• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.65-65
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• 2007

Microstructure and surface roughness of the sensing materials should be improved to use them in advanced sensor applications because the uneven surface roughness degrades the light reflection, pattern resolution, and devices performance. Chemical mechanical polishing (CMP) processing was selected for improving the surface roughness of $CeO_2$ which is one of the well known materials for the oxygen gas sensors. Surface roughness and removal rate of spin coated $CeO_2$ thin films were examined with a change of CMP process parameters such as down force and table speed. The optimized process condition, reflected by the surface roughness with the hillock-free surface as well as the excellent removal rate with the good uniformity, was obtained. The effects of the improved surface roughness on the sensing property of $CeO_2$ thin films were also confirmed. The improved sensitivity of $CeO_2$ thin films for oxygen sensors were obtained after CMP process by the improved surface characteristics. Therefore, we conclude that sensing property of $CeO_2$ thin film is strongly dependent on the surface roughness of $CeO_2$ thin films by using CMP process.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.6
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• pp.153-159
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• 2004

In this study, a new process to pattern directly on a thin metal layer using improved nano replication printing (nRP) process is suggested to evaluate the possibilities of fabricating a stamp for nano-imprinting. In the nRP process, any figure can be replicated from a bitmap figure file in the range of several micrometers with nano-scaled details. In the process, liquid-state resins are polymerized by two-photon absorption which is induced by femto-second laser. A thin gold layer was sputtered on a glass plate and then, designed patterns or figures were developed on the gold layer by newly developed top-down building approach. Generally, stamps fur nano-imprinting have been fabricated by using the costly electron-beam lithography process combined with a reactive ion-etching process. Through this study, the effectiveness of the improved nRP process is evaluated to make a stamp with the resolution of around 200nm with reduced cost.

• Journal of ILASS-Korea
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• v.6 no.1
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• pp.35-43
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• 2001

Previous studies on image processing techniques for panicle size measurement usually have focused on a single panicle or weakly overlapped particles. In the present work, the image processing algorithm for particle size measurement has been improved to process heavily-overlapped spherical-particle images. The algorithm consists of two steps; detection of boundaries which separate the images of the overlapped panicles from the background and the panicle identification process. For the first step, Sobel operator (using gray-level gradient) and the thinning process was adopted, and compared with the gray-level thresholding method that has been widely adopted. In the second, Hough transform was used. Hough transform is the detection algorithm of parametric curves such as straight lines or circles which can be described by several parameters. To reduce the measurement error, the process of finding the true center was added. The improved algorithm was tested by processing an image frame which contains heavily overlapped spherical panicles. The results showed that both the performances of detecting the overlapped images and separating the panicle from them were improved.

• 연구논문집
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• s.26
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• pp.121-132
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• 1996

The carburising surface modification treatment of the die steel has been used for improving wear resistance and heat cycle strength of the die and preventing a pitting on the surface because the carbides are forming in the matrix during carburising. Generally, the hot forging die was used after quenching-tempering treatment or nitriding after quenching-tempering treatment. The nitriding after carburising on the surface of a hot die steel and a wear resistance die steels was suggested by SOUCHARD, JACQUOT. and BUVRON. This surface modification treatment improved the adhesive and abrasive wear resistance and friction coefficient. The process was introduced to the forging die of stainless steel, titanium alloy steel, alloy and medium carbon steel and the physical properties of the die after the treatment were improved. The surface hardening treatment of the nitriding, the carburising, the boriding, and TD process were used to improved the life time of the forging die. Also, the coating process of PVD, CVD and PCVD were used and the hard chromium plating was occasionally used. Therefore, this study analyzed the effects of the carburising time and the conditions of nitriding on STD61 steel. The case depth, the surface hardness, the forming carbide size and shape during overcarburising process on the die steel were also examined.

• Solar Energy
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• v.19 no.4
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• pp.33-43
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• 1999

The study on ice thermal storage system is to improve total system performance and increase the economical efficiency in actual all-conditioning facilities. To obtain the high charging and discharging efficiencies in ice thermal storage system, the improvement of thermal stratification is essential, therefore the process flow must be piston flow in the cylindrical type. With the relation of the aspect ratio(H/D) in the storage tank, the stratification is formed better as inlet flow rate is smaller. If the inlet and the outlet port are settled at the upside and downside of the storage tank, higher storage rate could be obtainable. In case that the flow directions inside the thermal storage tank are the upward flow in charging and the downward in discharging, thermal stratification is improved because the thermocline thickness is maitained thin and the degree of stratification increases respectively. In the charging process, in case of inlet flow rate the thermal stratification has a tendency to be improved with the lower flow rate and smaller temperature gradient in case of inlet temperature, the large temperature difference between inflowing water and storage water are influenced from the thermal conduction. The effect of the reference temperature difference is seen differently in comparison with the former study for chilled and hot water. In the discharging process, the thermal stratification is improved by the effect of the thermal stratification of the charging process.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.34 no.2
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• pp.119-124
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• 2001

In Conventional process, sugaring and seasoning step were combined during seasoning process of Changran-Jeotgal. While, in the case of Improved process, sugaring and seasoning step were separated and agitation was employed in order to control moisture content and improve taste. The addition of $20\%$ of corn syrup and agitation with 10 rpm for 4 hours at $20^{\circ}C$ were carried out to optimize the seasoning process in Changran-Jeotgal. From above results, quality estimation of Changran-Jeotgal manufacturing process, such as chemical and microbiological changes, there were little difference for salinity, pH, VBN value, crude fat and crude protein between Improved process and Conventional one, However water activity of Changran-Jeotgal produced by the Improved process was lower with 0.82 than that of Conventional one with 0.90. And the sensory evaluation showed that Improved process produced more favorable products; By regional groups, Seoul residents favored them more than Busan ones and by age, teen-aged like them best.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.1
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• pp.54-61
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• 2011

Ball screw systems are largely used in industry for motion control and motor applications. But the problem of noise, which really perplexes us, is highly correlated with the quality in ball screw systems all the way. In this paper, machining process parameters were evaluated in respects of technique, business, produce and quality to verify which impact influences the noise most. In order to adjust and compare, two comparison groups were set with the present parameters bench mark. Different ball screws were produced as specimens for the noise tests. Through comparing the noise performance of different parameters in the machining process respectively, a group of optimized machining process parameters were obtained. Another noise test was proceeded to know how noise performance was improved by optimizing the machining process parameters. At last, surface roughness tests have been done to know how surface roughness improved by optimization. The improvement of surface roughness is the main factor influences the noise performances.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.2160-2163
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• 2005

Solid freeform fabrication (SFF) technology plays a major role in industry and represents a reasonable percentage of industrial rapid prototyping/tooling/manufacturing (RP/RT/RM) development applications. However, SFF technology still has long way to progress to achieve satisfactory process speed, surface finish and overall quality improvement of its application. Today, three dimensional printing (3DP) technique that is one of SFF technology is receiving many interests, and is applied by various fields. It can fabricate three dimensional objects of solid freeform with high speed and low cost using ink jet printing technology. However, need long curing time after manufacture completion. And it must do post-processing process necessarily to heighten strength of objects because strength of fabricated objects is very weak. Therefore, in this study, we proposed an improved 3DP process that can solve problems of conventional 3DP process. The general 3DP process is method to spout binder simply through printer head on powder, but proposed process is method to cure jetted UV resin by UV lamp after jet UV resin using printhead on powder. The hardening of resin is achieved strongly at early time by UV lamp in proposed method. So, the proposed process can fabricate three dimensional objects with high speed without any post-processing.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.5
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• pp.54-59
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• 2012

This study dealt with effect of the grinding in SCM420H planetary gears. The hardness, tooth profile, lead and roughness of the gear surface can be improved by grinding process. Therein, the grinding techniques are widely used especially as one of the physical surface improvement methods. As the results, the gear grinding process reduced vibration and noise, and increased the life of the gear. And the gear grinding improved the surface of gear tooth in a short time and low cost, thus, it is a very important process in manufacturing industry. But nowadays, it is hard to find the detail information of gear grinding process. The test piece is a planetary gear which is used in the industrial machine. The manufacture process of the test piece contains hobbing, shaving, carburizing and grinding. This study investigated the effect of the grinding process to the physiognomy and the fatigue strength of test piece which was made by SCM420H.

• The Magazine of the IEIE
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• v.37 no.8
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• pp.50-59
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• 2010

$0.18-{\mu}m$ high voltage technology 13.5V high voltage well-based symmetric EDMOS isolated by MTI was designed and fabricated. Using calibrated process and device model parameters, the characteristics of the symmetric and asymmetric EDMOS have been simulated. The asymmetric EDMOS has higher performance, better $R_{sp}$ / BVDSS figure-of-merit, short-channel immunity and smaller pitch size than the symmetric EDMOS. The asymmetric EDMOST is a good candidate for low-power and smaller source driver chips. The low voltage logic well-based EDMOS process has advantages over high voltage well-based EDMOS in process cost by eliminating the process steps of high-voltage well/drift implant, high-temperature long-time thermal steps, etc. The specific on-resistance of our well-designed logic well-based EDMOSTs is compatible with the smallest one published. TCAD simulation and measurement results show that the improved logic well-based nEDMOS has better electrical characteristics than those of the conventional one. The improved EDMOS proposed in this paper is an excellent candidate to be integrated with low voltage logic devices for high-performance low-power low-cost chips.