• Proceedings of the International Microelectronics And Packaging Society Conference
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• 1999.12a
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• pp.127-154
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• 1999

Interconnect - Wire bonding-> Flip chip interconnect ; At research step, Au stud bump bonding seems to be more proper .Package -Plastic package-> $Z_{0}$ controlled land grid package -Flip Chip will be used for RF ICs and CSP for digital ICs -RF MCM comprised of bare active devices and integrated passive components -Electrical design skills are much more required in RF packaging .Passive Component -discrete-> integrated -Both of size and numbers of passive components must be reduced

• Journal of international Conference on Electrical Machines and Systems
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• v.2 no.3
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• pp.275-282
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• 2013

Applications such as vibration isolation, gravity compensation, pick-and-place machines, etc., would benefit from (long-stroke) cylindrical/tubular permanent magnet (PM) actuators with integrated passive gravity compensation to minimize the power consumption. As an example, in component placing (pick-and-place) machines on printed circuit boards, passive devices allow the powerless counteraction of translator including nozzles or tooling bits. In these applications, an increasing demand is arising for high-speed actuation with high precision and bandwidth capability mainly due to the placement head being at the foundation of the motion chain, hence, a large mass of this device will result in high force/power requirements for the driving mechanism (i.e. an H-bridge with three linear permanent magnet motors placed in an H-configuration). This paper investigates a tubular actuator topology combined with passive gravity compensation. These two functionalities are separately introduced, where the combination is verified using comprehensive three dimensional (3D) finite element analyses.

• ETRI Journal
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• v.23 no.1
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• pp.23-32
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• 2001

Examination of the statistical variation of integrated passive components is crucial for designing and characterizing the performance of multichip module (MCM) substrates. In this paper, the statistical analysis of parallel plate capacitors with gridded plates manufactured in a multilayer low temperature cofired ceramic (LTCC) process is presented. A set of integrated capacitor structures is fabricated, and their scattering parameters are measured for a range of frequencies from 50 MHz to 5 GHz. Using optimized equivalent circuits obtained from HSPICE, mean and absolute deviation is calculated for each component of each device model. Monte Carlo Analysis for the capacitor structures is then performed using HSPICE. Using a comparison of the Monte Carlo results and measured data, it is determined that even a small number of sample structures, the statistical variation of the component values provides an accurate representation of the overall capacitor performance.

• Journal of Advanced Marine Engineering and Technology
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• v.32 no.2
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• pp.330-335
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• 2008

In this study, highly miniaturized short-wavelength transmission line employing periodically perforated ground metal (PPGM) structures were developed for application to miniaturized on-chip passive component on Si RFIC. The transmission line employing PPGM structure showed shorter wavelength and lower characteristic impedance than conventional coplanar-type transmission line. The wavelength of the transmission line employing PPGM structure was 57% of the conventional coplanar-type transmission line on Si Radio Frequency Integrated Circuit (RFIC) substrate. Basic characteristics of the transmission line employing PPGM structure were also investigated in order to evaluate its suitability for application to a development of miniaturized passive on-chip components. According to the results, it was found that the PPGM structure is a promising candidate for application to a development of miniaturized on-chip passive components on Si RFIC.

• KIEE International Transactions on Electrophysics and Applications
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• v.5C no.4
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• pp.176-179
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• 2005

The increasing demand for high density packaging technologies and the evolution to mixed digital and analogue devices has been the con-set of increasing research in thin film multi-layer technologies such as the passive components integration technology. In this paper, Cu and TaO thin film with RF sputtering was deposited for spiral inductor and MOM capacitor on the $SiO_2$/Si(100) substrate. MOM capacitor and spiral inductor were fabricated for L-C band pass filter by sputtering and lift-off. We are analyzed and designed thin films L-C passive components for band pass filter at 900 MHz and 1.8 GHz, important devices for mobile communication system. Based on the high-Q values of passive components, MOM capacitor and spiral inductors for L-C band pass filter, a low insertion loss of L-C passive components can be realized with a minimized chip area. The insertion loss was 3 dB for a 1.8 GHz filter, and 5 dB for a 900 MHz filter. This paper also discusses a analysis and practical design to thin-film L-C band pass filter.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.4
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• pp.47-54
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• 2020

Integration of active and passive waveguides is an essential component of the photonic integrated circuit and its elements. Butt joint is one of the important technologies to accomplish it with significant advantages. However, it suffers from high optical loss at the butt joint junction and need of accurate process control to align both waveguides. In this study, we used beam propagation method to simulate an integrated device composed of a laser diode and spot size converter (SSC). Two SSCs with different mode properties were combined with laser waveguide and optical coupling efficiency was simulated. The SSC with larger near field mode showed lower coupling efficiency, however its far field pattern was narrower and more symmetric. Tapered passive waveguide was utilized for enhancing the coupling efficiency and tolerance of waveguide offset at the butt joint without degrading the far field pattern. With this technique, high optical coupling efficiency of 89.6% with narrow far field divergence angle of 16°×16° was obtained.

• Journal of Advanced Marine Engineering and Technology
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• v.36 no.1
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• pp.157-165
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• 2012

In this study, a short-wavelength transmission line employing periodically arrayed capacitive devices (PACD) was studied for application to miniaturized on-chip passive component on monolithic microwave integrated circuit (MMIC). The transmission line employing PACD showed shorter wavelength and lower characteristic impedance than conventional microstrip transmission line. The wavelength transmission line employing PACD structure was 8% of the conventional microstrip transmission line on GaAs substrate. Using the theoretical analysis, basic characteristic of the transmission line employing PACD (e.g., loss, effective dielectric constant, effective propagation constant, bandwidth ) were also investigated in order to evaluate its suitability for application to a development of miniaturized passive on-chip components on MMIC. Above results indicate that the transmission line employing PACD is a promising candidate for a development of miniaturized passive components on MMIC.

• Journal of Advanced Marine Engineering and Technology
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• v.32 no.6
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• pp.964-973
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• 2008

In this study, a short-wavelength coplanar-type transmission line employing periodic ground structure (PGS) was developed for application to miniaturized on-chip passive component on Si Radio Frequency Integrated Circuit (RFIC). The transmission line employing PGS showed shorter wavelength and lower characteristic impedance than conventional coplanar-type transmission line. The wavelength of the transmission line employing PGS structure was 57 % of the conventional coplanar-type transmission line on Si substrate. Using the theoretical analysis. basic characteristics of the transmission line employing PGS (e.g., bandwidth. loss, impedance, and resonance characteristics) were also investigated in order to evaluate its suitability for application to a development of miniaturized passive on-chip components on silicon RFIC. According to the results. the bandwidth of the transmission line employing PGS was more than 895 GHz as long as T is less than 20${\mu}m$, and the resonance characteristic was observed in 1239 GHz, which indicates that the PPGM structure is a promising candidate for application to a development of miniaturized on-chip passive components on Si RFIC.

• Journal of Advanced Information Technology and Convergence
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• v.10 no.1
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• pp.37-43
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• 2020

This paper presents analysis of passive metal interconnection of the LNA block in CMOS integrated circuit. The performance of circuit is affected by the geometry of RF signal path. To investigate the effect of interconnection lines, a cascode LNA is designed, and circuit simulations with full-wave electromagnetic (EM) simulations are executed for different positions of a component. As the results, the position of an external capacitor (C_ex) changes the parasitic capacitance of electric coupling; the placement of component affects the circuit performance. This analysis of interconnection line is helpful to analyze the amount of electromagnetic coupling between the lines, and useful to choose the signal path in the layout design. The target of this work is the RF LNA enabling the seamless connection of wireless data network and the following standards have to be supported in multi-band (WCDMA: 2.11~ 2.17 GHz, CDMA200 1x : 1.84~1.87 GHz, WiBro : 2.3~2.4GHz) mobile application. This work has been simulated and verified by Cadence spectre RF tool and Ansoft HFSS. And also, this work has been implemented in a 0.13um RF CMOS technology process.

• Korean Journal of Materials Research
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• v.17 no.2
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• pp.86-90
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• 2007

The organic-capped Ba-Ti-O nanolayers were coated uniformly on spherical Ni particles for multilayer ceramic capacitor (MLCC) applications via the formation of Ti-hydroxide nano-coating layers and their subsequent reaction with Ba-stearate at $180^{\circ}C$. The capping of organic shell on oxide coating layer changed the hydrophilic surface structure into hydrophobic one, which significantly improved the dispersion behavior in hydrophobic solvents such as terpineol and butanol. In addition, the uniform coating of Ba-Ti-O layer was advantageous to prevent Ni oxidation. This method provides a useful chemical route to fabricate organic-soluble Ba-Ti-O coated Ni particles for a highly integrated passive component.