• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.918-921
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• 2002

Some investigators who have tried to achieve the highly smooth surface finish using electrochemical processes have reported that high current density produced lustrous surfaces while the opposite conditions produced a passive layer and had a tendency to produce a black surface. However, processing at a low current density may produce a non-lustrous surface but the improvement of dimensional accuracy of the surface is significant. The surface with pulse process was a bit more lustrous than with continuous current but the black passive layer still could be found at grooved surface. There are two ways to achieve highly smooth surface finish. One is brushing it with a brush the other is electrochemical machining (ECM) with high current. The former method is the most common polishing practice, but not only may the surface obtained differ from operator to operator, but precision smooth surface on micro grooves are difficult to obtain. The latter one recently has been used to produce a highly smooth surface after EDM process. However, the material removal rate in ECM with high current is relatively high. Hence the original shape of the micro grooves, which was formed by electrochemical micro-machining (EMM) process, may be destroyed. In this study, an electrochemical polishing process using pulse current is adopted as a possible alternative process when micro grooves formed by EMM process should be polished. Mirror-like micro grooves with lustrous and smooth surface can be produced electrochemically with pulse current because the voltage and current used can be lower than the case of continuous current. This study will discuss the accurate control of physical and electrical conditions so as to achieve mirror-like micro grooves with lustrous and smooth surface without destroying the original shape of micro grooves.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.326-329
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• 2002

In this paper, we investigated a feasibility of cerium oxide(CeO$_2$) films as a buffer layer of MFIS(metal ferroelectric insulator semiconductor) type capacitor. CeO$_2$ layer were Prepared by two step process of a low temperature film growth and subsequent RTA (rapid thermal annealing) treatment. By app1ying an ultra thin Ce metal seed layer and N$_2$ Plasma treatment, dielectric and interface properties were improved. It means that unwanted SiO$_2$ layer generation was successfully suppressed at the interface between He buffer layer and Si substrate. The lowest lattice mismatch of CeO$_2$ film was as low as 1.76% and average surface roughness was less than 0.7 m. The Al/CeO$_2$/Si structure shows breakdown electric field of 1.2 MV/cm, dielectric constant of more than 15.1 and interface state densities as low as 1.84${\times}$10$\^$11/ cm$\^$-1/eV$\^$-1/. After N$_2$ plasma treatment, the leakage current was reduced with about 2-order.

• 마이크로전자및패키징학회지
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• 제15권3호
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• pp.27-33
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• 2008

PDA, 핸드폰과 같은 포터블 제품의 사용이 급증함에 따른 전자 제품의 사용 환경의 변화는 제품의 솔더 조인트 신뢰성을 더욱 필요로 하게 되었다. 무전해 니켈/금 도금 표면 처리는 솔더링 특성이 우수하고, 표면처리 두께가 균일하며 패키징 공정에서 사용되는 광학설비에서 인식이 잘되기 때문에 미세피치 SMT 디바이스와 BGA 기판에 폭넓게 사용되고 있다. 그러나 무전해 니켈/금 도금 표면과 솔더 계면에서 발생되는 취성 파괴가 문제점으로 지적되고 있다. 솔더의 취성 파괴는 솔더링시 금속간 화합물과 무전해 니켈층 사이에 형성된 P-rich 영역의 갈바닉 니켈 부식에 의한 black pad 현상에 기인한다. 이론적으로 평탄한 무전해 Ni표면은 무전해 금도금 과정 중 도금액의 균일하게 순환되기 때문에 black pad 발생을 억제하는 장점을 가지고 있다. 그러나 이러한 장점에도 불구하고 무전해 Ni층의 표면형상을 어떻게 제어 할지에 대한 연구는 충분히 이루어 지지 않고 있다. 본 연구에서는 Cu 하지층의 표면 형상이 무전해 Ni층의 표면 형상에 미치는 영향에 대하여 분석하였다. 이를 위해 Cu 에칭액과 Cu에칭 처리 횟수를 변화시켜 Cu 하지층의 표면 형상을 다양하게 변화시켰다.

• Journal of Radiation Protection and Research
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• 제48권1호
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• pp.28-43
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• 2023

Background: High-fidelity meteorological data is a prerequisite for the realistic simulation of atmospheric dispersion of radioactive materials near nuclear power plants (NPPs). However, many meteorological models frequently overestimate near-surface wind speeds, failing to represent local meteorological conditions near NPPs. This study presents a new high-resolution (approximately 1 km) meteorological downscaling method for modeling short-range (< 100 km) atmospheric dispersion of accidental NPP plumes. Materials and Methods: Six considerations from literature reviews have been suggested for a new dynamic downscaling method. The dynamic downscaling method is developed based on the Weather Research and Forecasting (WRF) model version 3.6.1, applying high-resolution land-use and topography data. In addition, a new subgrid-scale topographic drag parameterization has been implemented for a realistic representation of the atmospheric surface-layer momentum transfer. Finally, a year-long simulation for the Kori and Wolsong NPPs, located in southeastern coastal areas, has been made for 2016 and evaluated against operational surface meteorological measurements and the NPPs' on-site weather stations. Results and Discussion: The new dynamic downscaling method can represent multiscale atmospheric motions from the synoptic to the boundary-layer scales and produce three-dimensional local meteorological fields near the NPPs with a 1.2 km grid resolution. Comparing the year-long simulation against the measurements showed a salient improvement in simulating near-surface wind fields by reducing the root mean square error of approximately 1 m/s. Furthermore, the improved wind field simulation led to a better agreement in the Eulerian estimate of the local atmospheric dispersion. The new subgrid-scale topographic drag parameterization was essential for improved performance, suggesting the importance of the subgrid-scale momentum interactions in the atmospheric surface layer. Conclusion: A new dynamic downscaling method has been developed to produce high-resolution local meteorological fields around the Kori and Wolsong NPPs, which can be used in short-range atmospheric dispersion modeling near the NPPs.

• 한국표면공학회지
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• 제53권4호
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• pp.144-152
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• 2020

In the manufacturing process of joining of aluminum alloy and polymer, the strength of the metal-polymer joining is greatly influenced by the nanostructure of the oxide film. In this study, we investigated the dependence of joining strength on the thickness, structure, pore formation and surface roughness of the formed film. After the two-step anodization process, the surface oxide layer became thinner and rougher resulting in higher joining strength with the polymer. More specifically, after the two-step anodization, the surface roughness, Ra increased from 2.3 to 3.2 ㎛ with pore of three-dimensional (3D) nanostructure, and the thickness of the oxide film was thinned from 350 to 250 nm. Accordingly, the joining strength of the aluminum alloy with polymer increased from 23 to 30 MPa.

• Transactions on Electrical and Electronic Materials
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• 제15권4호
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• pp.217-220
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• 2014

We studied the plating properties of Sn-Pb solder according to the shape of the Cu wire's cross-section for photovoltaic ribbon. The thickness of the Sn-Pb layer largely decreased to 29% on a curved Cu surface, compared to a flat Cu surface. This phenomenon is caused by the geometrical decrease in the contact angle of the liquid Sn-Pb solder and an increase in the surface energy of the solid/vapor on the curved Cu surface. We suggest a new ribbon's design where the Cu wire's cross-section is a semi-ellipse. These semi-ellipse ribbons can decrease the use of Sn-Pb solder to 64% and increase the photovoltaic efficiency, by reducing the contact area between the ribbon and cell, to 84%. We also see an improvement of reflectivity in the curved surface.

• 한국기계가공학회지
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• 제20권5호
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• pp.55-60
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• 2021

We applied an artificial neural network (ANN) and evaluated surface roughness prediction in lateral milling using an endmill. The selected workpiece was AL6061-T4 to obtain data of surface roughness measurement based on the spindle speed, feed, and depth of cut. The Bayesian optimization algorithm was applied to the number of nodes and the learning rate of each hidden layer to optimize the neural network. Experimental results show that the neural network applied to optimize using the Expected Improvement(EI) algorithm showed the best performance. Additionally, the predicted values do not exactly match during the neural network evaluation; however, the predicted tendency does march. Moreover, it is found that the neural network can be used to predict the surface roughness in the milling of aluminum alloy.

• 열처리공학회지
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• 제16권4호
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• pp.191-196
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• 2003

For improvement of the wear performance of Ti alloy, vacuum-carburizing technique was tried for the first time using propane atmosphere. During the low pressure carburizing carbide was formed at the surface and carbon transfer was occurred from the carbide to the matrix. It was found that: (i) surface hardness increased with the reduction of operating pressure and time; (ii) optimum hardness distribution could be obtained with the proper choice of temperature and carbon flux control; and, (iii) case depth was largely influenced not by time but by temperature. The two steps process was recommended for obtaining thick case depth and high surface hardness of Ti alloy. For the low oxygen partial pressure, it was necessary to introduce additional CO gas to the atmosphere.Grain boundary oxidation and non-uniformity could be prevented.

• 한국재료학회지
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• 제27권11호
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• pp.617-623
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• 2017

Mesoporous carbon nanofibers as electrode material for electrical double-layer capacitors(EDLCs) are fabricated using the electrospinning method and carbonization. Their morphologies, structures, chemical bonding states, porous structure, and electrochemical performance are investigated. The optimized mesoporous carbon nanofiber has a high sepecific surface area of $667m^2\;g^{-1}$, high average pore size of 6.3 nm, and high mesopore volume fraction of 80 %, as well as a unifom network structure consiting of a 1-D nanofiber stucture. The optimized mesoporous carbon nanofiber shows outstanding electrochemical performance with high specific capacitance of $87F\;g^{-1}$ at a current density of $0.1A\;g^{-1}$, high-rate performance ($72F\;g^{-1}$ at a current density of $20.0A\;g^{-1}$), and good cycling stability ($92F\;g^{-1}$ after 100 cycles). The improvement of the electrochemical performance via the combined effects of high specific surface area are due to the high mesopore volume fraction of the carbon nanofibers.

• 한국표면공학회지
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• 제32권6호
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• pp.709-716
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• 1999

Ceramic is select for an alternative substrate material for high-speed circuits due to its low-thermal expansion. As, in this study, ceramic was prepared by ISG (interlayer sol-gel) process using metal salts and a metal alkoxide as the starting materials. Generally ceramic substrate is used electroless copper plating for the metallization. But it has been indicate weakely the adhesion strength between the substrate and copper layer. Therefore, this research, using the ISG process on the preparation of homogeneous and possible preparation at law temperature fabricated sol solution. Using of the dip coating method was coated for the purpose of giving the anchoring effect on the coating layer and enhancing the adhesion strength between the $Al_2$O$_3$ substrate and copper layer. This study examined primary the characteristic of the sol making condition and differential thermal analysis (DTA) X-ray diffraction (XRD) were mearsured to identify the crystal phase of heat treatment specimens. The morphology of the coated films were studied by scanning electron microscopy(SEM). As a resurt, XRD analysis was obtained patterns of $\alpha$-cordierite after heat-treatment about 2 hours at $1000^{\circ}C$. SEM analysis could have seen a large number of voids on coated film. The more contants of$ Al_2$$O_3$ Wt% was increased the more voids was advanced. Peel adhesion strength has a maximum in the contants of the TEOS:ANE of 1:0.7 mole%. In this case, adhesion strength has been measured 1150gf, peel adhesion strength were about 10 times more than uncoated of the ceramics film.