• Proceedings of the Korean Society of Near Infrared Spectroscopy Conference
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• 2001.06a
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• pp.1531-1531
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• 2001

A novel technique has been developed to observe the three-dimensional (3-D) distribution of chemical components in biological materials using both automatic sectioning microtome and infrared microscope. The 3-D image was reconstructed based on the relationship between the content and the absorbancy of specified wavelength for chemical components. By using the automatic sectioning microtome, the kernel of rice sample fixed in paraffin was sequentially sliced with the thickness of $5\;\mutextrm{m}$ after pasting the sliced sectional specimens on an adhesive tape. The chemical components of the specimens, which are placed on the X-Y controlling stage with positioning accuracy of ${\pm}10\;\mutextrm{m}$, were analyzed by the infrared microscope. The 3-D images demonstrated that the zonal protein about $200\mutextrm{m}$ in width was observed mainly at the outer parts of a rice particle, and carbohydrates entirely. These images can be observed by choosing arbitrary observation angle. The result indicated that the developed technique could be applied 3-D information to investigate intrinsic chemical components but also residual pesticides as well as bacteria contamination for agricultural produce.

• Journal of the Korean Society for Nondestructive Testing
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• v.35 no.3
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• pp.200-205
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• 2015

An ultra-precise infrared microscope consisting of a high-resolution infrared objective lens and infrared sensors is utilized successfully to obtain location information on the plane and depth of local heat sources causing defects in a semiconductor device. In this study, multi-layer semiconductor chips are analyzed for the positional information of heat sources by using a lock-in infrared microscope. Optimal conditions such as focal position, integration time, current and lock-in frequency for measuring the accurate depth of the heat sources are studied by lock-in thermography. The location indicated by the results of the depth estimate, according to the change in distance between the infrared objective lens and the specimen is analyzed under these optimal conditions.

• Vacuum Magazine
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• v.2 no.1
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• pp.17-20
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• 2015

In this article, a historical and scientific review on the development of an ultrafast electron microscope is supplied, and the challenges in further improvement of time resolution under sub-picosecond or even sub-femtosecond scale is reviewed. By combining conventional scanning electron microscope and femtosecond laser technique, an ultrafast electron microscope was invented. To overcome its temporal resolution limit which originates from chromatic aberration and Coulomb repulsion between individual electrons, a generation of electron pulse via strong-field photoemission has been investigated thoroughly. Recent studies reveal that the field enhancement and field accumulation associated with the near-field formation at sharply etched metal nanoprobe enabled such field emission by ordinary femtosecond laser irradiation. Moreover, a considerable acceleration reaching 20 eV with near-infrared laser and up to 300 eV acceleration with mid-infrared laser was observed, and the possibility to control the amount of acceleration by varying the incident laser pulse intensity and wavelength. Such findings are noteworthy because of the possibility of realizing a sub-femtosecond, few nanometer imaging of nanostructured sample.in silicon as thermoelectric materials.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.827-828
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• 2012

• Journal of Korean Society of Industrial and Systems Engineering
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• v.36 no.2
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• pp.49-55
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• 2013

When developing a product, ensuring the quality and reliability is essential. Reliability process is always underestimated compared to its importance, especially in the field of domestic medical devices. In this paper, reliability process developed for near-infrared solid microscope, based on a variety of existing practices and other product process. The following findings were obtained as research progressed. First, learning about the medical equipment needed to assure the quality and reliability standards. Second, reliability process established to design a product in the field of medical devices.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.12
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• pp.15-21
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• 2010

Recently, there is a demand for a thermal imaging microscope in the medical field as well as the semi-conductor industry Although the demand of the advanced thermal imaging microscope has been increased, it is very difficult to obtain the technology of developing a thermal camera, because it is used for defense industry. We developed the ${\times}5$ zoom microscope which has $3\;{\mu}m$ spatial resolution to research the design and fabrication of the IR (Infrared) optical system. The optical system of the IR microscope consists of four spherical lenses and four aspheric lenses. We verified individual sensitivity of each optical parameter as the first order approach to the analysis. And we also performed structure and vibration analysis. The optical elements are fabricated using Freeform 700A. The measurement results of surface roughness and form accuracy using NT 2000 and UA3P are Ra 2.36 nm and P-V $0.13\;{\mu}m$. Finally we ascertained resolution power of $3\;{\mu}m$ using USAF (United State Air Force) 1951 IR resolution test chart.

• Textile Coloration and Finishing
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• v.21 no.3
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• pp.19-25
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• 2009

Polymerization of tetraethoxysilane on a glass substrate was investigated by remote microwave plasma using argon with portions of nitrous oxide as carrier gas. Transparent layer like a thickness of 0.5 ${\mu}m$ 3 ${\mu}m$ were obtained, differing in chemical composition, depending on plasma power and treatment time as well as on ageing time. In general the milder the treatment and the shorter the ageing was, the higher was the content of organic structural elements in the layer. We have identified that the chemical structure of our samples composed of mainly Si O and Si C groups containing aliphatics, carbonyl groups. These results were obtained by X ray photon spectroscopy, Fourier transformed infrared spectroscopy, and scanning electron microscope combined with Energy dispersive X ray spectroscopy.

• Journal of Korean Institute of Fire Investigation
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• v.11 no.1
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• pp.37-40
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• 2008

This paper deals with damage patterns of cabinet panel for low voltage deteriorated by flame. In order to analyze damage patterns, we used Metallurgical Microscope, x-ray system, and Fourier Transform Infrared spectroscopy. Firstly, Metallurgical microscope was used for analysis of electrical causes, such as electric short and overload Secondly, X-ray system was used for analysis of internal characteristics of circuit breakers. Lastly, Fourier Transform Infrared spectroscopy was used for analysis of damage direction by flame.

• Proceedings of the Korea Institute of Fire Science and Engineering Conference
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• 2008.04a
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• pp.269-272
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• 2008

This paper deals with damage patterns of cabinet panel for low voltage deteriorated by flame. In order to analyze damage patterns, we used Metallurgical Microscope, x-ray system, and Fourier Transform Infrared spectroscopy. Firstly, Metallurgical microscope was used for analysis of electrical causes, such as electric short and overload. Secondly, X-ray system was used for analysis of internal characteristics of circuit breakers. Lastly, Fourier Transform Infrared spectroscopy was used for analysis of damage direction by flame. The following results were obtained.

• The Journal of Korean Academy of Prosthodontics
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• v.50 no.1
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• pp.53-60
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• 2012

Purpose: The purpose of this study was to compare Ni-Cr alloy property of gas-oxygen torch soldering and infrared welding using optical microscope and Electron Probe Micro Analyzer (EPMA). Materials and methods: Ni-Cr alloys were casted for specimens. Specimens had 3.0 mm diameter, 30.0 mm length and were divided into two groups. Each group had 4 specimens. One group was for gas-oxygen torch soldering and the other was infrared welding. Specimens were cut with low-speed disc and soldered each other with gas-oxygen torch and infrared machine. After soldering and polishing, specimens were observed at 3 points (soldering point, 5 mm distance point, 10 mm distance point) with optical microscope and analyzed 3 points (soldering point, 5 mm distance point, 10 mm distance point with EPMA. Results: The results of this study were as follows: 1. The observation of gas-oxygen torch soldering at 10 mm distance point under the optical microscope was not founded any specific surface properties, but some crack lines were observed at 5 mm distance and soldering point. 2. There were no crack lines were founded at the observation of infrared welding at 10 mm distance and 5 mm distance points under the optical microscope. However, at the 5 mm distance, the surface was not smooth enough compared with at 10 mm distance point. Some crack lines were observed at the welding point as well. 3. In the EPMA analysis of the gas-oxygen torch soldering, the component of Ni was increased by 4.5%, Cr was increased by 7.5% than that of the Ni-Cr alloy at the 10.0 mm distance. At the 5 mm distance, the component of Ni was decreased by 6.1%, Mo was increased by 9.0% than that of the Ni-Cr alloy but Cr was equally shown at the 5.0 mm distance. Only Ni was shown at the soldering point. 4. In the EPMA analysis of the infrared welding, the component of Ni was increased by 9.1%, Cr was increased by 0.4% than that of the Ni-Cr alloy but Al was equal at the 10.0 mm distance. At the 5 mm distance, the component of Ni was increased by 4.7%, Cr was increased by 4.7% and Al was increased by 0.1% than that of the Ni-Cr alloy. At the welding point, the component of Ni was increased by 8.8%, Cr was increased by 8.2% than that of the Ni-Cr alloy. Conclusion: From these results, at the 5 mm distance from the soldering point, the surface of the infrared welding was more smoother than that of the gas-oxygen torch soldering. On the EPMA analysis, the component of the specimens with infrared welding was more similar than that of the gas-oxygen torch soldering compared with the component of the Ni-Cr alloy.