• Journal of Integrative Natural Science
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• v.10 no.4
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• pp.249-257
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• 2017

The main focus when developing software is to improve the reliability and stability of a software system. We are enjoying a very comfortable life thanks to modern civilization, however, comfort is not guaranteed to us. Once software systems are introduced, the software systems used in the field environments are the same as or close to those used in the development-testing environment; however, the systems may be used in many different locations. Development of software system is a difficult and complex process. Generally, existing software reliability models are applied to software testing data and then used to make predictions on the software failures and reliability in the field. In this paper, we present an improved exponential NHPP software reliability model in different development environments, and examine the goodness-of-fit of improved exponential model and other model based on two datasets. The results show that the proposed model fits significantly better than other NHPP software reliability model.

• Transactions on Electrical and Electronic Materials
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• v.5 no.4
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• pp.138-142
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• 2004

This paper presents the improved bum-in method for the reliability of SRAM in Multi Chip Package (MCP). Semiconductor reliability is commonly improved through the bum-in process. Reliability problem is more significant in MCP that includes over two chips in a package, because the failure of one chip (SRAM) has a large influence on the yield and quality of the other chips - Flash Memory, DRAM, etc. Therefore, the quality of SRAM must be guaranteed. To improve the quality of SRAM, we applied the improved wafer level bum-in process using multi cells selection method in addition to the previously used methods. That method is effective in detecting special failure. Finally, with the composition of some kind of methods, we could achieve the high quality of SRAM in Multi Chip Package.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.53-56
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• 2004

This paper presents the improved burn-in method for the reliability of SRAM in MCP Semiconductor reliability is commonly improved through the burn-in process. Reliability problem is more significant in the Multi Chip Package, because of including over two devices in a package. In the SRAM-based Multi Chip Package, the failure of SRAM has a large effect on the yield and quality of the other chips - Flash Memory, DRAM, etc. So, the quality of SRAM must be guaranteed. To improve the quality of SRAM, we applied the improved wafer level burn-in process using multi cell selection method in addition to the current used methods. That method is effective in detecting special failure. Finally, with the composition of some kinds of methods, we could achieve the high qualify of SRAM in Multi Chip Package.

• Fibers and Polymers
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• v.6 no.4
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• pp.336-338
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• 2005

This paper investigates the influence of raw material and process parameters in spinning that affect the inter fiber cohesion in yams. An instrument has been developed for measuring the minimum twist of cohesion. With regard to the raw material parameters, the influence of different cotton fiber mixings for a given count of yarn is investigated. Also the effect of spinning to varying counts for a given cotton variety is studied. With regard to the process parameters, studies have been carried out to investigate the influence of noil extraction in comber, number of draw frame passages, draft pressure in ring frame and direction of twist. Cohesion improved with increase in the noil extraction percentage in the comber. Increase in the number of draw frame passages also improved the cohesion. Draft pressure in ring frame improved the fiber cohesion in yarn up to a pressure of $2.1kg/cm^2$. Direction of twist had no effect on the cohesion.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.6
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• pp.506-509
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• 2005

This paper presents the improved burn-in method for the reliability of SRAM in Multi Chip Package (MCP). Semiconductor reliability is commonly improved by the burn-in process. Reliability Problem is very significant in the MCP which includes over two chips in a package because the failure of one SRAM chip has a large influence on the yield and quality of the other chips such as Flash Memory, DRAM, etc. Therefore the quality of SRAM must be guaranteed. To improve the qualify of SRAM, we applied the improved wafer level burn-in process using multi cell selection method in addition to the previously used methods and it is found to be effective in detecting particular failures. Finally, with the composition of some kinds of methods, we achieved the high quality of SRAM in MCP.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.560-564
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• 1996

In recently, annealing process of cold rolled sheet tend to change to continuous annealing process for improving qualify, saving yield. In the meantime as demand for various kind and small lot of products has been increasing, batch annealing has been appreciated for its small restriction for the operation. So, we tested on the effect for a hydrogen contents of atmospheric gas at annealing furnace. As a result of several investigation. We confirmed for the following characteristics ; improved productivity, uniform heating, improved surface quality, saving energy. Therefore, the use of hydrogen instead of nitrogen as the protective gas, combined with high convection in batch annealing furnaces, has shown that considerable increases in furnace output and material quality are attainable. Owing to the low density, high diffusion and reducing character of hydrogen, a better transfer resulting in uniform material temperatures and improved coil surfaces can be achieved.

• Food Science of Animal Resources
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• v.18 no.3
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• pp.216-223
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• 1998

This study was conducted to investigate the effects of the tenderness for the vacuum chilled, the air-frozen or the rechilled Holstein beef loin. The vacuum packaged beef was stored at 1$^{\circ}C$ and the air-packaged beef was stored at -20$^{\circ}C$ for 60 days. The rechilled beef was restored for 3 days at 1$^{\circ}C$ by using the vacuum chilled or the air-frozen beef. Hardness and chewiness of the vacuum chilled beef were better than those of the air-frozen beef. Hardness and chewiness were improved significantly(p＜0.05) after the 40 days storage for the vacuum chilled beef, but there was no significant improvement for the air-frozen beef during the 60 days storage. By the rechilling process, tenderness and myofibrillar fragmentation index of the vacuum chilled and air-frozen beef improved. Especially those were improved significantly(p＜0.05) in the vacuum chilled beef after the 20 days storage, and in the air-frozen beef after the 40 and 60 days storage.

• Journal of the Semiconductor & Display Technology
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• v.16 no.2
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• pp.75-78
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• 2017

We reports improved monitoring performance of Self plasma-optical emission spectroscopy (SP-OES) by augmenting a by-pass tube to a conventional straight (or single) tube type self plasma reactor. SP-OES has been used as a tool for the monitoring of plasma chemistry indirectly in plasma process system. The benefits of SP-OES are low cost and easy installation, but some semiconductor industries who adopted commercialized SP-OES product experiencing less sensitivity and slow sensor response. OH out-gas chemistry monitoring was performed to have a direct comparison of a conventional single type tube and a by-pass type tube, and fluid dynamic simulation on the improved hardware design was also followed. It is observed faster pumping out of OH from the chamber in the by-pass type SP-OES.

• Journal of Korean Society for Quality Management
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• v.28 no.3
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• pp.91-103
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• 2000

It is very important to rationally allocate manufacturing processes because customer's needs are being various, and product life cycle in the market Is being shortened. The process allocation is needed before making process control plan and is mostly being done by the field experience or intuition of machine operator, process engineer and/or maintenance technician. Therefore, a modified allocation method using the process variation is proposed. This paper presents the result of comparative studies between current method and the proposed one.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.15 no.26
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• pp.137-150
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• 1992

As a part of quality control activities for developing competitive products, the significant method of process quality assurance for solving initial production quality problems is just quality control process chart(QC process chart). However, the QC process chart which is used for domestic enterprises at present had obscured in basement and not itemized by industry and formally used. So. in this study, the improved QC process charts which classified by industry we suggested so that each enterprise may utilize them according to the each enterprise characteristics.