• Title/Summary/Keyword: Integrated design optimization

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Smart Electric Mobility Operating System Integrated with Off-Grid Solar Power Plants in Tanzania: Vision and Trial Run (탄자니아의 태양광 발전소와 통합된 전기 모빌리티 운영 시스템 : 비전과 시범운행)

  • Rhee, Hyop-Seung;Im, Hyuck-Soon;Manongi, Frank Andrew;Shin, Young-In;Song, Ho-Won;Jung, Woo-Kyun;Ahn, Sung-Hoon
    • Journal of Appropriate Technology
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    • v.7 no.2
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    • pp.127-135
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    • 2021
  • To respond to the threat of global warming, countries around the world are promoting the spread of renewable energy and reduction of carbon emissions. In accordance with the United Nation's Sustainable Development Goal to combat climate change and its impacts, global automakers are pushing for a full transition to electric vehicles within the next 10 years. Electric vehicles can be a useful means for reducing carbon emissions, but in order to reduce carbon generated in the stage of producing electricity for charging, a power generation system using eco-friendly renewable energy is required. In this study, we propose a smart electric mobility operating system integrated with off-grid solar power plants established in Tanzania, Africa. By applying smart monitoring and communication functions based on Arduino-based computing devices, information such as remaining battery capacity, battery status, location, speed, altitude, and road conditions of an electric vehicle or electric motorcycle is monitored. In addition, we present a scenario that communicates with the surrounding independent solar power plant infrastructure to predict the drivable distance and optimize the charging schedule and route to the destination. The feasibility of the proposed system was verified through test runs of electric motorcycles. In considering local environmental characteristics in Tanzania for the operation of the electric mobility system, factors such as eco-friendliness, economic feasibility, ease of operation, and compatibility should be weighed. The smart electric mobility operating system proposed in this study can be an important basis for implementing the SDGs' climate change response.

A Study for Optimization of Armed Flight Test Ammunition Requirement for the Development of Attack Helicopter (공격헬기 개발을 위한 무장 비행시험 탄약발수 최적화 연구)

  • Lee, Myeong-Seok;Hur, Jang-Wook
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.21 no.8
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    • pp.147-153
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    • 2020
  • Developments in aircraft require safety verification through flight testing for many hours with prototype design and production. The test evaluation step of performing flight tests was an important process that determines the success in the development of the system. In particular, safety development through flight tests in the armed flight test is important for the development of attack helicopters. In the development of attack helicopters, the evaluation period and cost related to the armed flight test are closely related to the required ammunition requirement. Therefore, this paper presents the amount of ammunition required for the military flight test between attack helicopter developments through an analysis of the AH-1 helicopter in a similar case and ADS-44-HDBK of military specification. The AH-1 can be used to calculate the ammunition demand by considering the exclusion of redundant firing tests and configuration differences. In the case of the machine gun-equipped configuration, approximately 10,500R was required, and approximately 324R was required in the case of a rocket-mounted configuration. In addition, if the armed integrated bench is used properly, it is expected to promote efficiently the flight test in the armed flight by identifying the possible risk factors with armed flight tests and excluding them.

Numerical Analysis of Warpage and Stress for 4-layer Stacked FBGA Package (4개의 칩이 적층된 FBGA 패키지의 휨 현상 및 응력 특성에 관한 연구)

  • Kim, Kyoung-Ho;Lee, Hyouk;Jeong, Jin-Wook;Kim, Ju-Hyung;Choa, Sung-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.2
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    • pp.7-15
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    • 2012
  • Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.

Water Digital Twin for High-tech Electronics Industrial Wastewater Treatment System (II): e-ASM Calibration, Effluent Prediction, Process selection, and Design (첨단 전자산업 폐수처리시설의 Water Digital Twin(II): e-ASM 모델 보정, 수질 예측, 공정 선택과 설계)

  • Heo, SungKu;Jeong, Chanhyeok;Lee, Nahui;Shim, Yerim;Woo, TaeYong;Kim, JeongIn;Yoo, ChangKyoo
    • Clean Technology
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    • v.28 no.1
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    • pp.79-93
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    • 2022
  • In this study, an electronics industrial wastewater activated sludge model (e-ASM) to be used as a Water Digital Twin was calibrated based on real high-tech electronics industrial wastewater treatment measurements from lab-scale and pilot-scale reactors, and examined for its treatment performance, effluent quality prediction, and optimal process selection. For specialized modeling of a high-tech electronics industrial wastewater treatment system, the kinetic parameters of the e-ASM were identified by a sensitivity analysis and calibrated by the multiple response surface method (MRS). The calibrated e-ASM showed a high compatibility of more than 90% with the experimental data from the lab-scale and pilot-scale processes. Four electronics industrial wastewater treatment processes-MLE, A2/O, 4-stage MLE-MBR, and Bardenpo-MBR-were implemented with the proposed Water Digital Twin to compare their removal efficiencies according to various electronics industrial wastewater characteristics. Bardenpo-MBR stably removed more than 90% of the chemical oxygen demand (COD) and showed the highest nitrogen removal efficiency. Furthermore, a high concentration of 1,800 mg L-1 T MAH influent could be 98% removed when the HRT of the Bardenpho-MBR process was more than 3 days. Hence, it is expected that the e-ASM in this study can be used as a Water Digital Twin platform with high compatibility in a variety of situations, including plant optimization, Water AI, and the selection of best available technology (BAT) for a sustainable high-tech electronics industry.

A Study on the Development of Ultra-precision Small Angle Spindle for Curved Processing of Special Shape Pocket in the Fourth Industrial Revolution of Machine Tools (공작기계의 4차 산업혁명에서 특수한 형상 포켓 곡면가공을 위한 초정밀 소형 앵글 스핀들 개발에 관한 연구)

  • Lee Ji Woong
    • Journal of Practical Engineering Education
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    • v.15 no.1
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    • pp.119-126
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    • 2023
  • Today, in order to improve fuel efficiency and dynamic behavior of automobiles, an era of light weight and simplification of automobile parts is being formed. In order to simplify and design and manufacture the shape of the product, various components are integrated. For example, in order to commercialize three products into one product, product processing is occurring to a very narrow area. In the case of existing parts, precision die casting or casting production is used for processing convenience, and the multi-piece method requires a lot of processes and reduces the precision and strength of the parts. It is very advantageous to manufacture integrally to simplify the processing air and secure the strength of the parts, but if a deep and narrow pocket part needs to be processed, it cannot be processed with the equipment's own spindle. To solve a problem, research on cutting processing is being actively conducted, and multi-axis composite processing technology not only solves this problem. It has many advantages, such as being able to cut into composite shapes that have been difficult to flexibly cut through various processes with one machine tool so far. However, the reality is that expensive equipment increases manufacturing costs and lacks engineers who can operate the machine. In the five-axis cutting processing machine, when producing products with deep and narrow sections, the cycle time increases in product production due to the indirectness of tools, and many problems occur in processing. Therefore, dedicated machine tools and multi-axis composite machines should be used. Alternatively, an angle spindle may be used as a special tool capable of multi-axis composite machining of five or more axes in a three-axis machining center. Various and continuous studies are needed in areas such as processing vibration absorption, low heat generation and operational stability, excellent dimensional stability, and strength securing by using the angle spindle.