1 |
J. Moyne, H. Haji, K. Beatty, and R. Lewandowski, IEEE Trans. Semi. Manufac., 30, 408 (2007) [DOI: http://dx.doi.org/10.1109/ TSM.2007.907617].
|
2 |
S. J. Qin, G. Cherry, R. Good, J. Wang, and C. A. Harrison, J. of Process Control, 16, 171 (2006) [DOI: http://dx.doi. org/10.1016/j.jprocont.2005.06.002].
DOI
ScienceOn
|
3 |
P. Kang, H. Lee, S. Cho, D. Kim, J. Park, C. Park, and S. Doh, Expert Systems with Applications, 39, 12554 (2009) [DOI: http:// dx.doi.org/10.1016/j.eswa.2009.05.053].
DOI
ScienceOn
|
4 |
Y. Kim, K. Baek, S. Lee, S. Lee, J. Lee, Y. Jee, C. Kang, H. Cho, and J. Moon, Int. Symp. Semi. Manufac., 346 (2006) [DOI: http:// dx.doi.org/10.1109/ISSM.2006.4493103].
DOI
|
5 |
S. Dolins, A. Srivastave, and B. Flinchbaugh, IEEE Trans. Semi. Manufac., 1, 23 (1988) [DOI: http://dx.doi.org/10.1109/66.4369].
DOI
ScienceOn
|
6 |
G. May and C. Spanos, IEEE Trans. Semi. Manufac., 6, 28 (1993) [DOI: http://dx.doi.org/10.1109/66.210656].
DOI
ScienceOn
|
7 |
S. Hong and G. May, "Neural Network-based Real-time Malfunction Diagnosis of Reactive Ion Etching Using in-situ Metrology Data," IEEE Trans. Semi. Manufac., 17, 408 (2004) [DOI: http://dx.doi.org/10.1109/TSM.2004.831952].
DOI
ScienceOn
|
8 |
C. J. Kang and S. C. Park, "Semiconductor Patterning Technology for Nano Devices," Current Applied Physics, 8, 656 (2008) [DOI: http://dx.doi.org/10.1016/j.cap.2007.04.059].
DOI
ScienceOn
|
9 |
P. C. Russel, I. Khandaker, E. Glavas, D. Alston, R.V. Smith, and G.R. Jones, IEE Proc. Sci. Meas. Technol., 141, 99 (1994) [DOI: http://dx.doi.org/10.1049/ip-smt:19949850].
DOI
ScienceOn
|
10 |
M. Sato, H. Ohtake, K. Suzuki, S. Samukawa, J. Vac. Sci. & Tech. A: Vacuum, Surface, and Films, 25, 1594 (2007) [DOI: http:// dx.doi.org/10.1116/1.2796180].
DOI
ScienceOn
|