• 한국정보시스템학회지:정보시스템연구
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• 제18권2호
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• pp.127-150
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• 2009

Although many employees in the logistics/small package express companies are using mobile information systems. there is little research on the individual impacts of adopting mobile information systems in the distribution area. Therefore, this study attempts to develop the research model to evaluate individual impacts on using mobile information systems which are frequently utilized in logistics and small package express companies. In order to propose the research model, we attempt to incorporate technology acceptance model and IS success model to evaluate individual impacts on using mobile information systems. To verify the research model, we collected 225 data from staffs who have mobile IT system in distribution and logistics area. We also verified the validity and reliability by using SEM(structural equation modeling). As a results, we found that system use, cognitive judgement and attitude can be the key variables to improve individual impacts by using mobile information system. We further found that perceived usefulness can be ere of the Imp factors to improve the individual impacts. Based on out findings, we can understand that this research model can provide a deeper understanding of individual impacts of mobile information systems.

• Journal of the Korean Data and Information Science Society
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• 제24권4호
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• pp.931-940
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• 2013

For analysis of clustered survival data, the inferences of parameters in semi-parametric frailty models have been widely studied. It is also important to investigate the potential heterogeneity in event times among clusters (e.g. centers, patients). For purpose of this analysis, the interval estimation of frailty is useful. In this paper we propose a visualizing method to present confidence intervals of individual frailties across clusters using the frailtyHL R-package, which is implemented from h-likelihood methods for frailty models. The proposed method is demonstrated using two practical examples.

• 한국정밀공학회지
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• 제28권2호
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• pp.193-201
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• 2011

Clamp type transferring mechanism for package substrate's wet processes was newly developed instead of conventional roller type transferring mechanism. Clamp type transferring mechanism has the advantages of reducing the panel deflection and of minimizing the contact problem between the panel and the transferring mechanism. Individual clamp of the mechanism has two distinct mechanical functions which are perfectly fixing a panel during the transferring and generating adequate tension for the panel. To determine the mechanical parameters of the clamp, panel deflection simulation was conducted and the result was verified by the panel deflection measurement. Also, fixing angle of a clamp could be determined by the free body force analysis of individual clamp. Finally clamp type transferring mechanism was actually manufactured and the transferring performance was verified during the water spraying condition of the package substrate's wet processes.

• 한국포장학회지
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• 제20권1호
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• pp.1-6
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• 2014

신선 농산물의 필름포장은 적정의 저온저장 시에는 적정 변형기체조건 유지로 품질유지가 양호하나, 상대적으로 온도가 높은 판매유통단계에서는 적정조건의 유지가 어려워 품질손실이 발생한다. 저온저장과 판매유통단계에서 농산물 주위에 적정 변형기체(modified atmosphere, MA)조성을 유지하는 개별(1차)포장/2차 포장의 결합 및 해체 개념을 설계한 마스터 포장 시스템이 최근에 제안되고, 단감, 큰느타리 버섯, 밤, 딸기에 대해서 적용된 바 있다. 온도에 따라 다른 농산물의 호흡과 포장의 기체이동 현상의 상호관계를 이용한 마스터 포장 시스템의 개념을 체계화하고, 적정 MA 유지를 위한 설계변수의 조합을 살펴보았다. 바람직한 포장기체조성을 형성 유지할 수 있는 마스터 포장 시스템의 설계를 위한 수학적 모델이 제시되었다. 아울러 마스터 포장 시스템의 이점과 함께 적용을 위한 한계에 대해서 논의하였다. 마스터 포장 시스템의 적용 확대를 위한 미래의 연구방향을 제시하였다.

• 한국식품영양과학회지
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• 제45권3호
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• pp.402-408
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• 2016

생표고버섯 생산 농가에서 일반 판매처까지 보관 및 유통 단계를 거치면서 변화하는 온도 조건에 노출된 제품의 품질을 향상하기 위해 1차 개별포장과 2차 포장을 결합한 active 마스터 포장 시스템을 적용하였다. 외부 2차 포장에는 이산화탄소 흡수제인 $Ca(OH)_2$와 수분 흡수제인 고흡수성 고분자를 sachet 형태로 만들어 포장에 적용했다. 낮은 온도로 유지되는 저장단계에서는 1차 개별포장과 2차 포장의 결합한 형태로 수송 및 유통되고, 높은 온도에 노출되는 판매단계에서는 2차 포장을 해체한 후 판매가 진행되도록 하였다. 판매단계에서 2차 포장을 해체하면 온도 상승으로 인한 호흡 증가로 포장 내 산소 고갈과 높은 농도의 이산화탄소 축적을 막을 수 있으며, 급격한 생리장해를 억제할 수 있다. 수송 및 저장 단계에서 포장 내 기체조성과 온습도를 측정하고, 판매단계에서 포장을 개봉하여 생표고버섯의 품질을 측정하였다. 관행적인 방법인 통기성 천공 포장을 대조구로 하여 같은 조건으로 수송 및 유통, 판매를 통해 처리구 포장의 품질과 비교하였다. 이산화탄소 흡수제인 $Ca(OH)_2$와 수분 흡수제인 고흡수성 고분자를 봉지 형태로 만들어 함입시킨 active 마스터 포장 시스템은 유통 저장 단계에서 포장의 기체 이동과 이산화탄소 흡수제의 효과로 인하여 개별 포장내에 산소 농도가 9~11%, 이산화탄소 농도가 1~4% 범위를 얻을 수 있어서 품질보존에 도움이 되는 변형기체가 형성되었다. 처리구 간에 따른 경도와 표면색택, 호기성 세균수 등의 품질 변화에 대해서는 유의적인 차이를 확인할 수 없었으나, 대조구에 비해 이산화탄소 흡수제와 수분 흡수제의 처리구가 부패율 감소와 곰팡이/효모수의 성장억제 효과를 얻을 수 있었다. 농가에서 포장 전 예건처리를 할 수 없는 상황이기 때문에 계절적인 요인에 따라 이산화탄소 흡수제와 수분 흡수제의 양을 조절한다면 active 마스터 포장 시스템의 효과를 볼 수 있을 것으로 생각한다.

• 산경연구논집
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• 제11권1호
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• pp.29-38
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• 2020

Purpose: Understanding which product types of overseas travel (free independent travel vs. package travel) consumers will choose is one of the key issues of marketing and consumer behavior in travel agency management. Prior studies on overseas travel type preferences mainly focused on comparing regional differences (e.g., Asian vs. Westerner, or Korean vs. Australian, or Korean vs. Japanese, or American, French, Italian vs. Japanese) influencing the choice of overseas travel type. Another researchers focused on comparing cultural differences (e.g., individualism vs. collectivism, or individualistic culture vs. collectivistic culture), subcultural difference (e.g., acculturation; Koreans living in Republic of Korea vs. Koreans living in Australia), travel lifestyle, and socio-demographics (e.g., age, gender, income level, education level, marital status, occupation etc.). However, there are few studies that identify individual psychological differences (i.e., individual psychological differences within the same culture) influencing the choice of overseas travel type. Self-construal is a psychological factors that greatly influences choice behavior. The purpose of this study was to examine the role of self-construal as an antecedent variable influencing choice of overseas travel product type. Research design, data and methodology: To achieve the purpose of this study, the questionnaire survey method was used. Self-construal items composed of independent self-construal items and interdependent self-construal items. Product types of overseas travel were free independent travel (FIT) type versus package travel type. In this study, the correlation coefficient between independent self-construal and interdependent self-construal was nonsignificant. It meant that the relationship between independent self-construal and interdependent self-construal was orthogonal. Therefore it was analyzed that independent self-construal and interdependent self-construal separately. Reliability analysis, factor analysis, and logistic regression analysis (controlling gender and age) was used as the data analysis method. Results: According to the results of this study, the stronger independent self-construal, the more preference for the free independent travel type rather than package travel, and the stronger interdependent self-construal, the more preference for the package travel type rather than free independent travel. Conclusions: Self-construal is an antecedent variable influencing the choice of travel type. Travel agencies must consider the consumer's self-construal (independent self-construal vs. interdependent self-construal) before planning and designing overseas travel products.

• JSTS:Journal of Semiconductor Technology and Science
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• 제12권2호
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• pp.139-149
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• 2012

A 3D stacked IC is made by multiple dies (possibly) with heterogeneous process technologies. Therefore, die-to-die variation in 2D chips renders on-package variation (OPV) in a 3D chip. In spite of the different variation effect in 3D chips, generally, 3D die stacking can produce high yield due to the smaller individual die area and the averaging effect of variation on data path. However, 3D clock network can experience unintended huge clock skew due to the different clock propagation routes on multiple stacked dies. In this paper, we analyze the on-package variation effect on 3D clock networks and show the necessity of a post silicon management method such as body biasing technique for the OPV induced 3D clock skew control in 3D stacked IC designs. Then, we present a parametric yield improvement method to mitigate the OPV induced 3D clock skew.

• Journal of Ginseng Research
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• 제17권3호
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• pp.219-223
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• 1993

Assessment of root weight grade system for the numeral definition in Korea ginseng was tried by investigation of 13 boxes of the 15-root-grade of 4-year-old white ginseng as a model. In this case satisfaction to theoretical value was 58% in root weight and 50% in root number. The coefficient of variation (CV) was high (35%) for individual root weight in package. The CV of tap root weight 1 among package is low (7.1%) even though there was no significant correlation between tap root weight : and lateral root weight among roots. The mean percentage of tap root to root weight in each package ranged 61 to 74% with CV range of 16.5 to 33.2%. The CV was not much different between 1st and 2nd lateral root weight and the means was above 60%. Strict practice of numeral definition of root weight grade system will be prerequisite for chemical standardization of Korea ginseng.

• 한국정밀공학회지
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• 제20권10호
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• pp.183-190
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• 2003

Major device failures such as die cracking, interfacial delamination and warpage in flip chip packages are due to excessive heat and thermal gradients- There have been significant researches toward understanding the thermal performance of electronic packages, but the majority of these studies do not take into account the combined effects of thermo-mechanical interactions of the different package constituents. This paper investigates the thermo-mechanical performance of flip chip package constituents based on the finite element method with thermo-mechanically coupled elements. Delaminations with different lengths between the silicon die and underfill resin interfaces were introduced to simulate the defects induced during the assembly processes. The temperature gradient fields and the corresponding stress distributions were analyzed and the results were compared with isothermal case. Parametric studies have been conducted with varying thermal conductivities of the package components, substrate board configurations. Compared with the uniform temperature distribution model, the model considering the temperature gradients provided more accurate stress profiles in the solder interconnections and underfill fillet. The packages with prescribed delaminations resulted in significant changes in stress in the solder. From the parametric study, the coefficients of thermal expansion and the package configurations played significant roles in determining the stress level over the entire package, although they showed little influence on stresses profile within the individual components. These observations have been implemented to the multi-board layer chip scale packages (CSP), and its results are discussed.

• 한국재료학회지
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• 제19권5호
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• pp.288-292
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• 2009

This article shows various factors that influence the thermal-cycling reliability of semiconductor devices utilizing the lead-on-chip (LOC) die attach technique. This work details how the modification of LOC package design as well as the back-grinding and dicing process of semiconductor wafers affect passivation reliability. This work shows that the design of an adhesion tape rather than a plastic package body can play a more important role in determining the passivation reliability. This is due to the fact that the thermal-expansion coefficient of the tape is larger than that of the plastic package body. Present tests also indicate that the ceramic fillers embedded in the plastic package body for mechanical strengthening are not helpful for the improvement of the passivation reliability. Even though the fillers can reduce the thermal-expansion of the plastic package body, microscopic examinations show that they can cause direct damage to the passivation layer. Furthermore, experimental results also illustrate that sawing-induced chipping resulting from the separation of a semiconductor wafer into individual devices might develop into passivation cracks during thermal-cycling. Thus, the proper design of the adhesion tape and the prevention of the sawing-induced chipping should be considered to enhance the passivation reliability in the semiconductor devices using the LOC die attach technique.