• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2023년도 봄 학술논문 발표대회
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• pp.161-162
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• 2023

The construction inspection is conducted by the contractor or construction supervisor after a certain stage of work has been completed. As the consturction inspection task is dependant on construction schedule, however, it is difficult to plan inspection task systematically, resulting in increased supervision costs, delays in construction, and disputes. Therefore, this study aims to integrate inspection work with schedule management to systematize inspection procedures. Firstly, the inspection work is defined based on the construction supervision checklist. Then its relationship with the construction process, required time, and resources for inspection tasks are defined in construction schedule. Lastly, a process management program is used to assess the effects of applying the inspection work and examine changes in the overall construction period and process management. The proposed method in this study can support to plan construction inspection more systematically and to improve the effectiveness of construction quality management.

• 산업경영시스템학회지
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• 제10권15호
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• pp.33-38
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• 1987

In establishing Multi-Stage Machining process inspection procedures, however, where costs of inspection md defective products are often directly measurable, a better method for formulating inspection plans is available. If one of the primary interest of a manufacturing concern is to maximize profits, then optimal inspection plans ought to be selected so as to minimize costs. This paper is aimed to find a methodology of optimal inspection planning in Multi-stage Machining process and to develope a proper algorithm.

• 반도체디스플레이기술학회지
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• 제19권3호
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• pp.55-60
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• 2020

The hard mask photo-resist strip inspection system for the semiconductor wafer manufacturing process inspects the position of the circuit pattern formed on the wafer by measuring the distance from the edge of the wafer to the strip processing area. After that, it is an inspection system that enables you to check the process status in real time. Process defects can be significantly reduced by applying a tester that has not been applied to the existing wafer strip process, edge etching process, and wafer ashing process. In addition, it is a technology for localizing semiconductor process inspection equipment that can analyze the outer diameter of the wafer and the state of pattern formation, which can secure process stability and improve wafer edge yield.

• 디지털산업정보학회논문지
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• 제15권4호
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• pp.63-70
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• 2019

The subject of the simultaneous measuring system of base pattern and deposition pattern is a new research topic on a defect inspection of OLED. In this paper, we propose a new OLED inspection method that simultaneously measures standard and deposition pattern images. This method reduces unnecessary processes and tac time during OLED inspection. For an additional reduction of the tac time during pattern measurement, the ROI was configured to measure only in the designated ROI area instead of measuring the entire area of an image. During the ROI set-up, the value of effective deposition pattern area is included so that if the deposition pattern is out of the ROI zone, it would be treated as a defect before measuring the size and center point of the pattern. As a result, the tac time and inspection process could be shortened. The proposed method also could be applied to the OLED manufacturing process. Production of OLED could be increased by reducing tac time and inspection process.

• 한국정밀공학회지
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• 제13권2호
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• pp.37-47
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• 1996

This paper presents an automatic tele-inspection scheme for the remotely manufacturing process. The remote-manufacturing process is continuously monitored and a crucial process is captured by CCD Camera. The captured image is compressed by neural network and JPEG, and it is sent directly to the assembly plant for incoming inspection. Massive image data require broadband channel to transmit them to remote distance, but sender is able to transmit them to receiver in use common channel by compressing massive image data in the high ratio. After the receiver reconstructs the compressed image to be transmitted, the reconstructed image is also directly used for automatic inspection of the process. The Experimental results show that the proposed inspection mechanism could be effectively implemented for real applications.

• 한국경영과학회:학술대회논문집
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• 한국경영과학회 2007년도 추계학술대회 및 정기총회
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• pp.418-421
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• 2007

For Shock obsorber piston led is launched to the market through luring, milling, grooving, rolling, inspection and finally packing processes, To this time around 11 items, that is, out diameter and length etc..for the piston lod are inspected strictly as a total inspection. Piston Lod is being produced 30,000 a day and its excessively repeating inspection is getting induce repetition strain injury and reduce production rate as fatigue accumulation of worker increase inspection errors. Therefore, for the inspection process is severely needed a progressive improvement through the automation. In this study, we consider automation method of piston led inspection process and suggest an efficient automation strategy as improving the various problems in present manual inspection way.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.654-658
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• 2002

The purpose of this paper is to establish an effective featured based inspection planning system for OMM(On-Machine Measurement) process. In this system, an effective inspection process planning is accomplished by determining the number of measuring points, their locations and probing paths using fuzzy logic, Hammersley method and TSP problem. Also, an effective collision-free algorithm Is proposed based on the EZ-map analysis. All the inspection planning processes are performed based on the defined inspection features those are derived from the CAD database. Proposed inspection planning method is simulated for the given sample wrokpieces, and the results are analyzed. The results show that the proposed method can be successfully implemented in real OMM process.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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• pp.106-106
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• 2000

This study is to embody automatic inspection system of motor body panel by visual system. since it is inefficient to examine the adhesion condition of components with the naked eye, picture processing algorithm is presented to replace the existing manual inspection process with an automatic inspection process. The developed automatic inspection system presents the examination method of the adhesion condition of components with a ixed camera, which leads to an increase of the productivity and a reduction of manufacturing cost.

• 전자공학회논문지B
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• 제32B권1호
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• pp.73-84
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• 1995

New morphological positioning algorithm and inspection method are presented and compared with a method by means of the Hough transform. The positioning algorithm is the process of finding the center and the rotated angle of the surface mounted device (SMD). The inspection method is capable of detecting the location of broken or bent leads. In order to obtain the center and the orientation of the SMD rapidly, the Hough transform method utilizes feature points (concave points) and is executed on a DSP board. The proposed morphological method is implemented by using the morphological skeleton subsets, and an ultimate orientation is decided by the Hit-or-Miss transform (HMT). In the inspection process, two inspection methods also are presented. The first method utilizes the morphological methods, i.e., opening and closing. It is performed before the positioning process and called an initial inspection. The second method follows the positioning process and is performed by an inspection of intersections of rulers and the lead edge (or the skeleton). It is a ruling technique which is referred to as a detailed inspection. We find the morphological approach is preciser and faster than the Hough approach by the comparison of the proposed algorithms.

• International Journal of Quality Innovation
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• 제7권1호
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• pp.90-97
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• 2006

The process of producing software differs in many aspects from that of traditional manufacturing. Software is not manufactured in the classical sense. Development of software more closely resembles the development effort that goes into design new product [1-3]. In this article, we first describe the foundations of process improvement, which all processes can share. The process improvement differences between software and manufacturing process are then discussed, and a defect driven process inspection and improvement is introduced. Based on the discussion, two experiments were designed and the results of the results were collected. Through the comparison, we found that some efficient quality improvement approaches can be easily adapted in the software improvement and that the inspection efficiency is also significant.