• Corrosion Science and Technology
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• v.18 no.6
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• pp.253-257
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• 2019

A deep learning based real-time painting surface inspection algorithm is proposed herein, designed for developing an autonomous inspection drone. The painting surface inspection is usually conducted manually. However, the manual inspection has a limitation in obtaining accurate data for correct judgement on the surface because of human error and deviation of individual inspection experiences. The best method to replace manual surface inspection is the vision-based inspection method with a camera, using various image processing algorithms. Nevertheless, the visual inspection is difficult to apply to surface inspection due to diverse appearances of material, hue, and lightning effects. To overcome technical limitations, a deep learning-based pattern recognition algorithm is proposed, which is specialized for painting surface inspections. The proposed algorithm functions in real time on the embedded board mounted on an autonomous inspection drone. The inspection results data are stored in the database and used for training the deep learning algorithm to improve performance. The various experiments for pre-inspection of painting processes are performed to verify real-time performance of the proposed deep learning algorithm.

• Journal of the Semiconductor & Display Technology
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• v.16 no.2
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• pp.1-8
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• 2017

The visual inspection of electronic parts consists of two steps: automatic visual inspection and verification inspection. In the stage of a verification inspection, the human inspector sequentially inspects all the areas which detected in the automatic inspection. In this study, we propose an algorithm to determine the order of verification inspection by Bayes inference well known in the field of machine learning. This is a method of prioritizing a region estimated to have a high probability of defect using experience data of past inspection. This algorithm was applied to the visual inspection of ultraviolet filters to verify its effectiveness. As a result of the comparison experiment, it was confirmed that the verification inspection can be completed 30% of the conventional method by adapting proposed algorithm.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.993-997
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• 2004

A data error inspection algorithm for wireless digital data communication was developed. Original data converted By wireless digital data error inspection algorithm. Wireless digital data is high possibility to get distortion and lose by noise and barrier on wireless. If the data check damaged and lost at receiver, can't make it clear and can't judge whether this data is right or not. Therefore, by wireless transmission data need the data error inspection algorithm in order to decrease the data distortion and lose and to monitoring the transmission data as real time. This study consists of RF station for wireless transmission, Water Level Meter station for water level measurement and Error inspection algorithm for error check of transmission data. This study is also that investigation and search for error inspection algorithm in order to wireless digital data transmission in condition of the least data's damage and lose. Designed transmitter and receiver with one - chip micro process to protect to swell the volume of circuit. Had designed RF transmitter - receiver station simply by means of ATMEL one - chip micro processing the systems. Used 10mW of the best RF power and 448MHz-449MHz on frequency band which is open to public touse free within the limited power.

• Journal of Institute of Control, Robotics and Systems
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• v.19 no.12
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• pp.1072-1080
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• 2013

In a the present day, many vision inspection techniques are used in productive industrial areas. In particular, in the semiconductor industry the vision inspection system for wafers is a very important system. Also, inspection techniques for semiconductor wafer production are required to ensure high precision and fast inspection. In order to achieve these objectives, parallel processing of the inspection algorithm is essentially needed. In this paper, we propose the GPU (Graphical Processing Unit)-based parallel processing algorithm for the fast inspection of semiconductor wafers. The proposed algorithm is implemented on GPU boards made by NVIDIA Company. The defect detection performance of the proposed algorithm implemented on the GPU is the same as if by a single CPU, but the execution time of the proposed method is about 210 times faster than the one with a single CPU.

• Journal of Ship and Ocean Technology
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• v.2 no.1
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• pp.42-57
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• 1998

Genetic Algorithm (GA) is applied to obtain optimal Inspection plan for fatigue deteriorating structures. The optimization problem is defined so as to minimize inspection cost in the 1ifs-time of the structure under the constraint that the increment of failure probability in each inspection interval is maintained below a target value. Optimization parameters are the inspection timing and the inspection quality. The inspection timing is selected from the discrete intervals such as one year, two years, three years, etc. The inspection quality is selected from the followings; no inspection, normal inspection, sampling inspection or precise inspection. The applicability of the proposed GA approach is demonstrated through the numerical calculations assuming a structure consisting of four member sets. Influences of the level of target failure probability, initial defect condition and stress increase due to plate thickness reduction caused by corrosion on inspection planning are discussed.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.8
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• pp.788-793
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• 2015

This paper proposes a path planning algorithm to reduce the inspection time of AOI (Automatic Optical Inspection) machines for SMT (Surface Mount Technology) in-line system. Since the field-of-view of the camera attached at the machine is much less than the entire inspection region of board, the inspection region should be clustered to many groups. The image acquisition time depends on the number of groups, and camera moving time depends on the sequence of visiting the groups. The acquired image is processed while the camera moves to the next position, but it may be delayed if the group includes many components to be inspected. The inspection delay has influence on the overall job time of the machine. In this paper, we newly considers the inspection delay time for path planning of the inspection machine. The unified approach using genetic algorithm is applied to generates the groups and visiting sequence simultaneously. The chromosome, crossover operator, and mutation operator is proposed to develop the genetic algorithm. The experimental results are presented to verify the usefulness of the proposed method.

• Proceedings of the KIEE Conference
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• 2006.10c
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• pp.425-427
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• 2006

In this paper, an automatic side-view inspection algorithm for LCD modules is proposed. Until now, most parts of inspection is performed by human inspectors, which means very high product costs. So inspection automation is the very hot issue in the LCD industries. However, it is not easy problem to replace the human by computer vision system. In the many inspections which are based on the human eyes, side-view inspection is most hard problem to solve. In this paper, an image morphing algorithm is developed, which will help to enable the automation of the side-view inspection process.

• Journal of the Semiconductor & Display Technology
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• v.13 no.3
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• pp.1-6
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• 2014

Visual defect inspection for electronics parts manufacturing processes is comprised of 2 steps - automatic visual inspection by machine and inspection by human inspectors. It is necessary that spatial points which were detected by the machine should be adequately clustered for subsequent human inspection. This research deals with the spatial clustering algorithm for the purpose of process productivity improvement. Distribution based clustering is newly developed and experimentally confirmed to show better clustering efficiency than existing algorithm - area based clustering.

• Journal of the Korean Institute of Intelligent Systems
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• v.13 no.4
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• pp.480-485
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• 2003

We Propose a Path planning method to reduce the Inspection time of AOI (automatic optical inspection) machines in SMT (surface mount technology) in-line system. Inspection windows of board should be clustered to consider the FOV (field-of-view) of camera. The number of clusters is desirable to be minimized in order to reduce the overall inspection time. We newly propose a genetic algorithm to minimize the number of clusters for a given board. Comparative simulation results are presented to verify the usefulness of proposed algorithm.

• Proceedings of the IEEK Conference
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• 2000.06d
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• pp.139-142
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• 2000

$\mu$BGA(Ball Grid Array) is growing in response to a great demand for smaller and lighter packages for the use in laptop, mobile phones and other evolving products. However it is not easy to find its defect by human visual due to in very small dimension. From this point of view, we are interested its development of a vision based automated inspection algorithm. For this, first a 2D view of $\mu$BGA is described under a special blue illumination. Second, a notation-invariant 2D inspection algorithm is developed. Finally a 3D inspection algorithm is proposed for the case of stereo vision system. As a simulation result, it is shown that 3D defect not easy to find by 2D algorithm can be detected by the proposed inspection algorithm.