• 대한산업공학회지
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• 제36권3호
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• pp.154-163
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• 2010

Process monitoring of output variables affecting final performance have been mainly executed in semiconductor manufacturing process. However, even earlier detection of causes of output variation cannot completely prevent yield loss because a number of wafers after detecting them must be re-processed or cast away. Semiconductor manufacturers have put more attention toward monitoring process inputs to prevent yield loss by early detecting change-point of the process. In the paper, we propose the method to efficiently monitor functional input variables in multi-phase semiconductor manufacturing process. Measured input variables in the multi-phase process tend to be of functional structured form. After data pre-processing for these functional input data, change-point analysis is practiced to the pre-processed data set. If process variation occurs, key variables affecting process variation are selected using contribution plot for monitoring efficiency. To evaluate the propriety of proposed monitoring method, we used real data set in semiconductor manufacturing process. The experiment shows that the proposed method has better performance than previous output monitoring method in terms of fault detection and process monitoring.

• 반도체디스플레이기술학회지
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• 제18권1호
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• pp.5-9
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• 2019

Optical emission spectroscopy is used to identify chemical species and monitor the changes of process results during the plasma process. However, plasma process monitoring or fault detection by using emission signal variation monitoring is vulnerable to background signal fluctuations. IR heaters are used in semiconductor manufacturing chambers where high temperature uniformity and fast response are required. During the process, the IR lamp output fluctuates to maintain a stable process temperature. This IR signal fluctuation reacts as a background signal fluctuation to the spectrometer. In this research, we evaluate the effect of infrared background signal fluctuation on plasma process monitoring and improve the plasma process monitoring accuracy by using simple infrared background signal subtraction method. The effect of infrared background signal fluctuation on plasma process monitoring was evaluated on $SiO_2$ PECVD process. Comparing the $SiO_2$ film thickness and the measured emission line intensity from the by-product molecules, the effect of infrared background signal on plasma process monitoring and the necessity of background signal subtraction method were confirmed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.315-318
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• 1997

In terms of productivity, the speed of machining process has been increasing in most of engineering part. But the tapping process does not reach at enough level compared with other machining processes because of its complicate cutting mechanism. In the high speed tapping process, the one of important elements is tool monitoring system to prevent tool breakage. This paper describes tool monitoring system by acoustic emission(AE) in the tapping process. We used 2 types of AE sensors in this test. The one is commercial sensor which is used in other machining monitoring system like polishing and the other is a self-fabricated sensor for this test. In this test we purpose to find out the frequency of AE signal in tapping process and verify the possibility of applying AE sensor in in-process tapping monitoring system. Also grasp of characteristic of tapping process by AE signal is handled.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.560-565
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• 2001

Recently, machining process monitoring technique based on AE(acoustic emission) signal is used widely and becomes very important technique in machining process for improving the efficiency and the confidence of the systems. In this study, we fabricated a cheap acoustic emission sensor and monitoring system and estimated the properties of them through comparing with commercial AE sensor systems. In addition, we evaluated the performance of the fabricated sensor in polishing process. Futhermore, we are scheduled to develop the multi-point polishing process monitoring system through fabrication of the more AE sensors and complement of the monitoring system.

• Transactions on Electrical and Electronic Materials
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• 제13권2호
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• pp.78-84
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• 2012

An in-situ optical monitoring method for real-time process monitoring of electrochemical copper deposition (CED) is presented. Process variables to be controlled in achieving desired process results are numerous in the CED process, and the importance of the chemical bath conditions cannot be overemphasized for a successful process. Conventional monitoring of the chemical solution for CED relies on the pH value of the solution, electrical voltage level for the reduction of metal cations, and gravity measurement by immersing sensors into a plating bath. We propose a nonintrusive optical monitoring technique using three types of optical sensors such as chromatic sensors and UV/VIS spectroscopy sensors as potential candidates as a feasible optical monitoring method. By monitoring the color of the plating solution in the bath, we revealed that optically acquired information is strongly related to the thickness of the deposited copper on the wafers, and that the chromatic information is inversely proportional to the ratio of $Cu$ (111) and {$Cu$ (111)+$Cu$ (200)}, which can used to measure the quality of the chemical solution for electrochemical copper deposition in advanced interconnection technology.

• 한국정밀공학회지
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• 제12권5호
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• pp.25-32
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• 1995

In highly automated milling process, in-process monitoring of the malfunction is indispensable to ensure efficient cutting operation. Among many malfunctions in milling process, chatter vibration deteriorates surface finish, tool life and productivity. In this study, the monitoring system of chatter vibration for face milling process is proposed and experimentally estimated. The monitoring system employs two types of sensor such as cutting force and acceleration in sensory detection state. The RMS value and band frequency energy of the sensor signals are extracted in time domain for the input patterns of neural network to reduce time delay in signal processing state. The resultes of experimental evaluation show that the system works well over a wide range of cutting conditions.

• ETRI Journal
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• 제37권2호
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• pp.306-316
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• 2015

In today's highly competitive business environment, most companies try to manage their logistics function strategically to satisfy their orders as cost-effectively as possible and maximize their present and future profits. In this environment, logistics process visibility is essential to companies wishing to competently track components, parts, or products in transit from the original suppliers to the final destinations. Thus, it is important to provide instantly and easily recognizable information about such visibility to all stakeholders, especially customers. To ensure a high-level geographical visibility of the logistics processes, in this paper, we propose a way of implementing a GIS-based logistics process monitoring environment and of integrating a performer's work processing environment on the monitoring system. Additionally, to provide more abundant monitoring information, we describe a procedure for creating and processing various monitoring information, which are represented as ECA rules in this work processing environment. Therefore, it is possible to provide intuitive and visible monitoring information regarding the logistics process and resource elements.

• Transactions on Electrical and Electronic Materials
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• 제14권2호
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• pp.71-77
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• 2013

Advanced semiconductor manufacturing technology requires methods to maximize tool efficiency and improve product quality by reducing process variability. Real-time plasma process monitoring and diagnosis have become crucial for fault detection and classification (FDC) and advanced process control (APC). Additional sensors may increase the accuracy of detection of process anomalies, and optical monitoring methods are non-invasive. In this paper, we propose the use of a chromatic data acquisition system for real-time in-situ plasma process monitoring called the Plasma Eyes Chromatic System (PECS). The proposed system was initially tested in a six-inch research tool, and it was then further evaluated for its potential to detect process anomalies in an eight-inch production tool for etching blanket oxide films. Chromatic representation of the PECS output shows a clear correlation with small changes in process parameters, such as RF power, pressure, and gas flow. We also present how the PECS may be adapted as an in-situ plasma arc detector. The proposed system can provide useful indications of a faulty process in a timely and non-invasive manner for successful run-to-run (R2R) control and FDC.

• International Journal of Quality Innovation
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• 제1권1호
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• pp.97-105
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• 2000

In this paper, a two-section method for measuring is introduced and the variation sources of measurement process are analysed. Measuring is a special process in general process. Various variation source must be firstly decomposed so that the statistical distribution law of measuring process can be established, and then implement monitoring control of the measuring process. A special method to obtain the measuring variation is discussed, and a monitoring control technique for measuring process is studied based statistical distribution. Towards the end, we briefly introduce software design for the analysis and control of a measurement process.

• 한국생산제조학회지
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• 제5권1호
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• pp.43-50
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• 1996

From a manufacturing standpoint it would be desirable to monitor the degradation of drawing die, that is essential for the maintenance of die quality, the evaluation of product integrity and the reducing scrap. Acoustic emission is powerful method in monitoring fine wire drawing process, especially in detecting the die fracture at early stage. Experiments also suggested that acoustic emission sigals contained valuable information regarding the stage of a drawing process such as the surface appearance of products and the condition of lubrication. These informations are AE monitoring techniques a possible tool in monitoring the drawing process operation. In order to approach this, this paper discusses the nature of acoustic emission signal presented which illustrate the effects of wire and die material, lubricants, and drawing speed on the generation and the mean voltage level of acoustic emission signal. From these experimental, results, we understanded controlling factors of acoustic emission generation.