• Proceedings of the Korean Society of Computer Information Conference
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• 2023.01a
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• pp.341-342
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• 2023

배터리 기술 고도화 및 기술표준 강화에 따라 완성차 제조사와 배터리 업계간 활발한 협업이이어질 전망이다. 또한 기존 배터리 제조사들이 활발한 증설 및 밸류 체인 확장을 통한 기술가격 경쟁력 격차 유지에 적극적으로 나서고 있어, 향후 시장 주도권 경쟁이 가속화될 것으로 전망된다. 배터리의 온도 상승은 배터리 효율을 낮추는 원인이며, 배터리 온도 제어가 전기자동차 차량의 전체 성능 향상에 중요한 부분이라고 할 수 있다. 본 연구는 실제 Battery Pack 실험 전 열유동해석을 통해 배터리온도 상승추이 및 냉각효율 검증을 진행하는 과정에서 발생하는 과도한 시간 소요를 줄이기 위해 Machine Learning 을 활용하여 검증 효율 및 설계 효율을 높이는데 그 목적이 있으며, CFD를 활용한 배터리 효율 최적화 설계를 하는 기존 모델 대비 30%~50%정도의 성능향상을 예측할 수 있다.

• Proceedings of the Korean Society of Computer Information Conference
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• 2024.01a
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• pp.339-341
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• 2024

본 논문에서는 전기 자동차 배터리 팩 설계에서 성능 예측을 위해 전산유체해석 및 Long Short-Term Memory (LSTM)를 활용한다. 두 계산 모두의 예측이 상당한 유사성을 나타내며, 전산유체해석은 시스템 유체 역학을 고려한 상세한 물리 모델을 제공하고, LSTM은 시계열 데이터를 기반으로 한 딥러닝 모델로 효과적으로 패턴을 파악, 향후 온도 상승을 예측한다. 결과는 두 접근 모두가 효과적인 예측을 제공하며 향후 전기 자동차 배터리 팩 설계 및 최적화에서 종합적인 접근의 필요성을 강조한다. 특히, LSTM 기반 예측에 소요되는 시간은 계산 유체 역학의 약 25%로, 약 일주일 정도로 빠르게 확인 가능하다. 이는 현대 산업 환경에서 시간적 효율성이 중요한 측면을 강조하며, 계산 유체 역학의 상세한 물리 모델링과 LSTM의 빠른 예측 속도를 결합한 설계 방법론을 제안한다.

• Asia pacific journal of information systems
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• v.12 no.2
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• pp.137-162
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• 2002

As the ERP system become recognized as a strategic weapon of a firm, the way how to implement the system successfully has been an important issue for both practitioners and the academic community. The objective of this research is to identify the critical success factors influencing the implementation of the ERP system and to suggest the tasks to be considered first for the effective implementation of the system. The results from the analysis of data collected from the 169 firms among those which have implemented either the Oracle package or the SAP package in Korea are as follows. The important factors for the successful implementation of the ERP system include the strength of rivalry among competing firms; the degree to which information systems are matured; the information systems strategy of a firm; the support and concern from the top; and the technical openness between the ERP system and the legacy system such as network, hardware, and software. The tasks to be considered first for the effective implementation of the ERP system cover the same degree of feeling between labor and management on the threat to survive; the formulation of information systems strategy at the strategic level; CEO's strong will and resolution; the process automation and informatization of a firm; and the infrastructure including intranet and databases.

• Journal of the Korea Society of Computer and Information
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• v.12 no.1 s.45
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• pp.243-252
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• 2007

In recent years, there has been a growing concern about enterprise resource planning (ERP) implementation in small and medium-sized enterprises (SMEs). In this study, we investigate the relationship among ERP software qualify, vendor support, user information satisfaction. and performance of ERP implementation. The empirical findings of this paper will allow SMEs to identify the importance of relationships with vendors and software itself for the successful implementation of ERP systems. The results provide a useful basis for the SMEs which have limited information capability to focus their attention on the software quality and vendor support in overcoming difficulties and obstacles facing the ERP implementation.

• 한국데이터정보과학회:학술대회논문집
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• 2005.10a
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• pp.103-115
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• 2005

Mathematical packages have the advantages of symbolic computation and powerful graphics interface in contrast with statistical packages. We can use mathematical packages as a support tool in education of mathematics for statistics.

• Information Display
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• v.4 no.5
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• pp.16-18
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• 2003

• Journal of KIISE:Computer Systems and Theory
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• v.32 no.2
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• pp.75-84
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• 2005

This research is to design a high performance NAND-type flash memory package with a smart buffer cache that enhances the exploitation of spatial and temporal locality. The proposed buffer structure in a NAND flash memory package, called as a smart buffer cache, consists of three parts, i.e., a fully-associative victim buffer with a small block size, a fully-associative spatial buffer with a large block size, and a dynamic fetching unit. This new NAND-type flash memory package can achieve dramatically high performance and low power consumption comparing with any conventional NAND-type flash memory. Our results show that the NAND flash memory package with a smart buffer cache can reduce the miss ratio by around 70% and the average memory access time by around 67%, over the conventional NAND flash memory configuration. Also, the average miss ratio and average memory access time of the package module with smart buffer for a given buffer space (e.g., 3KB) can achieve better performance than package modules with a conventional direct-mapped buffer with eight times(e.g., 32KB) as much space and a fully-associative configuration with twice as much space(e.g., 8KB)

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.17-26
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• 2010

Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Experiments are conducted for two types of WB-PBGA packages that have Pb-Sn solder and lead-free solder as joint interconnections. Using real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Bending deformations of the assemblies and average strains of the solder balls are investigated and compared for the two type of WB-PBGA package assemblies. Results show that shear strain in #3 solder ball located near the chip shadow boundary is dominant for the failure of the package with Pb-Sn solder, while normal strain in #7 most outer solder ball is dominant for that with lead-free solder. It is also shown that the package with lead-free solder has much larger bending deformation and 10% larger maximum effective strain than the package with Pb-Sn solder at same temperature level.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.49 no.7
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• pp.1-9
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• 2012

In this paper, resistance temperature detector (RTD) integrated into the LED package is proposed in order to solve the temperature dependence of LED's optical properties. To measure the package temperature in real time, the RTD type temperature sensor having excellent accuracy and linearity between temperature change and resistance change was adopted. A stable metallic film is required for long term reliability and stability of the RTD type temperature sensor. Therefore, deposition and annealing condition for the film were determined. Based on the determined condition, the RTD type temperature sensor with the sensitivity of about $1.560{\Omega}/^{\circ}C$ was fabricated inside the LED package. In order to configurate the LED package system keeping the constant brightness regardless of the temperature, additional conversion circuit and control circuit boards were fabricated and added to the fabricated LED package. The proposed system was designed to compensate the light intensity caused by temperature change using the variable duty rate of driving current. As a result, the duty rate of PWM signal which is the output signal of the configurated system was changed with the temperature change, and the duty rate was similarly varied with the target duty rate. Consequently, it was focused the fabricated RTD can be used for compensating the optical properties of LED and the LED package which exhibits constant brightness regardless of the temperature change.

• The Journal of the Convergence on Culture Technology
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• v.4 no.2
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• pp.191-196
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• 2018

Recently, consumers' taste has been diversified, consumption pattern has changed, and product package design has been gradually developed. The product packaging design should be made to be able to know the contents accurately, and it should have the charm that attracts consumers' attention and makes them want to buy the goods. In addition, product design should motivate consumers to buy according to brand naming, package layout, content expression method, taste color, as well as graphic elements that induce visual effects.The graphic elements that express the image of the contents in a package design of the product at a glance are the most essential elements to enhance the value added of the product and to induce the purchase motivation and rationalization of the consumer. This study is a study on visual image symbol image using visual information metadata in livestock products. It examines cases of various livestock packages and presents graphical elements that can visualize livestock images at a glance as metadata elements. We will pursue the premiumization of livestock products, raise brand value, and offer differentiating design strategies for economic benefits as well as potential for revitalizing the livestock market.