• 한국전기전자재료학회논문지
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• 제35권2호
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• pp.190-193
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• 2022

In this work, the effect of sputtering working pressure for the tellurium film and its thin-film transistor was investigated. The transfer characteristics of tellurium thin-film transistors were improved by increasing the working pressure during sputtering process. As increasing working pressure, physical and optical properties of Te films such as crystallinity, transmittance, and surface roughness were improved. Therefore, the improved transfer characteristics of Te thin-film transistors may originate from both improved interface properties between the silicon oxide gate dielectric layer and the tellurium active layer with an improved quality of Te film. In conclusion, the control of working pressure during sputtering would be important for obtaining high-performance tellurium-based thin film transistor

• Journal of the Korean Wood Science and Technology
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• 제48권1호
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• pp.86-94
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• 2020

This study serves as basic research for the development of a new wood-based building finishing material that improved the weakness of inorganic materials such as gypsum board and magnesium board widely used as interior finishing materials and brought out the strength of the wood. The results of evaluating the physical and mechanical properties and the environmental effect related to hazardous substance discharge having manufactured a wood-magnesium laminated composite are as follows. The thermal conductivity and thermal resistance of WML board was improved by about 28~109 percent over magnesium board due to the low thermal conductivity of wood. The adhesive strength of WML board showed a similar result to that of plywood as it exceeds 0.7N/㎟, the adhesive standard of wood veneer which is presented by KS F 3101. Bending strength and screw holding strength were more improved by manufacturing WML board than magnesium board. The WML board manufactured in this study satisfied the criteria for emissions of hazardous substances prescribed in the Indoor Air Quality Control Act, and confirmed the possibility of development as a new wood-based composite material that can replace existing inorganic materials.

• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• 한국습지학회지
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• 제26권2호
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• pp.139-146
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• 2024

노후된 관거 및 지하구조물의 균열 보수에 아스팔트계 주입재, 우레탄계 주입재, 시멘트계 주입재, 아크릴계 주입재 등 다양한 주입재가 사용되고 있다. 친환경적이고 습윤상태에서 경화가 잘되고 온도변화에 안정적인 물성을 갖는 아크릴계 누수 보수재에 대하여 연구하였다. 개량된 아크릴 누수 보수재와 기존 아크릴레이트 주입재의 성능 비교를 위하여 KS 규격의 실험방법에 준용하여 수중침지 길이변화율 시험, 수중 유실 저항성 시험, 내화학 성능시험을 실시하였다. 비교 실험해 본 결과 개량된 아크릴 누수 보수재는 기존 아크릴레이트 주입재보다 습윤상태, 온도변화, 화학적 반응에 따른 수축변화가 없었고 수중 저항성 실험에서 유실되지 않았다. 또한, 개량된 아크릴 누수 보수재의 환경적 영향성을 알아보기 위해 어류급성독성 실험과 급성경구독성 실험을 진행하여 관찰해 본 결과 실험체의 사망률이 없었고 특별한 유의점이 발견되지 않았다. 본 연구의 실험결과 개량된 아크릴 누수 보수재가 성능적으로 우수하고 환경적으로 안전하고 인체에 무해하다고 판단되었다. 본 연구의 다양한 실험결과 기존의 아크릴레이트 보수재보다 개량된 아크릴 누수 보수재가 관거 및 지하구조물 균열 부위의 보수재로 사용되기 적합하다고 사료된다. 본 연구는 아크릴 누수 보수재에 대한 적용성 평가에 대한 연구로 향후 기술 개발에 활용자료로 제안하고자 한다.

• 대한건축학회연합논문집
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• 제20권6호
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• pp.55-61
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• 2018

This study improved the water repair materials of the polyacrylic system applied to concrete structures by controlling expansion, strengthening water resistance, and improving cohesiveness. The improved polyacrylate repair materials were evaluated against the existing products to verify their performance and level of improvement, and applied on-site to the concrete structures that are leaking the improved water. The verification method measured the presence of water leaks and the moisture content of concrete inside. Moisture levels were measured for two months before and after material installation, and at least 0.8 - 1.7% of humidity was reduced after installing polyacrylic resin, and no leakage was found.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.930-930
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• 2006

• 한국재료학회:학술대회논문집
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• 한국재료학회 1994년도 춘계 학술발표 강연 및 논문 개요집
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• pp.135-135
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• 1994

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1119-1121
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• 2006

Using a chemical radical we modified the surface property of PET substrates. The chemically treated substrate surface improved dispersion of CNTs on substrate and provides suitable adhesion of CNTs to substrate. In addition, an ink-jet printed patterning technique effectively improved the transparency of transparent conductive CNT composite films.

• 한국세라믹학회지
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• 제40권10호
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• pp.1021-1026
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• 2003

탄소재의 수지함침은 탄소재 표면 상태에 영향을 받는다. Coupling처리에 의한 탄소재 표면처리는 수지와의 호환성과 젖음성을 개선시켜 함침효율과 물성을 향상시킨다. 본 연구에서는 표면개질을 위해 탄소재를 실란 coupling 처리하였다. FT-IR 관찰결과 실라놀은 탄소재 표면에 단층으로 코팅되었음을 확인하였다. 탄소재의 coupling 처리는 함침효율을 향상시켜 기공율, 기계적 강도, 밀도, 마찰거동이 개선되었다.

• Nuclear Engineering and Technology
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• 제30권3호
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• pp.202-211
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• 1998

Interfacial stresses at two-material interfaces and initial displacement field over the entire domain are obtained by modifying the potential energy functional with a penalty function, which enforces continuity of the stresses at the interface of two materials. Based on the initial displacement field and interfacial stresses, a new methodology to generate a continuous stress field over the entire domain has been proposed by combining the modified projection method of stress-smoothing and Loubignac's iterative method of improving the displacement field. Stress analysis is carried out on two examples made of dissimilar materials : one is a two-material cantilever composed of highly dissimilar materials and the other is a zirconium-lined cladding tube made of slightly dissimilar materials. Results of the analysis show that the proposed method provides an improved continuous stress field over the entire domain, and accurately predicts the nodal stresses at the interface, while the conventional displacement-based finite element method produces significant stress discontinuities at the interface. In addition, the total strain energy evaluated from the improved continuous stress field converges to the exact value in a few iterations.