capacitors Fabricated in a Multilayer LTCC Process Poddar, R.;Brooke, M.
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- J. RF Design v.6 no.2 RF Amplifier Design Program Feeney, R.K.;Hertling, D.R.