• Journal of the Korean Society for Precision Engineering
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• v.27 no.12
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• pp.67-74
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• 2010

The fabrication method of aspheric lens is changed from machining to press molding so as to improve the productivity. In the case of the press molding method, the temperature control of the molding die is most impotent, because the temperature of each molding die determines the quality of lens. But any practical method for direct measuring of the lens temperature and the die internal temperature is yet unknown. Besides, in the case of the press molding system in which the heating and pressing and cooing of a die is done at one work station, the cycle time for the system is yet too long. The paper shows an improved structure of radiant sequential system in which the heating and pressing and cooing of dies is done at individual work station so as to cut down the cycle time. To know the die internal temperature, numerical results are given using ANSYS. An experimental radiant sequential system is developed and tested. Finally, the Taguchi method is applied in order to optimize the setting conditions of individual work station.

• Journal of information and communication convergence engineering
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• v.13 no.3
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• pp.172-179
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• 2015

Face-to-face (F2F) bonding in three-dimensional integrated circuits (3D ICs), compared with other bonding styles, is closer to commercialization because of its benefits in terms of density, yield, and cost. However, despite the benefits that F2F bonding expect to provide, it's physical nature has not been studied thoroughly. In this study, we, for the first time, extract cross-die (inter-die) parasitic elements from F2F bonds on the full-chip scale and compare them with the intra-die elements. This allows us to demonstrate the significant impact of field sharing across dies in F2F bonding on full-chip noise and critical path delay values. The baseline method used is the die-by-die method, where the parasitic elements of individual dies are extracted separately and the cross-die parasitic elements are ignored. Compared with this inaccurate method, which was the only method available until now, our first-of-its-kind holistic method corrects the delay error by 25.48% and the noise error by 175%.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.2
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• pp.139-149
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• 2012

A 3D stacked IC is made by multiple dies (possibly) with heterogeneous process technologies. Therefore, die-to-die variation in 2D chips renders on-package variation (OPV) in a 3D chip. In spite of the different variation effect in 3D chips, generally, 3D die stacking can produce high yield due to the smaller individual die area and the averaging effect of variation on data path. However, 3D clock network can experience unintended huge clock skew due to the different clock propagation routes on multiple stacked dies. In this paper, we analyze the on-package variation effect on 3D clock networks and show the necessity of a post silicon management method such as body biasing technique for the OPV induced 3D clock skew control in 3D stacked IC designs. Then, we present a parametric yield improvement method to mitigate the OPV induced 3D clock skew.

• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.1-7
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• 2023

Recently, in the semiconductor industry, memory device market is focusing on producing ultra-thin wafers for high integration. In the wafer manufacturing process, wafers after backgrinding and CMP process must be picked up as individual dies and subjected to be peeled off from the dicing tape. However, ultra-thin dies are vulnerable to the possibility of breakage and failure in their thickness and size. This research studies the mechanism of peeling a die with a high-aspect ratio using a thermopneumatic method instead of a die ejector with physical pins. Setting compressed air and the temperature as main factors, we determine the success of the digester using thermopneumatic system and analyze the good die to find the possibility of making mass-production equipment.

• The Journal of Korean Academy of Prosthodontics
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• v.43 no.5
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• pp.622-632
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• 2005

Statement of problem: Silicone Index Tooth Tray impression system which does not use gingicord has a shortcoming. It takes time to remove internal wall of Silicone Index Tooth Tray for space of wash impression material. Purpose: This study was to evaluate whether providing certain space to impression body can prevent from doing complicated laboratory work. Material and methods: After mounting metal dies with shoulder and chamfer margins arbiturarily, SITT was produced using $Blu-mousse^(R)$. In one experimental group, wash impression was taken using $Fit-tester^(R)$ without removing interior surface of SITT and in the other group, wash impression was taken using $Fit-tester^(R)$ providing 0.5mm space in the SITT and then compared the differences in two groups. Results: 1. There was no significant difference between a group which did not allow space and a group which granted equal 0.5mm space. 2. There was no significant difference between gingival diameter, occlusal diameter of metal die that has shoulder margin and gingival diameter, occlusal diameter of metal die that has chamfer margin. 3. There was no significant difference between a group which did not take pick-up impression and a group which took pick-up impression through relining method using SITT 4. There was no significant difference between a group that poured immediately after taking primary impression and a group that poured after removing poured stone die. Conclusions: When taking an impression of an abutment using SITT impression system, it is considered to obtain clinically identical results between a group that did not grant a 0.5mm space within SITT for wash impression and a group which invest a space. Furthermore, it is considered possible to produce an individual die through secondary pouring.

• Transactions of the Korean Society of Mechanical Engineers
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• v.12 no.4
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• pp.712-720
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• 1988

This paper describes some development of computer-aided system called "COLD-FORMING" and "DESIGN-DIE". "COLD-FORMING" is designed for the forming sequence and "DESIGN-DIE" for the die design of press forming rotationally symmetric parts. The computer program developed is used in interactive and written in BASIC. Design rules for process planning and die design are formulated from process limitations, plasticity theory and know-how of experience of the field. "COLD-FORMING" capabilities include (1) analysis of forming sequence and recognition of individual operation involved each step, (2) determination of intermediate shape and dimensions, (3) calculation of forming loads to perform each forming operation and (4) graphic out put for the operation sheet. "DESIGN-DIE" capabilities include (1) optimum die design corresponding to the output of "COLD-FORMING" and (2) graphic output for the die design.of "COLD-FORMING" and (2) graphic output for the die design.ie design.

• Journal of Power System Engineering
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• v.11 no.2
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• pp.51-57
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• 2007

As a shot sleeve in die casting plays a critical role in delivering molten metal to a die cavity, any disruption to its function in the injection stage results in deterioration of the quality of final castings. To guarantee a smooth operation of a shot sleeve, its structural stability should be maintained. Despite the simple geometry, design of shot sleeve is based on individual engineer's experience and no agreement on the design is present. In this study, we newly propose a systematic methodology to determine a minimum wall thickness of a shot sleeve to prevent yielding or plastic deformation. Analytical calculations incorporating numerical analysis produce a rational design rule for minimum thickness of a shot sleeve subject to metal intensification pressure and geometric die constraint. To validate the proposed design guideline, authors present real data on a collection of actual shot sleeves. Upon checking their conformity to the new design rule, we discovered a strong correlation between the design of wall thickness and premature failures.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.2
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• pp.202-210
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• 2011

The fabrication method of aspheric lens is changed from machining to press molding so as to improve the productivity. In the case of the press molding method, the temperature control of the molding die is most important, because the temperature of each molding die determines the quality of lens. But any practical method for direct measuring of the lens temperature and the die internal temperature is yet unknown. Besides, in the case of the press molding system in which the heating and pressing and cooing of a die is done at separate work stations, the lens productivity of the system for small lens is yet too low. The paper shows an improved structure of convective sequential system, the lens productivity of which is three times as many as the conventional convective system. To know the die internal temperature, numerical results are given using ANSYS. A new convective sequential system is developed and tested. Finally, the Taguchi method is applied in order to optimize the setting conditions of individual work station of the system.

• Korean Journal of Materials Research
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• v.19 no.5
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• pp.288-292
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• 2009

This article shows various factors that influence the thermal-cycling reliability of semiconductor devices utilizing the lead-on-chip (LOC) die attach technique. This work details how the modification of LOC package design as well as the back-grinding and dicing process of semiconductor wafers affect passivation reliability. This work shows that the design of an adhesion tape rather than a plastic package body can play a more important role in determining the passivation reliability. This is due to the fact that the thermal-expansion coefficient of the tape is larger than that of the plastic package body. Present tests also indicate that the ceramic fillers embedded in the plastic package body for mechanical strengthening are not helpful for the improvement of the passivation reliability. Even though the fillers can reduce the thermal-expansion of the plastic package body, microscopic examinations show that they can cause direct damage to the passivation layer. Furthermore, experimental results also illustrate that sawing-induced chipping resulting from the separation of a semiconductor wafer into individual devices might develop into passivation cracks during thermal-cycling. Thus, the proper design of the adhesion tape and the prevention of the sawing-induced chipping should be considered to enhance the passivation reliability in the semiconductor devices using the LOC die attach technique.

• International Journal of Advanced Culture Technology
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• v.9 no.1
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• pp.224-241
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• 2021

According to data from the National Police Agency, 75.5 percent of dead traffic accidents in Korea are truck accidents. About 1,000 people die in cargo truck accidents in Korea every year, and two to three people die in cargo truck accidents every day. In the survey, Korean cargo workers answer poor working conditions as an important cause of constant truck accidents. COVID 19 is increasing demand for non-face-to-face logistics. The inefficiency of the Korean transportation system is leading to excessive work burden for small logistics The inefficiency of the Korean transportation system is causing excessive work burden for small individual carriers. The inefficiency of the Korean transportation system is also evidenced by the number of deaths from logistics industry disasters that have risen sharply since 2020. Small and medium-sized Korean Enterprises located in CIPs (Connected Industrial Parks) often do not have smart access certification systems. And as a result, a lot of transportation time is wasted at the final destination stage. In the logistics industry, time is the cost and time is the revenue. The logistics industry is the representative industry in which time becomes money. The smart access authentication system architecture proposed in this paper allows small logistics private carriers to improve legal stability, and SMEs (Small and Medium-sized Enterprises) in CIPs to reduce logistics transit time. The CIPs smart access system proposed in this paper utilizes the currently active Mobile OTP (One Time Password), which can significantly reduce system design costs, significantly reduce the data capacity burden on individual cell phone terminals, and improve the response speed of individual cell phone terminals. It is also compatible with the OTP system, which was previously used in various ways, and the system reliability through the long period of use of the OTP system is also high. User customers can understand OTP access systems more easily than other smart access systems.