• Journal of the Korean Society for Precision Engineering
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• v.26 no.11
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• pp.35-40
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• 2009

This paper presents the geometrical analysis of an inclined ultra-precision grinding technology using simulations about grinding point locus for micro lens manufacturing. Simulation results show the relationship between radius ratios ($R_1/R_2$) and wheel center locus. Furthermore, the critical grinding wheel radius ($R_1$) can be calculated from work-piece radius ($R_2$) and inclined angle ($\theta=-45^{\circ}$). These achievements could be applied to calculate CNC data in ultra-precision grinding and give insight for wheel wear and compensation grinding.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.12
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• pp.66-72
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• 1997

This paper aims at reviewing the possibility application over normal or abnormal, detection used by AE and the wear characteristics of grinding process. In this study, when diamond bur in dentistry with chosen grinding conditions were tuned at grinding. The variation of grinding resistance and AE signal is detected by the use of AE measuring system. The tests are carried out in accordance with diamond burs and workpiece: arcyl and bovine. According to the experiment results, the following can be expected: AE has the possibility to detect the state normality and abnormality. Hpwever, the grinding resistance measuring can find it difficult to detect it. It can be accurately excepted from AE occurrence pattern in contact start point of diamond bur and bovine, grinding condition and derailment point. It is known that AErms is well compatible with grinding resistance. According to the increase of the material removal rate, the specific energy of the diamond bur is inclined to dectease and the grinding resistance has a tendency to increase.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.80-84
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• 1996

This paper aims at reviewing the Possibility application over normal or abnormal, detection used by AE and the wear characteristics of grinding process. In this study, when diamond bur in dentistry with chosen grinding conditions were tuned at grinding. The variation of grinding resistance and hE signal is detected by the use of AE measuring system. The tests are carried out in accordance with diamond burs and workpiece; arcyl and bovine. According to the experiment results, the following can be expected; AE has the possibility to detect the state normality and abnormality. However, the grinding resistance measuring can find it difficult to detect it. It can be accurately excerpted from AE occurrence pattern in contact start point of diamond bur and bovine, grinding condition and derailment point. It is known that AE$\_$rms/ is well compatible with grinding resistance. According to the increase of the material removal rate, the specific energy of the diamond bur is inclined to decrease and the grinding resistance has a tendency to increase.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.5
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• pp.60-67
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• 2012

In the study, the effect grinding condition on the workpiece arithmetical average roughness(Ra) to 10 steps leading to cutting each section with the spindle rotational speed 8000rpm and feed rate 150mm/min of grinding in GC(green silicon carbide) grinding processing after heat treatment and non heat treatment of SCM415 material. Also the following conclusions were obtained analysis of stress distribution displacement and finite elements method(FEM) on assemble parts with 3+2 axis simultaneous control through grinding and gave a load 11kg on ATC arm both sides gave a load of 11kg. For the centerline average roughness(Ra) in the heat and non-heat treatment work pieces, which were appeared the most favorable in the fifth section were $0.511{\mu}m$ and $0.514{\mu}m$, that were shown in the near the straight line section was the smallest deformation of curve. In addition, the bad surface roughness appeared on the path is too long by changing angle, the more inclined depth of cut, because the chip discharging is not smoothly.

• Resources Recycling
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• v.11 no.2
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• pp.28-35
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• 2002

A study on the grinding characteristics of metal components in printed circuit boards (PCBs) scrap by a swing-hammer typeimpact mill was conducted. The PCBs scrap crushed to sizes less than 3 mm were pulverized to liberate metal components by the impact mill. The effect of rotation speed of hammer on the grinding characteristics was investigated. The particle size distribution and degree of liberation of metals such as copper and solder were measured. The effect of rotation speed and particle size on the shape sorting of metal Particles from milled PCBs was investigated using an inclined vibrating Plate. At the hammer speed of 61.3 m/s about 80% of the copper particles became larger than 297 $\mu$m while 90% of solder particles was smaller than 297 $\mu$m. In the shape sorting method, the recovery location becomes shorter as the rotation speed of hammer increases. The recovery location for particles larger than 297$\mu$m was shorter than for particles sized between 149$\mu$m and 297$\mu$m. As the recovery location becomes shorter, KI value increases towards unity while $\phi_{c}$ value decreases towards unity indicating the more roundness of metal particles.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2011.04a
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• pp.493-498
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• 2011

구름접촉피로는 차륜과 레일의 반복적인 접촉으로 인하여 발생하는 표면손상현상으로 점차 증가하는 레일손상 중 하나이다. 접촉마모 및 주기적 그라인딩보다 균열의 성장속도가 더 빨라 균열진전이 시작되는 최소균열크기(minimum crack size for growth)는 레일의 파괴방지 및 유효한 유지보수전략을 수립하는데 기초자료로 활용된다. 본 연구에서는 최소균열크기를 예측하기 위하여 차륜레일의 접촉에 영향을 미치는 주요 파라미터를 변화시키면서 최소균열크기의 변화를 살펴보았다. 이를 위하여 Fletcher와 Kapoor의 "2.5D"모델을 적용한 시뮬레이션 소프트웨어를 개발하였으며, 최대접촉하중(1174MPa), 표면마찰계수(0.1, 0.2, 0.3 and 0.4), 잔류응력, 접촉에 의한 표면마모(1.0nm/cycle), 그라인딩량(0.3mm/10MGT)을 파라미터로 하여 해석을 수행하였다. 해석결과 최소균열크기는 해석조건에 따라 1.41-1.95mm로 계산되었다.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.9
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• pp.1078-1085
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• 2011

Prediction of a minimum crack size for growth, which is defined as a crack size that grows fast enough to keep ahead of its removal by contact wear and periodic grinding, is the most demanding work to prevent rail from fatigue failure and develop cost effective railway maintenance strategy In this study, we investigated the wheel load increment due to a rail defect during a train ran over it, and its effect on the minimum crack size for growth. For this purpose, we developed simulation software based on the Fletcher and Kapoor's "2.5D" model and measured wheel load increment during a train passed over a defect. A maximum contact pressure and contact patch size were calculated by 3D FEM and crack growth analyses were performed by varying two of dominant contact contributors; surface friction coefficient(0.1, 0.2, 0.3 and 0.4) and crack aspect ratio. The minimum crack sizes for growth were calculated from 0.29 to 1.44mm depending on the contact conditions. They were decreasing with increasing surface friction coefficient and decreasing with crack aspect ratio(a/b).

• Journal of the Korean Society for Precision Engineering
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• v.30 no.4
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• pp.397-402
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• 2013

In this study, we carried out the each lines of section, using GC (green silicon carbide) whetstone, the SCM415 material which separated by after and before heat treatments process, in 3+2 axis machining centers for integrated grinding after cutting end mill works, the spindle speed 8000 rpm and feed rate 150 mm/min. For the analysis of the centerline average roughness (Ra), we measured by 10 steps stages. Using Finite element analysis, we found the result of the load analysis effect of the assembly parts, when applied the 11 kg's load on both side of the ATC (Automatic tool change) arm. The result is as follows. For the centerline average roughness (Ra) in the non-heat treatment work pieces, are appeared the most favorable in the tenth section are $0.510{\mu}m$, that were shown in the near the straight line section which is the smallest deformation of curve. In addition, the bad surface roughness appears on the path is to long by changing angle, the more inclined depth of cut, because the chip discharging is not smoothly.