• Journal of the Mineralogical Society of Korea
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• v.18 no.4 s.46
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• pp.237-248
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• 2005

Results from in-situ high temperature X-ray diffraction measurements show that $Mg_{2}SiO_{4}{-}$spinel converts back to olivine phase only when heated in vacuum, and that at some high temperature, the olivine phase grows with time at the expense of the spinel phase strongly suggesting a 'nucleation and growth' type transition. In order to obtain the activation energy of spinel-olivine back transformation, kinetics measurements were performed on $Mg_{2}SiO_{4}{-}$spinel in vacuum at high temperatures between 1023 and 1116 K. Activation energy was determined using 'time to a given fraction method'. By employing the Avrami equation, it was found that n values generally increase with increasing temperature in a wide range implying that the nucleation and growth mechanism is probably temperature-dependent. It is likely that in spinel, at a relatively lower transformation temperature, after nucleation sites saturated, the growth of the new phase starts on the surface and gradually moves inwards. At high temperatures, however, after nucleation sites saturated, the growth starts both on the surface as well as at the interior.

• Journal of the Korean Vacuum Society
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• v.17 no.6
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• pp.518-522
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• 2008

The miniaturization of device size and multilevel interlayers have been developed by ULSI circuit devices. These submicron processes cause serious problems in conventional metallization due to the solubility of silicon and metal at the interface, such as an increasing contact resistance in the contact hole and interdiffusion between metal and silicon. Therefore it is necessary to implement a barrier layer between Si and metal. Thus, the size of multilevel interconnection of ULSI devices is critical metallization schemes, and it is necessary reduce the RC time delay for device speed performance. So it is tendency to study the Cu metallization for interconnect of semiconductor processes. However, at the submicron process the interaction between Si and Cu is so strong and detrimental to the electrical performance of Si even at temperatures below $200^{\circ}C$. Thus, we suggest the tungsten-carbon-nitrogen (W-C-N) thin film for Cu diffusion barrier characterized by nano scale indentation system. Nano-indentation system was proposed as an in-situ and nanometer-order local stress analysis technique.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.228-228
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• 2010

반도체 집적도의 비약적인 발전으로 각 박막 층간의 두께는 더욱 줄어들었고 이는 각 박막 층간의 확산에 대한 문제를 간과할 수 없게 하였다. 따라서 각 층간의 확산을 방지하기위한 확산방지막의 연구에 대한 관심도는 증가하게 되었다. 또한 본 연구에서 분석을 위하여 사용된 Nanoindenter는 박막 표면에 다이아몬드 팁을 이용하여 압입을 실시하여 이때 시표의 반응에 의한 팁의 위치(Z-축)를 in-situ로 측정하여 인가력과 팁의 위치에 대한 연속 압입곡선을 측정하게 된다. 이를 통하여 박막의 hardness와 elastin modulus를 측정하게 되고, 연속 압입곡선 분석을 통하여 박막의 표면응력 변화를 측정한다. 이 논문에서는 반도체의 기판으로 사용되는 Si 기판과 금속배선 물질인 Cu와의 확산을 효과적으로 방지하기 위한 W-C-N 확산방지막을 제시하였고, 시료 증착을 위하여 rf magnetron sputter를 사용하여 동일한 증착 조건에서 질소(N)의 비율을 다르게 하여 박막내 질소 비율에 따른 확산방지막을 제작하였다. 이후 시료의 열적 안정성 측정을 위하여 상온에서 $900^{\circ}C$ 까지 질소 분위기에서 30분간 열처리 과정을 실시하여 열적 손상을 인가하였고, 고온에서 확산방지막의 열적인 안정성을 Nanoindentation 분석을 이용하여 측정하였다. 측정 결과 박막내 질소 불포함된 박막의 경우 표면 강도는 9.01 GPa에서 194.01 GPa의 급격한 변화를 보였고, 질소가 포함된 박막은 9.41 GPa에서 43.01 GPa으로 상대적으로 적은 차이를 보였다. X-ray 분석 결과에서도 박막내 질소가 포함된 박막이 고온에서도 더 안정된 특성을 보이는 것을 확인하였다.

• Journal of the Korean Vacuum Society
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• v.4 no.S1
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• pp.113-117
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• 1995

MOCVD of Cu films were carried out on gold-TiN(1000$\AA$)/Ti/Si wafers from hexafluoroacetylacetonate-Cu(l) vinyltrimethylsilane, Cu(l)(hafac)(vtms), in a small cold-wall type reactor. Effects of the substrate and bubbler temperatures on the film growth rate were studied, and a film with $\rho$=1.8$\pm$0.1$\mu$$\Omega$.cm could be deposited 150nm/min at Ts=200 and Tb=$30^{\circ}C$, respectively. The initial stage of the film formation was also investigated by in-situ laser reflectivity monitoring combined with SEM observations, based on which variations in the film properties depending on the growth conditions were discussed in terms of the nucleation rate and grain size.

• Korean Journal of Materials Research
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• v.10 no.10
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• pp.703-708
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• 2000

As the engine design changes to get high efficiency and performance of commercial diesel engine, surface w wear of the earn follower becomes an important issue as applied load increasing at the contact face between cam follower and cam. We developed the ceramic cam follower made of sili$\infty$n nitride ceramic which was more wear resistant than the cast iron or sintered metal cam follower. Ceramic cam follower was made by direct brazing of thin ceramic disk to steel body using an active brazing alloy without the interlayer. In-situ crowning(R), resulted from the difference of thermal expansion coefficient between ceramic and carbon steel after direct brazing without any stress-relieving inter]ayer, could be controlled. When a earbon steel was heated above $A_{c1}$ point and then c$\infty$led, the expansion curve represented a hysteresis. Appropriate crowning was achieved below the $A_{c1}$ point(about $723^{\circ}C$) and crowning increased with brazing temperature exponentially above the $A_{c1}$ point. Optimum brazing temperature range was from 700 to $720^{\circ}C$. We developed successfully the ceramic cam follower having appropriate crowning and being inexpensive. Also we could successfully control the crowning of ceramic earn follower by hysteresis behavior of thermal expansion of earbon steel during direct brazing process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.6
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• pp.459-466
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• 2000

For the applications in the ultra-large-scale-integration (ULSI) metallization processing copper thin films have been prepared by metal organic chemical vapor deposition (MOCVD) technology on TiN/Si substrates. The films have been deposited with varying the experimental conditions of substrate temperatures and copper source vapor pressures. The films were then annealed in a vacuum condition after the deposition and the annealing effect to the electrical conductivity of the films was measured. The grain size and the crystallinity of the films were observed to be increased by the post annealing and the electrical conductivity was also increased. The best electrical property of the copper film was obtained by in-situ annealing treatment at above 40$0^{\circ}C$ for the sample prepared at 18$0^{\circ}C$ of the substrate temperature.

• Bulletin of the Korean Chemical Society
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• v.16 no.11
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• pp.1109-1112
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• 1995

Bis(silyl)alkylbenzenes such as bis(1-sila-sec-butyl)benzene (1) and 2-phenyl-1,3-disilapropane (2) were prepared in high yields by reduction of the corresponding chlorosilanes with LiAlH4. The dehydropolymerization of 1 and 2 was carried out with group 4 metallocene complexes generated in situ from Cp2MCl2/Red-Al and Cp2MCl2/n-BuLi (M=Ti, Hf), producing two phases of polymers. The TGA residue yields of the insoluble polymers were in the range of 64-74%. The molecular weights of the soluble polymers produced ranged from 700 to 5000 (Mw vs polystyrene) and from 500 to 900 (Mn vs polystyrene). The dehydropolymerization of 1 and 2 seemed to initially produce a low-molecular-weight polymer, which then underwent an extensive cross-linking reaction of backbone Si-H bonds, leading to an insoluble polymer.

• Journal of the Korean Vacuum Society
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• v.8 no.3A
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• pp.249-255
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• 1999

Deposition characteristics of Cu thin films using Ar carrier gas and $H_2$ processing gas at various working pressures and substrate temperatures were investigated. Also, effects of $H_2$ pretreatment using plasma at $200^{\circ}C$ of substrate temperature and 0.6 Torr of chamber pressure were stdied. Cu thin films were deposited on TiN/Si substrate at working pressure of 0.5~1.5 Torr, substrate temperatures of 140~$240^{\circ}C$ with (hface)Cu(tmvs). Substrates were pretreated by $H_2$ plasma, and Cu films deposited in situ using twofold shower head. The purity, electrical resistivity, thickness, surface morphology, optical properties of the deposited Cu films were measured b the AES, four point probe, stylus profiler, SEM,. and the uv-visible spectrophotometer. This study suggests that $H_2$ plasma is an effective method for enhancing deposition rate and for producing high quality copper thin films.

• Journal of Environmental Science International
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• v.11 no.6
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• pp.519-528
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• 2002

This study was to evaluate the impact of river runoff and salt intrusion by tide on nutrient balance of estuary during a complete tidal cycle. 24 hours time series survey was carried out during a spring tide July 2001 on a tidal estuary in the Keum river. Three stations(A,B,C) were set along a transect line of about 10km, which linked the lower part of estuary dyke to the subtidal zone. Surface water was sampled simultaneously at each station every hours f3r the determination of nutrients. Water temperature, pH and dissolved oxygen were measured in situ. Riverine input of silicate and nitrate during ebb tide significantly increased the concentration of all stations. Conversely, during high tide, nutrient concentration were lowered by the mixing of fresh water with sea water Ammonium nitrogen concentration were higher at intertidal zone(Stn.B) due to sewage inflow to Kyeongpo stream and ammonium release under anaerobic conditions. Also, these results was discussed as a biological component that influences the processes of nutrient regeneration within the estuary. Best correlations were found at lower part of estuary dyke(Stn.A) for salinity against DIN(Y=0.121 Sal.+4.97, r2=0.956) and silicate(Y=0.040 Sal.+2.62, r2=0.785). But no significant correlation was found between salinity and ammonium. Unbalanced elemental ratio(N/P, Si/N and Si/P) depended significantly on the import of nutrients (silicate & nitrate nitrogen) from river and stream. The effect of the tidal cycle and river runoff is important that in determining the extend of the variations in nutrient concentrations at all station.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.184-184
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• 2010

반도체 집적도의 비약적인 발전으로 각 박막 층간의 두께는 더욱 줄어들었고 이는 각 박막 층간의 확산에 대한 문제를 간과할 수 없게 하였다. 따라서 각 층간의 확산을 방지하기 위하여 두께가 수십 nm size의 확산방지막의 연구에 대한 관심도는 증가하게 되었다. 본 연구에서 분석을 위하여 사용된 Nano-indentation은 박막 표면에 다이아몬드 팁을 이용하여 압입을 실시하여 이때 시표의 반응에 의한 팁의 위치(Z-축)를 in-situ로 측정하여 인가력과 팁의 위치에 대한 연속 압입곡선을 측정하게 된다. 이를 통하여 박막의 hardness와 elastic modulus를 측정하게 되고, 연속 압입곡선 분석을 통하여 박막의 표면응력 변화를 측정한다. 이 논문에서는 반도체의 기판으로 사용되는 Si기판과 금속배선 물질인 Cu와의 확산을 효과적으로 방지하기 위한 W-C-N 확산 방지막을 제시하였고, 시료 증착을 위하여 RF-magnetron sputter를 사용하여 동일한 증착조건에서 질소(N)의 비율을 다르게 하여 박막 내 질소비율에 따른 확산방지막을 제작하였다. 이후 시료의 열적 안정성 측정을 위하여 상온, $600^{\circ}C$, $800^{\circ}C$로 각각 질소 분위기에서 30분간 열처리 과정을 실시하여 열적 손상을 인가하였다. 고온에서 확산방지막의 물리적 특성을 알아보기 위해 Nano-indentation을 이용하여 분석하였고, WET-SPM을 이용하여 표면 이미지와 거칠기를 확인하였다. 그 결과 질화물질이 내화물질에 비해 고온에서 물성변화가 적게 나타나는 것을 알 수 있었고, 균일도와 결정성 또한 질화물질에서 더 안정적이었다.