• 제목/요약/키워드: InGaAs/InP HBT

검색결과 63건 처리시간 0.029초

III-V 광소자 제작을 위한 ITO/n+lnP 옴 접촉 특성연구 (Formation of ITO Ohmic Contact to ITO/n+lnP for III-V Optoelectronic Devices)

  • 황용한;한교용
    • 한국전기전자재료학회논문지
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    • 제15권5호
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    • pp.449-454
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    • 2002
  • The use of a thin film of indium between the ITO and the $n^+-lnP$ contact layers for InP/InGaAs HPTs was studied without degrading its excellent optical transmittance properties. $ITO/n^+-lnP$ ohmic contact was successfully achieved by the deposition of indium and annealing. The specific contact resistance of about $6.6{\times}10^{-4}\Omega\textrm{cm}^2$ was measured by use of the transmission line method (TLM). However, as the thermal annealing was just performed to $ITO/n^+-lnP$ contact without the deposition of indium between ITO and $n^+-lnP$, it exhibited Schottky characteristics. In the applications, the DC characteristics of InP/InGaAs HPTs with ITO emitter contacts was compared with those of InP/InGaAs HBTs with the opaque emitter contacts.

RF 트랜스포머를 사용한 광대역 전력증폭기 설계 (Broadband power amplifier design utilizing RF transformer)

  • 김욱현;우제욱;전주영
    • 전기전자학회논문지
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    • 제26권3호
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    • pp.456-461
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    • 2022
  • 본 논문에서는 차동 증폭기에 필수적으로 필요한 Radio frequency(RF) transformer(TF)을 활용하여 광대역 이득 특성을 가지는 2단 단일 종단 전력증폭기를 제시하였다. RF TF의 특징을 파악하고 광대역 특성을 가지도록 설계한 뒤 2단 전력증폭기의 단간(inter-stage) 임피던스 정합 회로에 적용함으로써 증폭기의 대역폭을 향상시킬 수 있다. 기존의 2단 단일 종단(Single-ended) 증폭기의 성능과 면적을 유지하면서 광대역 이득 특성을 얻을 수 있도록 단간 정합 회로를 Monolithic Microwave Integrated Circuit (MMIC)와 다층 PCB에 구현하고 시뮬레이션을 통해 결과를 비교하였다. InGaP/GaAs HBT 모델을 사용하여 설계한 2단 전력증폭기 모듈을 시뮬레이션 한 결과 중심주파수 3.3GHz에서 기존의 전력증폭기가 11.2%의 fractional 대역폭을 보인 반면 제안된 설계 기법을 적용한 전력증폭기는 19.8%의 개선된 대역폭을 가짐을 확인하였다.

Design of a New Harmonic Noise Frequency Filtering Down-Converter in InGaP/GaAs HBT Process

  • Wang, Cong;Yoon, Jae-Ho;Kim, Nam-Young
    • Journal of electromagnetic engineering and science
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    • 제9권2호
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    • pp.98-104
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    • 2009
  • An InGaP/GaAs MMIC LC VCO designed with Harmonic Noise Frequency Filtering(HNFF) technique is presented. In this VCO, internal inductance is found to lower the phase noise, based on an analytic understanding of phase noise. This VCO directly drives the on-chip double balanced mixer to convert RF carrier to IF frequency through local oscillator. Furthermore, final power performance is improved by output amplifier. This paper presents the design for a 1.721 GHz enhanced LC VCO, high power double balance mixer, and output amplifier that have been designed to optimize low phase noise and high output power. The presented asymmetric inductance tank(AIT) VCO exhibited a phase noise of -133.96 dBc/Hz at 1 MHz offset and a tuning range from 1.46 GHz to 1.721 GHz. In measurement, on-chip down-converter shows a third-order input intercept point(IIP3) of 12.55 dBm, a third-order output intercept point(OIP3) of 21.45 dBm, an RF return loss of -31 dB, and an IF return loss of -26 dB. The RF-IF isolation is -57 dB. Also, a conversion gain is 8.9 dB through output amplifier. The total on-chip down-converter is implanted in 2.56${\times}$1.07 mm$^2$ of chip area.

On-chip Smart Functions for Efficiency Enhancement of MMIC Power Amplifiers for W-CDMA Handset Applications

  • Youn S. Noh;Kim, Ji H.;Kim, Joon H.;Kim, Song G.;Park, Chul S.
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제3권1호
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    • pp.47-54
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    • 2003
  • New efficiency enhancement techniques have been devised and implemented to InGaP/GaAs HBT MMIC power amplifiers for W-CDMA mobile terminals applications. Two different types of bias current control circuits that select the efficient quiescent currents in accordance with the required output power levels are proposed for overall power efficiency improvement. A dual chain power amplifier with single matching network composed of two different parallel-connected power amplifier is also introduced. With these efficiency enhancement techniques, the implemented MMIC power amplifiers presents power added efficiency (PAE) more than 14.8 % and adjacent channel leakage ratio(ACLR) lower than -39 dBc at 20 dBm output power and PAE more than 39.4% and ACLR lower than -33 dBc at 28 dBm output power. The average power usage efficiency of the power amplifier is improved by a factor of more than 1.415 with the bias current control circuits and even up to a factor of 3 with the dual chain power amplifier.

헤어핀 공진기 구조를 소형화한 MMIC 발진기 설계 (A Design of MMIC Oscillator with Miniaturized Hairpin Resonator Structure)

  • 최종원;문성모;박준석;이재학;이문규
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2004년도 하계학술대회 논문집 C
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    • pp.2067-2069
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    • 2004
  • 본 논문에서는 전통적인 헤어핀 공진기보다 훨씬 소형화한 헤어핀 공진기 구조를 이용하여 X 대역 MMIC 발진기를 InGaP/GaAs HBT 공정을 이용하여 제작하였다. 헤어핀 공진기의 크기는 약 1/4정도로 작게 구현이 가능하였으며, 이를 적용한 발진기의 측정결과 주파수는 8.295 GHz, 출력전력은 4.8 dBm, 위상잡음특성은 100 kHz 옵셋 주파수에서 -106.8 dBc/Hz, 1 MHz 옵셋 주파수에서 -121.7 dBc/Hz를 각각 나타내었다.

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