• Journal of the Korean Wood Science and Technology
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• 제25권4호
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• pp.10-16
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• 1997

This study was carried out to improve coating structure by controlling the electrostatic interaction of coating components and by changing the coating structure of coated paper prepared with amphoteric and anionic latices. The results indicated that amphoteric latex copolymerized with carboxylic and amine groups had stronger interaction with other coating components than anionic latex with branched carboxylic group by controlling pH. These properties of amphoteric latex showed positive effects on viscosity rheology, and supernatant sediment of coating color. The coated paper using amphoteric latex had also produced more porous and smoother coverage of the coating layer than that using anionic latex. This porous and smooth coating layer showed better optical properties and printability than those of anionic latex such as opacity, porosity, ink set-off, and wet ink receptivity.

• 펄프종이기술
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• 제33권3호
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• pp.24-28
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• 2001

The utilization of wastepaper as a papermaking raw material is everlastingly required for the environmental protection of earth. However the recycling of wastepaper for this purpose cause another problem such as the increasing of the load of wastewater treatment, lower strength properties of paper, and poor printability, etc. The interest in the development of the environmentally friendly deinking technology is increased continuously. Thus, our research team have tried to apply the ozone to the deinking of white ledger and ONP, and obtained the positive results which can be considered as an alternative method for the conventional deinking method. The purpose of this study is to investigate the mechanism of ozone deinking. Styrene acrylate and polystyrene were treated with ozone and measured the change of molecular weight with the GPC. The molecular weight distribution obtained with GPC showed only slight increase by the ozone treatment, and gel formation by the polymerization was observed. Therefore the removal of ink particles with ozone treatment seems to be facilitated by the increase of the brittleness and decrease of adhesive property.

• 한국재료학회지
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• 제22권9호
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• pp.476-481
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• 2012

Among the various roll-to-roll printing technologies such as gravure, gravure-offset, and reverse offset printing, reverse offset printing has the advantage of fine patterning, with less than 5 ${\mu}m$ line width. However, it involves complex processes, consisting of 1) the coating process, 2) the off process, 3) the patterning process, and 4) the set process of the ink. Each process demands various ink properties, including viscosity, surface tension, stickiness, and adhesion with substrate or clich$\acute{e}$; these properties are critical factors for the printing quality of fine patterning. In this study, Ag nano ink was developed for reverse offset printing and the effect of polyvinylpyrrolidone(PVP), used as a capping agent of Ag nano particles, on the printing quality was investigated. Ag nano particles with a diameter of ~60 nm were synthesized using the conventional polyol synthesis process. Ethanol and ethylene glycol monopropyl ether(EGPE) were used together as the main solvent in order to control the drying and absorption of the solvents during the printing process. The rheological behavior, especially ink adhesion and stickiness, was controlled with washing processes that have an effect on the offset process and that played a critical role in the fine patterning. The electrical and thermal behaviors were analyzed according to the content of PVP in the Ag ink. Finally, an Ag mesh pattern with a line width of 10 ${\mu}m$ was printed using reverse offset printing; this printing showed an electrical resistivity of 36 ${\mu}{\Omega}{\cdot}cm$ after sintering at $200^{\circ}C$.

• 한국건축시공학회지
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• 제19권1호
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• pp.59-66
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• 2019

고로시멘트와 내한촉진제를 병용한 모르타르의 수축특성 및 수축성상에 미치는 영향에 대해 검토했다. 그 결과, OPC, BB 모두 내한촉진제를 첨가함에 따라 굳지 않은 성상에 미치는 영향은 작고, 초기재령부터 압축강도는 커진다. 또한, 내한 촉진제를 표준 사용량 이상으로 다량 사용할 경우에는 초기재령에 있어서의 팽창거동, 특히 강도발현과 팽창성의 관계에 대해 검토할 필요가 있다. 한편, 내한촉진제를 첨가함으로써 OPC, BB 모두 길이변화는 증가하는 경향을 확인할 수 있었다. 내한촉진제를 첨가함에 따라 직경 30nm 이하의 세공량, 특히 직경 20~30nm의 세공량 및 ink-bottle 세공량이 감소하여 수축량은 커지게 되며, 이 범위의 세공량의 변화가 수축성상에 미치는 영향이 크다고 판단된다.

• 대한기계학회논문집B
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• 제34권11호
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• pp.975-982
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• 2010

잉크젯으로 인쇄된 실버 도선의 레이저 소결에 관한 연구를 수행하였다. 요구적출(DOD) 방식의 잉크젯 프린터를 이용하여 서로 다른 두께의 유리와 PET 기판에 실버 나노 잉크를 이용한 미세 도선을 인쇄하였으며, 인쇄된 실버 도선에 집광된 레이저 빔을 조사하여 소결하였다. 레이저 강도와 조사 시간을 달리하여 소결된 실버 도선의 비저항을 측정하였으며, 오븐을 이용한 소결 처리 결과와 비교하였다. 단순화된 이론식으로부터 레이저 강도, 조사 시간, 표면 반사율 및 기판의 물성에 따른 온도 증가를 추산하였으며, 추산된 온도 증가와 레이저 소결에 의한 전기전도도 향상의 관계에 대하여 논의하였다.

• 마이크로전자및패키징학회지
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• 제29권2호
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• pp.99-105
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• 2022

칩사이즈가 작아짐에 따라 선폭 또한 미세화되면서 인터커넥션의 밀집정도가 증가하고 있다. 그로 인해 캐패시터 층과 전기전도층의 저항 차이로 인해 RC delay가 문제되고 있다. 이를 해결하기 위해서는 높은 전기전도도의 전극과 낮은 유전율의 유전체 개발이 요구된다. 본 연구에서는 PCB (Print Circuit Board)의 회로를 외부요인으로부터 보호하는 상용 PSR (photo solder resist)과 우수한 내열 및 저유전 특성을 보유한 PI (polyimide)를 혼합하여 저유전체 잉크 개발을 진행하였다. 그 결과 PSR과 PI를 10:3으로 혼합한 잉크가 가장 우수한 결과를 보였으며 20 GHz와 28 GHz에서 각각 유전 상수 약 2.6, 2.37을 보였고, 유전손실은 약 0.022, 0.016으로 측정되었다. 차후 어플리케이션 적용 가능성 검증을 위해 테프론에 제작된 다양한 선폭의 전송선로에 평가하였으며 그 결과, PSR만 사용했을 때보다 PI와 혼합한 저유전체 잉크를 사용한 전송선로의 손실이 S21에서 평균 0.12 dB 덜 감소한 결과를 보였다.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 춘계학술발표대회
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• pp.1.1-1.1
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• 2011

Printed electronics based on the direct writing of solution processable functional materials have been of paramount interest and importance. In this talk, the synthesis of printable inorganic functional materials (conductors and semiconductors) for thin-film transistors (TFTs) and photovoltaic devices, device fabrication based on a printing technique, and specific characteristics of devices are presented. For printable conductor materials, Ag ink is designed to achieve the long-term dispersion stability and good adhesion property on a glass substrate, and Cu ink is sophisticatedly formulated to endow the oxidation stability in air and even aqueous solvent system. The both inks were successfully printed onto either polymer or glass substrate, exhibiting the superior conductivity comparable to that of bulk one. In addition, the organic thin-film transistor based on the printed metal source/drain electrode exhibits the electrical performance comparable to that of a transistor based on a vacuum deposited Au electrode. For printable amorphous oxide semiconductors (AOSs), I introduce the noble ways to resolve the critical problems, a high processing temperature above $400^{\circ}C$ and low mobility of AOSs annealed at a low temperature below $400^{\circ}C$. The dependency of TFT performances on the chemical structure of AOSs is compared and contrasted to clarify which factor should be considered to realize the low temperature annealed, high performance AOSs. For photovoltaic application, CI(G)S nanoparticle ink for solution processable high performance solar cells is presented. By overcoming the critical drawbacks of conventional solution processed CI(G)S absorber layers, the device quality dense CI(G)S layer is obtained, affording 7.3% efficiency CI(G)S photovoltaic device.

• 펄프종이기술
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• 제48권1호
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• pp.134-141
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• 2016

Dampening in printing is not only used with plain water but also used with various substances like dampening additive, in order to improve the wetting property by lowering the surface tension and to control material for modifing the ink transfer characteristic with proper emulsification. We have studied the printing quality according to these, looking into interrelationship among the dampening solution's pH, electrical conductivity and IPA content, prescribing the proper usage and minimum usage of fountain solution and dampening additive. In this study, it shows good result when mixing at the 7 wt% dampening with additive solution, which is result from the color density of printed sheets in accordance with the change of dampening solution condition. And the printed density value calculated 1 hour after printing, it shows relatively safe value at the etch liquid 4 wt% and IPA addition 2 wt%. The dry down at this test showed similar results regardless of various dampening conditions on coated paper, but in case of uncoated paper, the dry down showed a quite gap of different due to the fast penetration to the paper.

• 한국재료학회지
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• 제26권4호
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• pp.216-221
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• 2016

A sintering process for copper based films using a rapid thermal process with infrared lamps is proposed to improve the electrical properties. Compared with films produced by conventional thermal sintering, the microstructure of the copper based films contained fewer internal and interfacial pores and larger grains after the rapid thermal process. This high-density microstructure is due to the high heating rate, which causes the abrupt decomposition of the organic shell at higher temperatures than is the case for the low heating rate; the high heating rate also induces densification of the copper based films. In order to confirm the effect of the rapid thermal process on copper nanoink, copper based films were prepared under varying of conditions such as the sintering temperature, time, and heating rate. As a result, the resistivity of the copper based films showed no significant changes at high temperature ($300^{\circ}C$) according to the sintering conditions. On the other hand, at low temperatures, the resistivity of the copper based films depended on the heating rate of the rapid thermal process.

• 한국응용과학기술학회지
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• 제14권2호
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• pp.115-122
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• 1997

The field of printing use to pressurization ink using screen gassamer that is called screen printing. Existing cleaning solvent using screen printing are the organic solvents including aromatic compounds carried with poisonous and stench. Besides, cleaning method of current screen printing are for the most part mixed cleaning method of dipping and polish. Using 1,1,1-TCE, CFC-113 alternative system cleaning solvent be substituted for existing cleaning solvent against screen printing ink measured the cleaning efficiency according to gravimetric analysis method and property change of gassamer according to Image Analyzer. Also, Cleaning process system carry with excellent cleaning efficiency studied which was proposed new cleaning process including ultrasonic and vibration cleaning process be substituted for existing mixed cleaning method of dipping and polish.